CMOS MCU(MICROCOMPUTER UNIT)
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Hitachi (Renesas ) |
包装说明 | SDIP, SDIP64,.75 |
Reach Compliance Code | unknow |
位大小 | 8 |
CPU系列 | 6805 |
JESD-30 代码 | R-PDIP-T64 |
JESD-609代码 | e0 |
端子数量 | 64 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SDIP |
封装等效代码 | SDIP64,.75 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE, SHRINK PITCH |
电源 | 5 V |
认证状态 | Not Qualified |
RAM(字节) | 128 |
ROM(单词) | 4096 |
速度 | 1 MHz |
最大压摆率 | 10 mA |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 1.78 mm |
端子位置 | DUAL |
HD6305X0系列MCU(微计算机单元)是8位单片机,具有以下特点:
适合的应用场景包括:
由于HD6305X0系列MCU的多样性和灵活性,它们可以被广泛应用于需要微控制的各种场合。
HD6305XOP | HD6305XO | HD6305X0 | HD6305XOF | HD63A05X0P | HD63B05X0 | HD63B05X0F | HD63B05X0P | |
---|---|---|---|---|---|---|---|---|
描述 | CMOS MCU(MICROCOMPUTER UNIT) | CMOS MCU(MICROCOMPUTER UNIT) | CMOS MCU(MICROCOMPUTER UNIT) | CMOS MCU(MICROCOMPUTER UNIT) | CMOS MCU(MICROCOMPUTER UNIT) | CMOS MCU(MICROCOMPUTER UNIT) | CMOS MCU(MICROCOMPUTER UNIT) | CMOS MCU(MICROCOMPUTER UNIT) |
是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 | - | 不符合 | 不符合 |
厂商名称 | Hitachi (Renesas ) | - | - | Hitachi (Renesas ) | Hitachi (Renesas ) | - | Hitachi (Renesas ) | Hitachi (Renesas ) |
包装说明 | SDIP, SDIP64,.75 | - | - | QFP, QFP64,.7X.95,40 | SDIP, SDIP64,.75 | - | QFP, QFP64,.7X.95,40 | SDIP, SDIP64,.75 |
Reach Compliance Code | unknow | - | - | unknow | unknow | - | unknow | unknow |
位大小 | 8 | - | - | 8 | 8 | - | 8 | 8 |
CPU系列 | 6805 | - | - | 6805 | 6805 | - | 6805 | 6805 |
JESD-30 代码 | R-PDIP-T64 | - | - | R-PQFP-G64 | R-PDIP-T64 | - | R-PQFP-G64 | R-PDIP-T64 |
JESD-609代码 | e0 | - | - | e0 | e0 | - | e0 | e0 |
端子数量 | 64 | - | - | 64 | 64 | - | 64 | 64 |
最高工作温度 | 70 °C | - | - | 70 °C | 70 °C | - | 70 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SDIP | - | - | QFP | SDIP | - | QFP | SDIP |
封装等效代码 | SDIP64,.75 | - | - | QFP64,.7X.95,40 | SDIP64,.75 | - | QFP64,.7X.95,40 | SDIP64,.75 |
封装形状 | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE, SHRINK PITCH | - | - | FLATPACK | IN-LINE, SHRINK PITCH | - | FLATPACK | IN-LINE, SHRINK PITCH |
电源 | 5 V | - | - | 5 V | 5 V | - | 5 V | 5 V |
认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
RAM(字节) | 128 | - | - | 128 | 128 | - | 128 | 128 |
ROM(单词) | 4096 | - | - | 4096 | 4096 | - | 4096 | 4096 |
速度 | 1 MHz | - | - | 1 MHz | 1.5 MHz | - | 2 MHz | 2 MHz |
最大压摆率 | 10 mA | - | - | 10 mA | 10 mA | - | 10 mA | 10 mA |
标称供电电压 | 5 V | - | - | 5 V | 5 V | - | 5 V | 5 V |
表面贴装 | NO | - | - | YES | NO | - | YES | NO |
技术 | CMOS | - | - | CMOS | CMOS | - | CMOS | CMOS |
温度等级 | COMMERCIAL | - | - | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | - | - | GULL WING | THROUGH-HOLE | - | GULL WING | THROUGH-HOLE |
端子节距 | 1.78 mm | - | - | 1 mm | 1.778 mm | - | 1 mm | 1.778 mm |
端子位置 | DUAL | - | - | QUAD | DUAL | - | QUAD | DUAL |
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