SA636
Low voltage high performance mixer FM IF system
with high-speed RSSI
Rev. 7 — 16 June 2016
Product data sheet
1. General description
The SA636 is a low-voltage high performance monolithic FM IF system with high-speed
RSSI incorporating a mixer/oscillator, two limiting intermediate frequency amplifiers,
quadrature detector, logarithmic Received Signal Strength Indicator (RSSI), voltage
regulator, wideband data output and fast RSSI op amps. The SA636 is available in
20-lead SSOP (Shrink Small Outline Package) and HVQFN20 (quad flat package).
The SA636 was designed for high bandwidth portable communication applications and
will function down to 2.7 V. The RF section is similar to the famous SA605. The data
output has a minimum bandwidth of 600 kHz. This is designed to demodulate wideband
data. The RSSI output is amplified. The RSSI output has access to the feedback pin. This
enables the designer to adjust the level of the outputs or add filtering.
SA636 incorporates a power-down mode which powers down the device when
POWER_DOWN_CTRL pin is LOW. Power-down logic levels are CMOS and TTL
compatible with high input impedance.
2. Features and benefits
Wideband data output (600 kHz minimum)
Fast RSSI rise and fall times
Low power consumption: 6.5 mA typical at 3 V
Mixer input to >500 MHz
Mixer conversion power gain of 11 dB at 240 MHz
Mixer noise figure of 12 dB at 240 MHz
XTAL oscillator effective to 150 MHz (LC oscillator to 1 GHz local oscillator can be
injected)
92 dB of IF amp/limiter gain
25 MHz limiter small signal bandwidth
Temperature compensated logarithmic Received Signal Strength Indicator (RSSI) with
a dynamic range in excess of 90 dB
RSSI output internal op amp
Internal op amps with rail-to-rail outputs
Low external component count; suitable for crystal/ceramic/LC filters
Excellent sensitivity: 0.54
V
into 50
matching network for 12 dB SINAD
(Signal-to-Noise And Distortion ratio) for 1 kHz tone with RF at 240 MHz and IF at
10.7 MHz
10.7 MHz filter matching (330
)
Power-down mode (I
CC
= 200
A)
NXP Semiconductors
SA636
Low voltage high performance mixer FM IF system
ESD protection exceeds 2000 V HBM per JESD22-A114 and 1000 V CDM per
JESD22-C101
Latch-up testing is done to JEDEC Standard JESD78 Class II, Level B
3. Applications
DECT (Digital European Cordless Telephone)
Digital cordless telephones
Digital cellular telephones
Portable high performance communications receivers
Single conversion VHF/UHF receivers
FSK and ASK data receivers
Wireless LANs
4. Ordering information
Table 1.
Ordering information
Package
Name
Description
Version
SOT917-1
SOT266-1
HVQFN20 plastic thermal enhanced very thin quad flat package; no leads;
20 terminals; body 4
4
0.85 mm
SSOP20
plastic shrink small outline package; 20 leads; body width 4.4 mm
Type number Topside
mark
SA636BS
SA636DK/01
636B
SA636DK
SA636
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
Rev. 7 — 16 June 2016
2 of 31
NXP Semiconductors
SA636
Low voltage high performance mixer FM IF system
5. Block diagram
LIMITER_DECOUPL
IF_AMP_DECOUPL
IF_AMP_DECOUPL
LIMITER_DECOUPL
IF_AMP_OUT
MIXER_OUT
IF amp
mixer
LIMITER_IN
IF_AMP_IN
GND
limiter
quad
OSC
FAST
RSSI
POWER
DOWN
RSSI
POWER_DOWN_CTRL
RSSI_FEEDBACK
DATA_OUT
RSSI_OUT
QUADRATURE IN
002aaf661
V
CC
E
RF_IN_DECOUPL
OSC_OUT
RF_IN
B
OSC_IN
V
CC
audio
Fig 1.
Block diagram of SA636
SA636
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
Rev. 7 — 16 June 2016
LIMITER_OUT
3 of 31
NXP Semiconductors
SA636
Low voltage high performance mixer FM IF system
6. Pinning information
6.1 Pinning
RF_IN
RF_IN_DECOUPL
OSC_OUT
OSC_IN
V
CC
RSSI_FEEDBACK
RSSI_OUT
POWER_DOWN_CTRL
DATA_OUT
1
2
3
4
5
6
7
8
9
20 MIXER_OUT
19 IF_AMP_DECOUPL
18 IF_AMP_IN
17 IF_AMP_DECOUPL
16 IF_AMP_OUT
15 GND
14 LIMITER_IN
13 LIMITER_DECOUPL
12 LIMITER_DECOUPL
11 LIMITER_OUT
002aaf660
SA636DK/01
QUADRATURE_IN 10
Fig 2.
Pin configuration for SSOP20
17 IF_AMP_DECOUPL
20 RF_IN_DECOUPL
18 MIXER_OUT
terminal 1
index area
OSC_OUT
OSC_IN
V
CC
AUDIO_FEEDBACK
RSSI_OUT
1
2
3
4
5
DAP
(1)
LIMITER_DECOUPL 10
6
7
8
9
16 IF_AMP_IN
15 IF_AMP_DECOUPL
14 IF_AMP_OUT
13 GND
12 LIMITER_IN
11 LIMITER_DECOUPL
SA636BS
19 RF_IN
DATA_OUT
QUADRATURE_IN
POWER_DOWN
LIMITER_OUT
002aag294
Transparent top view
(1) Die Attach Paddle (DAP).
Fig 3.
Pin configuration for HVQFN20
SA636
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
Rev. 7 — 16 June 2016
4 of 31
NXP Semiconductors
SA636
Low voltage high performance mixer FM IF system
6.2 Pin description
Table 2.
Symbol
RF_IN
RF_IN_DECOUPL
OSC_OUT
OSC_IN
V
CC
RSSI_FEEDBACK
RSSI_OUT
POWER_DOWN_CTRL
DATA_OUT
QUADRATURE_IN
LIMITER_OUT
LIMITER_DECOUPL
LIMITER_DECOUPL
LIMITER_IN
GND
IF_AMP_OUT
IF_AMP_DECOUPL
IF_AMP_IN
IF_AMP_DECOUPL
MIXER_OUT
-
[1]
Pin description
Pin
SSOP20
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
-
HVQFN20
19
20
1
2
3
4
5
6
7
8
9
10
11
12
13
[1]
14
15
16
17
18
DAP
RF input
RF input decoupling pin
oscillator output (emitter)
oscillator input (base)
positive supply voltage
RSSI amplifier negative feedback terminal
RSSI output
power-down control; active HIGH
data output
quadrature detector input terminal
limiter amplifier output
limiter amplifier decoupling pin
limiter amplifier decoupling pin
limiter amplifier input
ground; negative supply
IF amplifier output
IF amplifier decoupling pin
IF amplifier input
IF amplifier decoupling pin
mixer output
exposed die attach paddle; connect to ground
Description
For the HVQFN20 package, the exposed die attach paddle must be connected to device ground pin 13 and
the PCB ground plane. GND pin must be connected to supply ground for proper device operation. For
enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the
board using a corresponding thermal pad on the board and for proper heat conduction through the board,
thermal vias need to be incorporated in the printed-circuit board in the thermal pad region.
SA636
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
Rev. 7 — 16 June 2016
5 of 31
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