HIGH SPEED GRAPHICS
conga-TR3
-
AMD Embedded R-Series SOC and G-Series SOC
-
Up to 4 “Excavator” Cores
-
High performance integrated 3
rd
Gen.
GCN graphics with up to 512 stream processors
-
Unified Video Decoder (UVD 6) supporting
HEVC/H.265 4K@60Hz
-
ECC protected DDR4 memory up to 32 GByte
-
Full HSA 2.0 compliant (Heterogenous System
Architecture)
-
TDP scalable down to 12W
Formfactor
CPU
COM Express
®
Basic | (95 x 125 mm) | Type 6 Connector Layout
AMD Embedded R-Series SOC
AMD Embedded RX-421BD
AMD Embedded RX-418GD
AMD Embedded RX-416GD
AMD Embedded RX-216GD
AMD Embedded GX-217GI
4x 2.1 .. 3.4 GHz
4x 1.8 .. 3.2 GHz
4x 1.6 .. 2.4 GHz
2x 1.6 .. 3.0 GHz
2x 1.7 .. 2.0 GHz
L2 cache 2MB shared Radeon™ R7 Graphics
L2 cache 2MB shared Radeon™ R6 Graphics
L2 cache 2MB shared Radeon™ R6 Graphics
TDP 15 W, conf. to 12/25/35 W
TDP 15 W, conf. to 12/25/35 W
TDP 15 W
L2 cache 1MB shared Radeon™ R5 Graphics
TDP 15 W, conf. to 12 W
L2 cache 1MB shared Radeon™ 3
rd
Gen Graphics TDP 15 W, conf. to 12 W
DRAM
Chipset
Ethernet
I/O Interfaces
Sound
Graphics
2 Sockets, SO-DIMM DDR4 up to 32 GByte with ECC
Integrated in SOC (single-chip)
Gigabit Ethernet
3x PCI Express
™
2.0 lanes | 1x PEG 3.0 x8 | 4x SATA
®
6 Gb/s | 4x USB 3.0/2.0 | 4x USB 2.0 | I²C bus (fast mode, 400 kHz, multi-master) |
SD | LPC Bus | SPI | SM-Bus | 2x UART
High Definition Audio Interface | TrueAudio 2.1
Integrated AMD Radeon™ Graphics supports DirectX 12 | OpenGL 4.4 and OpenCL™ 2.0 | up to 3 Simultaneous Displays
Unified Video Decoder 6 (H.265, H.264, MVC, MPEG4, MPEG2, VC-1, WMV and MJPEG)
Video Compression Engine 3.1 (dual, H.264, SVC)
18/24-bit Single/Dual Channel LVDS Interface | Resolutions up to 1920X1200@60Hz | VESA standard or JEIDA data mapping | Automatic Panel
Detection via EDID/EPI
2x DisplayPort 1.2/ HDMI 2.0 supporting 4K @60Hz
Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | BIOS Setup Data Backup
I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Backlight
AMI AptioV
®
UEFI 2.x firmware | 8 MByte serial SPI firmware flash
The conga-TR3 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM). It is capable of calculating efficient hash and
RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and
e-commerce will benefit also with improved authentication, integrity and confidence levels.
ACPI 5.0 with battery support
Microsoft
®
Windows 10 | Microsoft
®
Windows 8.1 | Microsoft
®
Windows
®
8 Embedded Standard | Linux | optional Microsoft
®
Windows 7
Commercial : Operating: 0 to +60°C | Storage: -20 to +80°C
Operating: 10 - 90% r. H. non cond. | Storage: 5 - 95% r. H. non cond.
