USB Interface IC USB to Basic Serial UART IC QFN-16
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP20,.4 |
| 针数 | 20 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 其他特性 | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO |
| 最大时钟频率 (fCLK) | 10 MHz |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e3 |
| 长度 | 12.8 mm |
| 内存密度 | 2097152 bit |
| 内存集成电路类型 | CONFIGURATION MEMORY |
| 内存宽度 | 1 |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 字数 | 2097152 words |
| 字数代码 | 2000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 2MX1 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP20,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 最大待机电流 | 0.00015 A |
| 最大压摆率 | 0.01 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 7.5 mm |
| Base Number Matches | 1 |
| AT17LV002-10SU | AT17LV256-10PU | AT17LV002A-10JU | AT17LV010A-10PU | AT17LV512A-10JU | AT17LV002-10TQU | AT17LV256-10SU | AT17LV256-10NU | |
|---|---|---|---|---|---|---|---|---|
| 描述 | USB Interface IC USB to Basic Serial UART IC QFN-16 | Precision Amplifiers High Precision Oper Amplifier | Tantalum Capacitors - Solid SMD 10uF 50volt 10% D Case Molded | FPGA - Configuration Memory 1M-BIT CONFIG EEPROM ALTERA PINOUT-1M-BIT | Analog Switch ICs IC 1 Ohm 16V Dual SPDT CMOS | FPGA - Configuration Memory 2M 3.3V 10MHz | FPGA - Configuration Memory 256KB EEPROM 8 PIN LAP 10MHZ | FPGA - Configuration Memory 256KB EEPROM 8 PIN LAP 10MHZ |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| 零件包装代码 | SOIC | DIP | LPCC | DIP | LPCC | QFP | SOIC | SOIC |
| 包装说明 | SOP, SOP20,.4 | DIP, DIP8,.3 | QCCJ, LDCC20,.4SQ | DIP, DIP8,.3 | QCCJ, LDCC20,.4SQ | TQFP, TQFP44,.47SQ,32 | SOP, SOP20,.4 | SOP, SOP8,.25 |
| 针数 | 20 | 8 | 20 | 8 | 20 | 44 | 20 | 8 |
| Reach Compliance Code | compliant | unknown | unknown | unknown | unknown | unknown | compliant | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | ALSO OPERATES AT 5V SUPPLY | ALSO OPERATES AT 5V SUPPLY | ALSO OPERATES AT 5V SUPPLY | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO |
| 最大时钟频率 (fCLK) | 10 MHz | 10 MHz | 15 MHz | 15 MHz | 15 MHz | 10 MHz | 10 MHz | 10 MHz |
| JESD-30 代码 | R-PDSO-G20 | R-PDIP-T8 | S-PQCC-J20 | R-PDIP-T8 | S-PQCC-J20 | S-PQFP-G44 | R-PDSO-G20 | R-PDSO-G8 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 12.8 mm | 9.271 mm | 8.9662 mm | 9.271 mm | 8.9662 mm | 10 mm | 12.8 mm | 4.925 mm |
| 内存密度 | 2097152 bit | 262144 bit | 2097152 bit | 1048576 bit | 524288 bit | 2097152 bit | 262144 bit | 262144 bit |
| 内存集成电路类型 | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 湿度敏感等级 | 1 | 1 | 2 | 1 | 2 | 3 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 8 | 20 | 8 | 20 | 44 | 20 | 8 |
| 字数 | 2097152 words | 262144 words | 2097152 words | 1048576 words | 524288 words | 2097152 words | 262144 words | 262144 words |
| 字数代码 | 2000000 | 256000 | 2000000 | 1000000 | 512000 | 2000000 | 256000 | 256000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 2MX1 | 256KX1 | 2MX1 | 1MX1 | 512KX1 | 2MX1 | 256KX1 | 256KX1 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | DIP | QCCJ | DIP | QCCJ | TQFP | SOP | SOP |
| 封装等效代码 | SOP20,.4 | DIP8,.3 | LDCC20,.4SQ | DIP8,.3 | LDCC20,.4SQ | TQFP44,.47SQ,32 | SOP20,.4 | SOP8,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | FLATPACK, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | 260 | NOT SPECIFIED | 245 | NOT SPECIFIED | 245 | 260 | 260 | 260 |
| 电源 | 3.3/5 V | 3.3 V | 3.3 V | 3.3/5 V | 3.3 V | 3.3/5 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.65 mm | 5.334 mm | 4.572 mm | 5.334 mm | 4.572 mm | 1.2 mm | 2.65 mm | 1.75 mm |
| 最大压摆率 | 0.01 mA | 0.005 mA | 0.005 mA | 0.01 mA | 0.005 mA | 0.01 mA | 0.005 mA | 0.005 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | NO | YES | NO | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) - annealed | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) - annealed | Matte Tin (Sn) |
| 端子形式 | GULL WING | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 0.8 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD | DUAL | QUAD | QUAD | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | NOT SPECIFIED | 40 | NOT SPECIFIED | 40 | 40 | 40 | 40 |
| 宽度 | 7.5 mm | 7.62 mm | 8.9662 mm | 7.62 mm | 8.9662 mm | 10 mm | 7.5 mm | 3.9 mm |
| Is Samacsys | N | N | - | - | N | N | - | N |
| 最大待机电流 | 0.00015 A | 0.0001 A | 0.0001 A | - | - | 0.00015 A | 0.0001 A | 0.0001 A |
| Base Number Matches | 1 | 1 | - | - | 1 | 1 | - | 1 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
