FEATURES:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
3.3 VOLT DUAL CMOS SyncFIFO™
DUAL 256 X 9, DUAL 512 X 9,
DUAL 1,024 X 9, DUAL 2,048 X 9,
DUAL 4,096 X 9 , DUAL 8,192 X 9
IDT72V801
IDT72V811
IDT72V821
IDT72V831
IDT72V841
IDT72V851
The IDT72V801 is equivalent to two IDT72V201 256 x 9 FIFOs
The IDT72V811 is equivalent to two IDT72V211 512 x 9 FIFOs
The IDT72V821 is equivalent to two IDT72V221 1,024 x 9 FIFOs
The IDT72V831 is equivalent to two IDT72V231 2,048 x 9 FIFOs
The IDT72V841 is equivalent to two IDT72V241 4,096 x 9 FIFOs
The IDT72V851 is equivalent to two IDT72V251 8,192 x 9 FIFOs
Offers optimal combination of large capacity, high speed,
design flexibility and small footprint
Ideal for prioritization, bidirectional, and width expansion
applications
10 ns read/write cycle time
5V input tolerant
Separate control lines and data lines for each FIFO
Separate Empty, Full, programmable Almost-Empty and
Almost-Full flags for each FIFO
Enable puts output data lines in high-impedance state
Space-saving 64-pin plastic Thin Quad Flat Pack (TQFP/
STQFP)
Industrial temperature range (–40°C to +85°C) is available
°
°
Green parts available, see ordering information
DESCRIPTION:
The IDT72V801/72V811/72V821/72V831/72V841/72V851/72V851 are
dual synchronous (clocked) FIFOs. The device is functionally equivalent to
two IDT72V201/72V211/72V221/72V231/72V241/72V251 FIFOs in a single
package with all associated control, data, and flag lines assigned to separate
pins.
Each of the two FIFOs (designated FIFO A and FIFO B) contained in the
IDT72V801/72V811/72V821/72V831/72V841/72V851 has a 9-bit input data
port (DA0 - DA8, DB0 - DB8) and a 9-bit output data port (QA0 - QA8,
QB0 - QB8). Each input port is controlled by a free-running clock (WCLKA,
WCLKB), and two Write Enable pins (WENA1, WENA2,
WENB1,
WENB2).
Data is written into each of the two arrays on every rising clock edge of the Write
Clock (WCLKA, WCLKB) when the appropriate Write Enable pins are
asserted.
The output port of each FIFO bank is controlled by its associated clock pin
(RCLKA, RCLKB) and two Read Enable pins (RENA1,
RENA2, RENB1,
RENB2).
The Read Clock can be tied to the Write Clock for single clock operation
or the two clocks can run asynchronous of one another for dual clock operation.
An Output Enable pin (OEA,
OEB)
is provided on the read port of each FIFO
for three-state output control.
Each of the two FIFOs has two fixed flags, Empty (EFA,
EFB)
and Full (FFA,
FFB).
Two programmable flags, Almost-Empty (PAEA,
PAEB)
and Almost-Full
(PAFA,
PAFB),
are provided for each FIFO bank to improve memory utilization.
If not programmed, the programmable flags default to Empty+7 for
PAEA
and
PAEB,
and Full-7 for
PAFA
and
PAFB.
The IDT72V801/72V811/72V821/72V831/72V841/72V851 architecture
lends itself to many flexible configurations such as:
• 2-level priority data buffering
• Bidirectional operation
• Width expansion
• Depth expansion
This FIFO is fabricated using IDT's high-performance submicron CMOS
technology.