95 x 125 mm (3.74” x 4.92”)
LVDS
Digital Display Interface
congatec Board Controller
Embedded BIOS Features
Security
Power Management
Operating Systems
Temperature
Humidity
Size
www.congatec.com
conga-TR3
| Block diagram
COM Express AB
Connector
220 pos
DDI 3 ASSEMBLY OPTION
Dual Channel
DDR4 SODIMM
up to 2x 16GB
Embedded G-Series SOC
LVDS / eDP ASSEMBLY OPTION
COM Express CD
Connector
220 pos
Embedded R-Series SOC
Integrated
DP0
DDI 3
DP1
DP2
LVDS
eDP-LVDS
NXP PTN3460
Compute Unit
2MB Shared L2
Core #1
Core #2
Core #4
SSE4.2
Memory
high performance
ECC
low power
DirectX 12
AVX
DDI 1
DDI 2
CRT
PCIe 0-2
PCIe 3
PCIe 4-5
Ethernet
GBE
PCIe-GBE
Intel i211
PE x1
PCIE 3x1
Core #3
AES
PEG x8
PEG 0-7
PEG 8-15
PCIe 6-7
OpenGL 4.4
Graphics Unit
OpenCL 2.0
USB 0-7
SATA 0-1
SATA 2-3
8x USB2.0
Interfaces
DisplayPort
HDMI/DVI
Multimedia Features
WMV-9
VC-1
H.264
MVC
4x USB SS
MPEG-4
MUX
2x SATA
MPEG-2
MJPEG
USB SS 0-3
H.265
Integrated I/O Interfaces
PCIe
SATA
LPC Bus
USB 2.0
Platform Security
Optional
TPM
GPIOs
USB 3.0
HDA I/F
SD / SDIO
RSA
SHA
AES
TRNG
LPC
GPIOs / SDIO
SM
I2C
FAN control
LPC
MUX
GPIOs
congatec
Board
Controller
www.congatec.com
conga-TR3
| Order Information
Article
conga-TR3/RX421BD
conga-TR3/RX418GD
conga-TR3/i-RX-416GD
conga-TR3/RX216GD
conga-TR3/GX217GI
conga-TR3/HSP-HP-B
conga-TR3/HSP-HP-T
conga-TR3/CSP-HP-B
conga-TR3/CSP-HP-T
conga-TR3/CSA-HP-B
conga-TR3/CSA-HP-T
DDR4-SODIMM-2400 (4GB)
DDR4-SODIMM-2400 (8GB)
DDR4-SODIMM-2400 (16GB)
DDR4-SODIMM-2400 ECC (4GB)
DDR4-SODIMM-2400 ECC (8GB)
DDR4-SODIMM-2400 ECC (16GB)
PN
041300
041301
041310
041302
041320
041351
041352
041355
041356
041357
041358
068790
068791
068792
068795
068796
068797
Description
COM Express Basic Type 6 module | AMD Embedded RX-421BD SOC | AMD Radeon™ R7 Graphics | TDP 15/12-35W |
Quad-core | CPU freq. 2.1/3.4 GHz | 8 GPU-CU | GPU freq. 800 MHz
COM Express Basic Type 6 module | AMD Embedded RX-418GD SOC | AMD Radeon™ R6 Graphics | TDP 15/12-35W |
Quad-core | CPU freq. 1.8/3.2 GHz | 6 GPU-CU | GPU freq. 800 MHz
COM Express Basic Type 6 module | AMD embedded RX-416GD SOC | AMD Radeon™ R6 Graphics | TDP 15W |
Quad-core | CPU freq. 1.6/2.4 GHz | 6 GPU-CU | GPU freq. 800 MHz
COM Express Basic Type 6 module | AMD Embedded RX-216GD SOC | AMD Radeon™ R5 Graphics | TDP 15/12-15W |
Dual-core | CPU freq. 1.6/3.0 GHz | 4 GPU-CU | GPU freq. 800 MHz
COM Express Basic Type 6 module | AMD embedded GX-217GI SOC | AMD Radeon™ R5 Graphics | TDP 15/12-15W |
Dual-core | CPU freq. 1.7/2.0 GHz | 4 GPU-CU | GPU freq. 800 MHz
Standard heatspreader for high performance COM Express module conga-TR3 with integrated heat pipes. All standoffs are with
2.7mm bore hole.
Standard heatspreader for high performance COM Express module conga-TR3 with integrated heat pipes. All standoffs are
M2.5mm thread.
Standard passive cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins
and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole.
Standard passive cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins
and 20mm overall heat sink height. All standoffs are M2.5mm thread.
Standard active cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins,
20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
Standard active cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins,
20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
4 GByte DDR4 SODIMM memory module | 2400 MT/s
8 GByte DDR4 SODIMM memory module | 2400 MT/s
16 GByte DDR4 SODIMM memory module | 2400 MT/s
4 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V
8 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V
16 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V
Accessories
conga-TEVAL
conga-LDVI/EPI
COM-Express-Carrier-Socket-5
COM-Express-Carrier-Socket-8
065800
011115
400007
400004
Evaluation carrier board for Type 6 COM-Express-modules
LVDS to DVI converter board for digital flat panels with onboard EEPROM
Connector for COM-Express carrier boards | height 5mm | packing unit 4 pieces
Connector for COM-Express carrier boards | height 8mm | packing unit 4 pieces
© 2016 congatec AG. All rights reserved.
All data is for information purposes only. Although all the information contained within this document is carefully checked, no guarantee
of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their
respective trademark holders. These trademark holders are not affiliated with congatec AG. Rev. June 23, 2017 MR
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