FPGA - Configuration Memory 256KB EEPROM 8 PIN LAP 10MHZ
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Atmel (Microchip) |
零件包装代码 | SOIC |
包装说明 | SOP, SOP20,.4 |
针数 | 20 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
Factory Lead Time | 1 week |
最长访问时间 | 80 ns |
其他特性 | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO |
最大时钟频率 (fCLK) | 10 MHz |
JESD-30 代码 | R-PDSO-G20 |
JESD-609代码 | e3 |
长度 | 12.8 mm |
内存密度 | 262144 bit |
内存集成电路类型 | CONFIGURATION MEMORY |
内存宽度 | 1 |
湿度敏感等级 | 1 |
功能数量 | 1 |
端子数量 | 20 |
字数 | 262144 words |
字数代码 | 256000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 256KX1 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP20,.4 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | SERIAL |
峰值回流温度(摄氏度) | 260 |
电源 | 3.3 V |
认证状态 | Not Qualified |
座面最大高度 | 2.65 mm |
最大待机电流 | 0.0001 A |
最大压摆率 | 0.005 mA |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) - annealed |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 7.5 mm |
AT17LV256-10SU | AT17LV256-10PU | AT17LV002A-10JU | AT17LV010A-10PU | AT17LV512A-10JU | AT17LV002-10TQU | AT17LV002-10SU | AT17LV256-10NU | |
---|---|---|---|---|---|---|---|---|
描述 | FPGA - Configuration Memory 256KB EEPROM 8 PIN LAP 10MHZ | Precision Amplifiers High Precision Oper Amplifier | Tantalum Capacitors - Solid SMD 10uF 50volt 10% D Case Molded | FPGA - Configuration Memory 1M-BIT CONFIG EEPROM ALTERA PINOUT-1M-BIT | Analog Switch ICs IC 1 Ohm 16V Dual SPDT CMOS | FPGA - Configuration Memory 2M 3.3V 10MHz | USB Interface IC USB to Basic Serial UART IC QFN-16 | FPGA - Configuration Memory 256KB EEPROM 8 PIN LAP 10MHZ |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
零件包装代码 | SOIC | DIP | LPCC | DIP | LPCC | QFP | SOIC | SOIC |
包装说明 | SOP, SOP20,.4 | DIP, DIP8,.3 | QCCJ, LDCC20,.4SQ | DIP, DIP8,.3 | QCCJ, LDCC20,.4SQ | TQFP, TQFP44,.47SQ,32 | SOP, SOP20,.4 | SOP, SOP8,.25 |
针数 | 20 | 8 | 20 | 8 | 20 | 44 | 20 | 8 |
Reach Compliance Code | compliant | unknown | unknown | unknown | unknown | unknown | compliant | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | ALSO OPERATES AT 5V SUPPLY | ALSO OPERATES AT 5V SUPPLY | ALSO OPERATES AT 5V SUPPLY | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO |
最大时钟频率 (fCLK) | 10 MHz | 10 MHz | 15 MHz | 15 MHz | 15 MHz | 10 MHz | 10 MHz | 10 MHz |
JESD-30 代码 | R-PDSO-G20 | R-PDIP-T8 | S-PQCC-J20 | R-PDIP-T8 | S-PQCC-J20 | S-PQFP-G44 | R-PDSO-G20 | R-PDSO-G8 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
长度 | 12.8 mm | 9.271 mm | 8.9662 mm | 9.271 mm | 8.9662 mm | 10 mm | 12.8 mm | 4.925 mm |
内存密度 | 262144 bit | 262144 bit | 2097152 bit | 1048576 bit | 524288 bit | 2097152 bit | 2097152 bit | 262144 bit |
内存集成电路类型 | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY |
内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
湿度敏感等级 | 1 | 1 | 2 | 1 | 2 | 3 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 8 | 20 | 8 | 20 | 44 | 20 | 8 |
字数 | 262144 words | 262144 words | 2097152 words | 1048576 words | 524288 words | 2097152 words | 2097152 words | 262144 words |
字数代码 | 256000 | 256000 | 2000000 | 1000000 | 512000 | 2000000 | 2000000 | 256000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 256KX1 | 256KX1 | 2MX1 | 1MX1 | 512KX1 | 2MX1 | 2MX1 | 256KX1 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | DIP | QCCJ | DIP | QCCJ | TQFP | SOP | SOP |
封装等效代码 | SOP20,.4 | DIP8,.3 | LDCC20,.4SQ | DIP8,.3 | LDCC20,.4SQ | TQFP44,.47SQ,32 | SOP20,.4 | SOP8,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | FLATPACK, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
峰值回流温度(摄氏度) | 260 | NOT SPECIFIED | 245 | NOT SPECIFIED | 245 | 260 | 260 | 260 |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3/5 V | 3.3 V | 3.3/5 V | 3.3/5 V | 3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.65 mm | 5.334 mm | 4.572 mm | 5.334 mm | 4.572 mm | 1.2 mm | 2.65 mm | 1.75 mm |
最大压摆率 | 0.005 mA | 0.005 mA | 0.005 mA | 0.01 mA | 0.005 mA | 0.01 mA | 0.01 mA | 0.005 mA |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | NO | YES | NO | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) - annealed | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) - annealed | Matte Tin (Sn) |
端子形式 | GULL WING | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 0.8 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | QUAD | DUAL | QUAD | QUAD | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 40 | NOT SPECIFIED | 40 | NOT SPECIFIED | 40 | 40 | 40 | 40 |
宽度 | 7.5 mm | 7.62 mm | 8.9662 mm | 7.62 mm | 8.9662 mm | 10 mm | 7.5 mm | 3.9 mm |
最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | - | - | 0.00015 A | 0.00015 A | 0.0001 A |
Is Samacsys | - | N | - | - | N | N | N | N |
Base Number Matches | - | 1 | - | - | 1 | 1 | 1 | 1 |
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