FUNCTIONAL BLOCK DIAGRAM
WCLKB
EFA
PAEA
WENB1
PAFA
LDA
WENB2
FFA
OFFSET REGISTER
FLAG
LOGIC
RAM ARRAY
256 x 9, 512 x 9,
1,024 x 9, 2,048 x 9,
4,096 x 9, 8,192 x 9
WRITE CONTROL
LOGIC
RAM ARRAY
256 x 9, 512 x 9,
1,024 x 9, 2,048 x 9,
4,096 x 9, 8,192 x 9
WCLKA
WENA1
WENA2
DA
0
- DA
8
DB
0
- DB
8
LDB
INPUT REGISTER
WRITE CONTROL
LOGIC
INPUT REGISTER
OFFSET REGISTER
FLAG
LOGIC
EFB
PAEB
PAFB
FFB
WRITE POINTER
READ POINTER
READ CONTROL
LOGIC
WRITE POINTER
READ POINTER
READ CONTROL
LOGIC
OUTPUT REGISTER
RESET LOGIC
RESET LOGIC
OUTPUT REGISTER
RSA
OEA
QA
0
- QA
8
RCLKA
RENA1
RENA2
RSB
OEB
QB
0
- QB
8
RCLKB
RENB1
RENB2
4093 drw 01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The TeraSync FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
©2014
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
NOVEMBER 2014
DSC-4093/5
IDT72V801/72V8211/72V821/72V831/72V841/72V851 3.3V DUAL CMOS SyncFIFO
TM
DUAL 256 x 9, DUAL 512 x 9, DUAL 1K x 9, DUAL 2K x 9, DUAL 4K x 9, DUAL 8K x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
PIN CONFIGURATION
QA
0
FFA
EFA
OEA
RENA
2
RCLKA
RENA
1
GND
QB
8
QB
7
QB
6
QB
5
QB
4
QB
3
QB
2
QB
1
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
DA
5
DA
4
DA
3
DA
2
DA
1
DA
0
PAFA
PAEA
WENB
2
/LDB
WCLKB
WENB
1
RSB
DB
8
DB
7
DB
6
DB
5
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
QA
1
QA
2
QA
3
QA
4
QA
5
QA
6
QA
7
QA
8
V
CC
WENA
2
/LDA
WCLKA
WENA
1
RSA
DA
8
DA
7
DA
6
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
QB0
FFB
EFB
OEB
RENB
2
RCLKB
RENB
1
GND
Vcc
PAEB
PAFB
DB
0
DB
1
DB
2
DB
3
DB
4
4093 drw 02
TQFP (PN64, order code: PF)
STQFP (PP64, order code: TF)
TOP VIEW
2
IDT72V801/72V8211/72V821/72V831/72V841/72V851 3.3V DUAL CMOS SyncFIFO
TM
DUAL 256 x 9, DUAL 512 x 9, DUAL 1K x 9, DUAL 2K x 9, DUAL 4K x 9, DUAL 8K x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
PIN DESCRIPTIONS
The IDT72V801/72V811/72V821/72V831/72V841/72V851's two FIFOs,
referred to as FIFO A and FIFO B, are identical in every respect. The following
Symbol
D
A0
-D
A8
D
B0
-D
B8
RSA, RSB
description defines the input and output signals for FIFO A. The corresponding
signal names for FIFO B are provided in parentheses.
Name
I/O
I
I
I
Description
9-bit data inputs to RAM array A.
9-bit data inputs to RAM array B.
When
RSA
(RSB) is set LOW, the associated internal read and write pointers of array A (B) are set to the first
location;
FFA
(FFB) and
PAFA
(PAFB) go HIGH, and
PAEA
(PAEB) and
EFA
(EFB) go LOW. After power-
up, a reset of both FIFOs A and B is required before an initial WRITE.
Data is written into the FIFO A (B) on a LOW-to-HIGH transition of WCLKA (WCLKB) when the write enable(s)
are asserted.
If FIFO A (B) is configured to have programmable flags,
WENA1
(WENB1) is the only write enable pin that can be
used. When
WENA1
(WENB1) is LOW, data A (B) is written into the FIFO on every LOW-to-HIGH transition
WCLKA (WCLKB). If the FIFO is configured to have two write enables,
WENA1
(WENB1) must be LOW and
WENA2 (WENB2) must be HIGH to write data into the FIFO. Data will not be written into the FIFO if
FFA
(FFB) is
LOW.
FIFO A (B) is configured at reset to have either two write enables or programmable flags. If
LDA
(LDB) is HIGH at
reset, this pin operates as a second Write Enable. If WENA2/LDA (WENB2/LDB) is LOW at reset this pin operates
as a control to load and read the programmable flag offsets for its respective array. If the FIFO is configured to have
two write enables,
WENA1
(WENB1) must be LOW and WENA2 (WENB2) must be HIGH to write data into FIFO
A (B). Data will not be written into FIFO A (B) if
FFA
(FFB) is LOW. If the FIFO is configured to have programmable
flags,
LDA
(LDB) is held LOW to write or read the programmable flag offsets.
A Data Inputs
B Data Inputs
Reset
WCLKA
WCLKB
WENA1
WENB1
Write Clock
Write Enable 1
I
I
WENA2/LDA
WENB2/LDB
Write Enable 2/
Load
I
Q
A0
-Q
A8
Q
B0
-Q
B8
RCLKA
RCLKB
RENA1
RENB1
RENA2
RENB2
OEA
EFA
EFB
PAEA
PAEB
PAFA
PAFB
FFA
FFB
V
CC
GND
A Data Outputs
B Data Outputs
Read Clock
Read Enable 1
Read Enable 2
Output Enable
Empty Flag
Programmable
Almost-Empty Flag
Programmable
Almost-Full Flag
Full Flag
Power
Ground
O 9-bit data outputs from RAM array A.
