| 器件名 | 厂商 | 描 述 | 功能 |
|---|---|---|---|
| DS1852B-000+ | Maxim(美信半导体) | Telecom Circuit, 1-Func, PBGA25, 5 X 5 MM, 0.80 MM PITCH, ROHS COMPLIANT, MO-205, BGA-25 | 下载 |
| DS1852B-000 | DALLAS | Optical Transceiver Diagnostic Monitor | 下载 |
| DS1852B-000- | Maxim(美信半导体) | Data Acquisition ADCs/DACs - Specialized Optical Transceiver Diagnostic Monitor | 下载 |
| DS1852B-000 | Maxim(美信半导体) | Data Acquisition ADCs/DACs - Specialized Optical Transceiver Diagnostic Monitor | 下载 |
| DS1852B-000/C | Maxim(美信半导体) | Data Acquisition ADCs/DACs - Specialized OPT TRANS DIAG MON REV C1 | 下载 |
| DS1852B-000-TR | Maxim(美信半导体) | Data Acquisition ADCs/DACs - Specialized Optical Transceiver Diagnostic Monitor | 下载 |
| DS1852B-000/T&R; | Maxim(美信半导体) | IC MONITOR TXRX OPTICAL 25-BGA | 下载 |
| DS1852B-000+T&R; | Maxim(美信半导体) | IC MONITOR TXRX OPTICAL 25-BGA | 下载 |
| DS1852B-000+T&R | Maxim(美信半导体) | Data Acquisition ADCs/DACs - Specialized Optical Transceiver Diagnostic Monitor | 下载 |
| DS1852B-000/T&R | Maxim(美信半导体) | Telecom Circuit, 1-Func, PBGA25, 5 X 5 MM, 0.80 MM PITCH, MO-205, BGA-25 | 下载 |
| 对应元器件 | pdf文档资料下载 |
|---|---|
| DS1852B-000 、 DS1852B-000+T&R 、 DS1852B-000/C | 下载文档 |
| DS1852B-000- 、 DS1852B-000-TR | 下载文档 |
| DS1852B-000+T&R; 、 DS1852B-000/T&R; | 下载文档 |
| DS1852B-000+ 、 DS1852B-000/T&R | 下载文档 |
| DS1852B-000 | 下载文档 |
| 型号 | DS1852B-000 | DS1852B-000+T&R | DS1852B-000/C |
|---|---|---|---|
| 描述 | Data Acquisition ADCs/DACs - Specialized Optical Transceiver Diagnostic Monitor | Data Acquisition ADCs/DACs - Specialized Optical Transceiver Diagnostic Monitor | Data Acquisition ADCs/DACs - Specialized OPT TRANS DIAG MON REV C1 |
| 是否无铅 | 含铅 | 不含铅 | - |
| 是否Rohs认证 | 不符合 | 符合 | - |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | - |
| 零件包装代码 | BGA | BGA | - |
| 包装说明 | 5 X 5 MM, 0.80 MM PITCH, MO-205, BGA-25 | LFBGA, | - |
| 针数 | 25 | 25 | - |
| Reach Compliance Code | not_compliant | compliant | - |
| ECCN代码 | EAR99 | EAR99 | - |
| JESD-30 代码 | S-PBGA-B25 | S-PBGA-B25 | - |
| JESD-609代码 | e0 | e3 | - |
| 长度 | 5 mm | 5 mm | - |
| 湿度敏感等级 | 3 | 3 | - |
| 功能数量 | 1 | 1 | - |
| 端子数量 | 25 | 25 | - |
| 最高工作温度 | 100 °C | 100 °C | - |
| 最低工作温度 | -40 °C | -40 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | LFBGA | LFBGA | - |
| 封装形状 | SQUARE | SQUARE | - |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | - |
| 峰值回流温度(摄氏度) | 240 | 260 | - |
| 认证状态 | Not Qualified | Not Qualified | - |
| 座面最大高度 | 1.5 mm | 1.5 mm | - |
| 标称供电电压 | 3 V | 3 V | - |
| 表面贴装 | YES | YES | - |
| 电信集成电路类型 | TELECOM CIRCUIT | TELECOM CIRCUIT | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | - |
| 端子形式 | BALL | BALL | - |
| 端子节距 | 0.8 mm | 0.8 mm | - |
| 端子位置 | BOTTOM | BOTTOM | - |
| 处于峰值回流温度下的最长时间 | 20 | 30 | - |
| 宽度 | 5 mm | 5 mm | - |
| Base Number Matches | 1 | 1 | - |
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