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HYB25DC512160CF-6: 产品描述DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60; 产品类别存储存储; 文件大小3MB，共88页; 制造商Infineon(英飞凌); 官网地址http://www.infineon.com/

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HYB25DC512160CF-6概述

DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60

HYB25DC512160CF-6规格参数

参数名称	属性值
厂商名称	Infineon(英飞凌)
零件包装代码	BGA
包装说明	TBGA,
针数	60
Reach Compliance Code	unknown
ECCN代码	EAR99
访问模式	FOUR BANK PAGE BURST
最长访问时间	0.7 ns
其他特性	AUTO/SELF REFRESH
JESD-30 代码	R-PBGA-B60
长度	12 mm
内存密度	536870912 bit
内存集成电路类型	DDR DRAM
内存宽度	16
功能数量	1
端口数量	1
端子数量	60
字数	33554432 words
字数代码	32000000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	32MX16
封装主体材料	PLASTIC/EPOXY
封装代码	TBGA
封装形状	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE
认证状态	Not Qualified
座面最大高度	1.2 mm
自我刷新	YES
最大供电电压 (Vsup)	2.7 V
最小供电电压 (Vsup)	2.3 V
标称供电电压 (Vsup)	2.5 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子形式	BALL
端子节距	1 mm
端子位置	BOTTOM
宽度	10 mm
Base Number Matches	1

HYB25DC512160CF-6相似产品对比

	HYB25DC512160CF-6	HYB25DC512160CE-6	HYB25DC512800CF-6	HYB25DC512800CE-6	HYB25DC512160CE-5	HYB25DC512800CF-5	HYB25DC512160CF-5	HYB25DC512800CE-5
描述	DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60	DDR DRAM, 32MX16, 0.7ns, CMOS, PDSO66, GREEN, PLASTIC, TSOP2-66	DDR DRAM, 64MX8, 0.7ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60	DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66, GREEN, PLASTIC, TSOP2-66	DDR DRAM, 32MX16, 0.5ns, CMOS, PDSO66, GREEN, PLASTIC, TSOP2-66	DDR DRAM, 64MX8, 0.5ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60	DDR DRAM, 32MX16, 0.5ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60	DDR DRAM, 64MX8, 0.5ns, CMOS, PDSO66, GREEN, PLASTIC, TSOP2-66
厂商名称	Infineon(英飞凌)	Infineon(英飞凌)	Infineon(英飞凌)	Infineon(英飞凌)	Infineon(英飞凌)	Infineon(英飞凌)	Infineon(英飞凌)	Infineon(英飞凌)
零件包装代码	BGA	TSOP2	BGA	TSOP2	TSOP2	BGA	BGA	TSOP2
包装说明	TBGA,	TSSOP,	TBGA,	TSSOP,	TSSOP,	TBGA,	TBGA,	TSSOP,
针数	60	66	60	66	66	60	60	66
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
访问模式	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
最长访问时间	0.7 ns	0.7 ns	0.7 ns	0.7 ns	0.5 ns	0.5 ns	0.5 ns	0.5 ns
其他特性	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 代码	R-PBGA-B60	R-PDSO-G66	R-PBGA-B60	R-PDSO-G66	R-PDSO-G66	R-PBGA-B60	R-PBGA-B60	R-PDSO-G66
长度	12 mm	22.22 mm	12 mm	22.22 mm	22.22 mm	12 mm	12 mm	22.22 mm
内存密度	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bi
内存集成电路类型	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
内存宽度	16	16	8	8	16	8	16	8
功能数量	1	1	1	1	1	1	1	1
端口数量	1	1	1	1	1	1	1	1
端子数量	60	66	60	66	66	60	60	66
字数	33554432 words	33554432 words	67108864 words	67108864 words	33554432 words	67108864 words	33554432 words	67108864 words
字数代码	32000000	32000000	64000000	64000000	32000000	64000000	32000000	64000000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	32MX16	32MX16	64MX8	64MX8	32MX16	64MX8	32MX16	64MX8
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TBGA	TSSOP	TBGA	TSSOP	TSSOP	TBGA	TBGA	TSSOP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY, THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
自我刷新	YES	YES	YES	YES	YES	YES	YES	YES
最大供电电压 (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
最小供电电压 (Vsup)	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V
标称供电电压 (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	BALL	GULL WING	BALL	GULL WING	GULL WING	BALL	BALL	GULL WING
端子节距	1 mm	0.65 mm	1 mm	0.65 mm	0.65 mm	1 mm	1 mm	0.65 mm
端子位置	BOTTOM	DUAL	BOTTOM	DUAL	DUAL	BOTTOM	BOTTOM	DUAL
宽度	10 mm	10.16 mm	10 mm	10.16 mm	10.16 mm	10 mm	10 mm	10.16 mm

HYB25DC512160CF-6

HYB25DC512160CF-6概述

HYB25DC512160CF-6规格参数

HYB25DC512160CF-6相似产品对比

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