O 9-bit data outputs from RAM array B.
I
I
I
I
Data is read from FIFO A (B) on a LOW-to-HIGH transition of RCLKA (RCLKB) when
RENA1(RENB1)
and
RENA2
(RENB2) are asserted.
When
RENA1
(RENB1) and
RENA2
(RENB2) are LOW, data is read from FIFO A (B) on every LOW-to-HIGH
transition of RCLKA (RCLKB). Data will not be read from Array A (B) if
EFA
(EFB) is LOW.
When
RENA1
(RENB1) and
RENA2
(RENB2) are LOW, data is read from the FIFO A (B) on every LOW-to-
HIGH transition of RCLKA (RCLKB). Data will not be read from array A (B) if the
EFA
(EFB) is LOW.
When
OEA
(OEB) is LOW, outputs D
A0
-D
A8
(D
B0
-D
B8
) are active. If
OEA
(OEB) is HIGH, the
OEB
outputs D
A0
-
D
A8
(D
B0
-D
B8
) will be in a high-impedance state.
O When
EFA
(EFB) is LOW, FIFO A (B) is empty and further data reads from the output are inhibited. When
EFA
(EFB) is HIGH, FIFO A (B) is not empty.
EFA
(EFB) is synchronized to RCLKA (RCLKB).
O When
PAEA
(PAEB) is LOW, FIFO A (B) is Almost-Empty based on the offset programmed into the appropriate
offset register. The default offset at reset is Empty+7.
PAEA
(PAEB) is synchronized to RCLKA (RCLKB).
O When
PAFA
(PAFB) is LOW, FIFO A (B) is Almost-Full based on the offset programmed into the appropriate offset
register. The default offset at reset is Full-7.
PAFA
(PAFB) is synchronized to WCLKA (WCLKB).
O When
FFA
(FFB) is LOW, FIFO A (B) is full and further data writes into the input are inhibited. When
FFA
(FFB) is
HIGH, FIFO A (B) is not full.
FFA
(FFB) is synchronized to WCLKA (WCLKB).
+3.3V power supply pin.
0V ground pin.
3
IDT72V801/72V8211/72V821/72V831/72V841/72V851 3.3V DUAL CMOS SyncFIFO
TM
DUAL 256 x 9, DUAL 512 x 9, DUAL 1K x 9, DUAL 2K x 9, DUAL 4K x 9, DUAL 8K x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
ABSOLUTE MAXIMUM RATINGS
Symbol
V
TERM
T
STG
I
OUT
Rating
Terminal Voltage with
Respect to GND
Storage Temperature
DC Output Current
Commercial
–0.5 to +5
–55 to +125
–50 to +50
Unit
V
°C
mA
RECOMMENDED OPERATING
CONDITIONS
Symbol
V
CC
GND
V
IH
V
IL
T
A
T
A
Parameter
Supply Voltage(Com’l & Ind’l)
Supply Voltage(Com’l & Ind’l)
Input High Voltage
(Com’l & Ind’l)
Input Low Voltage
(Com’l & Ind’l)
Operating Temperature
Commercial
Operating Temperature
Industrial
Min
3.0
0
2.0
—
0
-40
Typ.
3.3
0
—
—
—
⎯
Max
3.6
—
5.0
0.8
70
85
Unit
V
V
V
V
°C
°C
NOTE:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of the specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
DC ELECTRICAL CHARACTERISTICS
(Commercial: V
CC
= 3.3V ± 0.3V, T
A
= 0°C to +70°C; Industrial :V
CC
= 3.3V ± 0.3V, TA = -40°C to +85°C)
IDT72V801
IDT72V811
IDT72V821
IDT72V831
IDT72V841
IDT72V851
Commercial and Industrial
(1)
t
CLK
= 10, 15, 20 ns
Typ.
—
—
—
—
—
—
Symbol
I
LI
(2)
I
LO
(3)
V
OH
V
OL
I
CC1
(4,5,6)
I
CC2
(3,7)
Parameter
Input Leakage Current (Any Input)
Output Leakage Current
Output Logic “1” Voltage, I
OH
= –2 mA
Output Logic “0” Voltage, I
OL
= 8 mA
Active Power Supply Current (both FIFOs)
Standby Current
Min.
–1
–10
2.4
—
—
—
Max.
–1
10
—
0.4
40
10
Unit
μA
μA
V
V
mA
mA
NOTES:
1. Industrial temperature range product for the 15ns speed grade is available as a standard device.
2. Measurements with 0.4
≤
V
IN
≤
V
CC
.
3. OEA, OEB
≥
V
IH,
0.4
≤
V
OUT
≤
V
CC
.
