1.6mm, glass epoxy board. Exposed Die-pad area is not a substrate mounting.
[Warning]: If you should intend to use this IC continuously under high temperature, high current, high voltage, or drastic temperature change, even if it is used
within the range of absolute maximum ratings or operating conditions, there is a possibility of decrease reliability. Please contact us for a confirmation.
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed,
damage may occur and reliability may be affected.
Recommended Operating Conditions
at Ta = 25°C
Parameter
Recommended supply voltage
Operating supply voltage range
Symbol
VCC
VCC op
SVCC
SVCC
Conditions
Ratings
5.0
4.5 to 5.5
Unit
V
V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended
Operating Ranges limits may affect device reliability.
Electrical Characteristics
at Ta
=
25°C, VCC = 5V
Parameter
Consumption current
Oscillator frequency
Reference current pin voltage
MAX output current
Between bits output current
Maximum LED driver output
current 1
LED output on resistance 1
LED output on resistance 2
OFF leak current
Driver output malfunction
protection voltage
Ron1
Ron2
Ileak
Vt
LED1, LED2, LED3, LED4, LED5
(IO = 100mA)
LED6 (IO = 100mA)
LED OFF
SVCC
2.58
2.70
11
4
22
10
10
2.82
Ω
Ω
μA
V
Symbol
ICC2
Fosc
VRT
ΔIL
ΔI
OL
IMAX1
RT1=22kΩ
VO=0.7 to 4.0V(Same channel line regulation)
IO=30.7mA (Between bits pairing
characteristics)
LED OUTSCT= L
28.8
30.7
32.6
mA
LED off
900
0.92
-10
5
Conditions
Ratings
min
typ
5
1000
0.98
max
7
1100
1.04
Unit
mA
kHz
V
%
%
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be
indicated by the Electrical Characteristics if operated under different conditions.
No.A1941-2/32
LV5235V
Control circuit
at Ta
=
25°C, VCC = 5.0V
Parameter
H level 1
M level 1
L level 1
H level 2
L level 2
H level 3
L level 3
H level 4
L level 4
H level 5
L level 5
Symbol
VH1
VM1
VL1
VH2
VL2
VH3
VL3
VH4
VL4
VH7
VL7
Conditions
Input H level OUTSCT
Input M level OUTSCT
Input L level OUTSCT
Input H level CTLSCT
Input L level CTLSCT
Input H level RESET
Input L level RESET
Input H level SCLK, SDATA, SDEN
Input L level SCLK, SDATA, SDEN
Input H level A0 to A4
Input L level A0 to A4
Ratings
min
4.7
2
-0.2
0.7× VCC
-0.2
0.8× VCC
-0.2
0.8× VCC
-0.2
0.7× VCC
-0.2
typ
max
5
3.3
0.3
VCC
0.3
VCC
0.2× VCC
VCC
0.2× VCC
VCC
0.3
Unit
V
V
V
V
V
V
V
V
V
V
V
Package Dimensions
SSOP44J (275mil) Exposed Pad
CASE 940AG
ISSUE A
No.A1941-3/32
LV5235V
SOLDERING FOOTPRINT*
(Unit: mm)
(7.8)
(3.6)
1.00
0.32
0.65
NOTES:
1. The measurements are for reference only, and unable to guarantee.
2. Please take appropriate action to design the actual Exposed Die Pad and Fin portion.
3. After setting, verification on the product must be done.
(Although there are no recommended design for Exposed Die Pad and Fin portion Metal mask and shape
for Through−Hole pitch (Pitch & Via etc), checking the soldered joint condition and reliability verification of
soldered joint will be needed. Void gradient insufficient thickness of soldered joint or bond degradation
could lead IC destruction because thermal conduction to substrate becomes poor.)
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor
Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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