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conga-TR3-CSP-HP-B: 产品描述Heat Sinks Standard passive cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole.; 产品类别热管理产品; 文件大小814KB，共3页; 制造商congatec

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conga-TR3-CSP-HP-B概述

Heat Sinks Standard passive cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole.

conga-TR3-CSP-HP-B规格参数

参数名称	属性值
产品种类 Product Category	Heat Sinks
制造商 Manufacturer	congatec
RoHS	Details
工厂包装数量 Factory Pack Quantity	1

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HIGH SPEED GRAPHICS

conga-TR3

AMD Embedded R-Series SOC and G-Series SOC

Up to 4 “Excavator” Cores

High performance integrated 3

Gen.

GCN graphics with up to 512 stream processors

Unified Video Decoder (UVD 6) supporting

HEVC/H.265 4K@60Hz

ECC protected DDR4 memory up to 32 GByte

Full HSA 2.0 compliant (Heterogenous System

Architecture)

TDP scalable down to 12W

Formfactor

CPU

COM Express

Basic | (95 x 125 mm) | Type 6 Connector Layout

AMD Embedded R-Series SOC

AMD Embedded RX-421BD

AMD Embedded RX-418GD

AMD Embedded RX-416GD

AMD Embedded RX-216GD

AMD Embedded GX-217GI

4x 2.1 .. 3.4 GHz

4x 1.8 .. 3.2 GHz

4x 1.6 .. 2.4 GHz

2x 1.6 .. 3.0 GHz

2x 1.7 .. 2.0 GHz

L2 cache 2MB shared Radeon™ R7 Graphics

L2 cache 2MB shared Radeon™ R6 Graphics

TDP 15 W, conf. to 12/25/35 W

TDP 15 W

L2 cache 1MB shared Radeon™ R5 Graphics

TDP 15 W, conf. to 12 W

L2 cache 1MB shared Radeon™ 3

Gen Graphics TDP 15 W, conf. to 12 W

DRAM

Chipset

Ethernet

I/O Interfaces

Sound

Graphics

2 Sockets, SO-DIMM DDR4 up to 32 GByte with ECC

Integrated in SOC (single-chip)

Gigabit Ethernet

3x PCI Express

™

2.0 lanes | 1x PEG 3.0 x8 | 4x SATA

6 Gb/s | 4x USB 3.0/2.0 | 4x USB 2.0 | I²C bus (fast mode, 400 kHz, multi-master) |

SD | LPC Bus | SPI | SM-Bus | 2x UART

High Definition Audio Interface | TrueAudio 2.1

Integrated AMD Radeon™ Graphics supports DirectX 12 | OpenGL 4.4 and OpenCL™ 2.0 | up to 3 Simultaneous Displays

Unified Video Decoder 6 (H.265, H.264, MVC, MPEG4, MPEG2, VC-1, WMV and MJPEG)

Video Compression Engine 3.1 (dual, H.264, SVC)

18/24-bit Single/Dual Channel LVDS Interface | Resolutions up to 1920X1200@60Hz | VESA standard or JEIDA data mapping | Automatic Panel

Detection via EDID/EPI

2x DisplayPort 1.2/ HDMI 2.0 supporting 4K @60Hz

Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | BIOS Setup Data Backup

I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Backlight

AMI AptioV

UEFI 2.x firmware | 8 MByte serial SPI firmware flash

The conga-TR3 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM). It is capable of calculating efficient hash and

RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and

e-commerce will benefit also with improved authentication, integrity and confidence levels.

ACPI 5.0 with battery support

Microsoft

Windows 10 | Microsoft

Windows 8.1 | Microsoft

Windows

8 Embedded Standard | Linux | optional Microsoft

Windows 7

Commercial : Operating: 0 to +60°C | Storage: -20 to +80°C

Operating: 10 - 90% r. H. non cond. | Storage: 5 - 95% r. H. non cond.