4. Tested with outputs disabled (I
OUT
= 0).
5. RCLK and WCLK toggle at 20 MHz and data inputs switch at 10 MHz.
6. Typical I
CC1
= 2[0.17 + 0.48*f
S
+ 0.02*C
L
*f
S
] (in mA).
These equations are valid under the following conditions:
V
CC
= 3.3V, T
A
= 25°C, f
S
= WCLK frequency = RCLK frequency (in MHz, using TTL levels), data switching at f
S
/2, C
L
= capacitive load (in pF).
7. All Inputs = V
CC
- 0.2V or GND + 0.2V, except RCLK and WCLK, which toggle at 20 MHz.
CAPACITANCE
(T
A
= +25°C, f = 1.0MHz)
Symbol
C
IN
(2)
Parameter
Input Capacitance
Output Capacitance
Conditions
V
IN
= 0V
V
OUT
= 0V
Max.
10
10
Unit
pF
pF
C
OUT
(1,2)
NOTE:
1. With output deselected (OEA,
OEB
≥
V
IH
).
2. Characterized values, not currently tested.
4
IDT72V801/72V8211/72V821/72V831/72V841/72V851 3.3V DUAL CMOS SyncFIFO
TM
DUAL 256 x 9, DUAL 512 x 9, DUAL 1K x 9, DUAL 2K x 9, DUAL 4K x 9, DUAL 8K x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
AC ELECTRICAL CHARACTERISTICS
(1)
(Commercial: V
CC
= 3.3V ± 0.3V, T
A
= 0°C to +70°C; Industrial: V
CC =
3.3V± 0.3V, TA = -40°C to +85°C)
Commercial
IDT72V801L10
IDT72V811L10
IDT72V821L10
IDT72V831L10
IDT72V841L10
IDT72V851L10
Symbol
f
S
t
A
t
CLK
t
CLKH
t
CLKL
t
DS
t
DH
t
ENS
t
ENH
t
RS
t
RSS
t
RSR
t
RSF
t
OLZ
t
OE
t
OHZ
t
WFF
t
REF
t
PAF
t
PAE
t
SKEW1
t
SKEW2
Clock Cycle Frequency
Data Access Time
Clock Cycle Time
Clock High Time
Clock Low Time
Data Set-up Time
Data Hold Time
Enable Set-up Time
Enable Hold Time
Reset Pulse Width
(2)
Reset Set-up Time
Reset Recovery Time
Reset to Flag Time and Output Time
Output Enable to Output in Low-Z
(3)
Output Enable to Output Valid
Output Enable to Output in High-Z
(3)
Write Clock to Full Flag
Read Clock to Empty Flag
Write Clock to Programmable Almost-Full Flag
Read Clock to Programmable Almost-Empty Flag
Skew Time Between Read Clock and Write Clock
for Empty Flag and Full Flag
Skew Time Between Read Clock and Write Clock for
Programmable Almost-Empty Flag and Programmable
Almost-Full Flag
Parameter
Min.
—
2
10
4.5
4.5
3
0.5
3
0.5
10
8
8
—
0
3
3
—
—
—
—
5
14
Max.
100
6.5
—
—
—
—
—
—
—
—
—
—
10
—
6
6
6.5
6.5
6.5
6.5
—
—
Com’l & Ind’l
IDT72V801L15
IDT72V811L15
IDT72V821L15
IDT72V831L15
IDT72V841L15
IDT72V851L15
Min.
—
2
15
(1)
6
6
4
1
4
1
15
10
10
—
0
3
3
—
—
—
—
6
18
Max.
66.7
10
—
—
—
—
—
—
—
—
—
—
15
—
8
8
10
10
10
10
—
—
Commercial
IDT72V801L20
IDT72V811L20
IDT72V821L20
IDT72V831L20
IDT72V841L20
IDT72V851L20
Min.
—
2
20
8
8
5
1
5
1
20
12
12
—
0
3
3
—
—
—
—
8
20
Max.
50
12
—
—
—
—
—
—
—
—
—
—
20
—
10
10
12
12
12
12
—
—
Unit
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
NOTES:
1. Industrial temperature range product for the 15ns speed grade is available as a standard device.
2. Pulse widths less than minimum values are not allowed.
3. Values guaranteed by design, not currently tested.
3.3V
330Ω
D.U.T.
AC TEST CONDITIONS
In Pulse Levels
Input Rise/Fall Times
Input Timing Reference Levels
Output Reference Levels
Output Load
GND to 3.0V
3ns
1.5V
1.5V
See Figure 1
510Ω
30pF*
4093 drw 03
or equivalent circuit
Figure 1. Output Load
*Includes jig and scope capacitances.
5
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