95 x 125 mm (3.74” x 4.92”)

LVDS

Digital Display Interface

congatec Board Controller

Embedded BIOS Features

Security

Power Management

Operating Systems

Temperature

Humidity

Size

www.congatec.com

conga-TR3

| Order Information

Article

conga-TR3/RX421BD

conga-TR3/RX418GD

conga-TR3/i-RX-416GD

conga-TR3/RX216GD

conga-TR3/GX217GI

conga-TR3/HSP-HP-B

conga-TR3/HSP-HP-T

conga-TR3/CSP-HP-B

conga-TR3/CSP-HP-T

conga-TR3/CSA-HP-B

conga-TR3/CSA-HP-T

DDR4-SODIMM-2400 (4GB)

DDR4-SODIMM-2400 (8GB)

DDR4-SODIMM-2400 (16GB)

DDR4-SODIMM-2400 ECC (4GB)

DDR4-SODIMM-2400 ECC (8GB)

DDR4-SODIMM-2400 ECC (16GB)

041300

041301

041310

041302

041320

041351

041352

041355

041356

041357

041358

068790

068791

068792

068795

068796

068797

Description

COM Express Basic Type 6 module | AMD Embedded RX-421BD SOC | AMD Radeon™ R7 Graphics | TDP 15/12-35W |

Quad-core | CPU freq. 2.1/3.4 GHz | 8 GPU-CU | GPU freq. 800 MHz

COM Express Basic Type 6 module | AMD Embedded RX-418GD SOC | AMD Radeon™ R6 Graphics | TDP 15/12-35W |

Quad-core | CPU freq. 1.8/3.2 GHz | 6 GPU-CU | GPU freq. 800 MHz

COM Express Basic Type 6 module | AMD embedded RX-416GD SOC | AMD Radeon™ R6 Graphics | TDP 15W |

Quad-core | CPU freq. 1.6/2.4 GHz | 6 GPU-CU | GPU freq. 800 MHz

COM Express Basic Type 6 module | AMD Embedded RX-216GD SOC | AMD Radeon™ R5 Graphics | TDP 15/12-15W |

Dual-core | CPU freq. 1.6/3.0 GHz | 4 GPU-CU | GPU freq. 800 MHz

COM Express Basic Type 6 module | AMD embedded GX-217GI SOC | AMD Radeon™ R5 Graphics | TDP 15/12-15W |

Dual-core | CPU freq. 1.7/2.0 GHz | 4 GPU-CU | GPU freq. 800 MHz

Standard heatspreader for high performance COM Express module conga-TR3 with integrated heat pipes. All standoffs are with

2.7mm bore hole.

Standard heatspreader for high performance COM Express module conga-TR3 with integrated heat pipes. All standoffs are

M2.5mm thread.

Standard passive cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins

and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole.

Standard passive cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins

and 20mm overall heat sink height. All standoffs are M2.5mm thread.

Standard active cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins,

20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

Standard active cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins,

20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.

4 GByte DDR4 SODIMM memory module | 2400 MT/s

8 GByte DDR4 SODIMM memory module | 2400 MT/s

16 GByte DDR4 SODIMM memory module | 2400 MT/s

4 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V

8 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V

16 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V

Accessories

conga-TEVAL

conga-LDVI/EPI

COM-Express-Carrier-Socket-5

COM-Express-Carrier-Socket-8

065800

011115

400007

400004

Evaluation carrier board for Type 6 COM-Express-modules

LVDS to DVI converter board for digital flat panels with onboard EEPROM

Connector for COM-Express carrier boards | height 5mm | packing unit 4 pieces

Connector for COM-Express carrier boards | height 8mm | packing unit 4 pieces

All data is for information purposes only. Although all the information contained within this document is carefully checked, no guarantee

of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their

respective trademark holders. These trademark holders are not affiliated with congatec AG. Rev. June 23, 2017 MR

www.congatec.com

conga-TR3-CSP-HP-B相似产品对比

	conga-TR3-CSP-HP-B	conga-TR3-RX-418GD	conga-TR3-CSP-HP-T	conga-TR3-CSA-HP-B
描述	Heat Sinks Standard passive cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole.	Computer-On-Modules - COM COM Express Type 6 Basic module with AMD embedded R-Series RX-418GD (Merlin Falcon) quad core processor with 1.8GHz up to 3.2GHz core frequency, 2MB L2 cache and 2133MT/s DDR4 SODIMM memory interface for up to 32GB. Features AMD	Heat Sinks Standard passive cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are M2.5mm thread.	Heat Sinks Standard active cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
产品种类 Product Category	Heat Sinks	Computer-On-Modules - COM	Heat Sinks	Heat Sinks
制造商 Manufacturer	congatec	congatec	congatec	congatec
RoHS	Details	Details	Details	Details
工厂包装数量 Factory Pack Quantity	1	1	1	1

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conga-TR3-CSP-HP-B概述

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