NSR20F20
Schottky Barrier Diode
These Schottky barrier diodes are optimized for low forward
voltage drop and low leakage current and are offered in a Chip Scale
Package (CSP) to reduce board space. The low thermal resistance
enables designers to meet the challenging task of achieving higher
efficiency and meeting reduced space requirements.
Features
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•
•
•
•
•
Low Forward Voltage Drop − 450 mV @ 2.0 A
Low Reverse Current − 30
mA
@ 10 V VR
2.0 A of Continuous Forward Current
Power Dissipation of 665 mW with Minimum Trace
ESD Rating − Human Body Model: Class 3B
ESD Rating
− Machine Model: Class C
•
High Switching Speed
•
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
20 V SCHOTTKY
BARRIER DIODE
1
CATHODE
2
ANODE
2
MARKING
DIAGRAM
PIN 1
1
•
•
•
•
•
•
•
•
•
•
LCD and Keypad Backlighting
Camera Photo Flash
Buck and Boost dc−dc Converters
Reverse Voltage and Current Protection
Clamping & Protection
DSN2
(0603)
CASE 152AB
20F20
YYY
20F20
YYY
= Specific Device Code
= Year Code
Markets
Mobile Handsets
MP3 Players
Digital Camera and Camcorders
Notebook PCs & PDAs
GPS
ORDERING INFORMATION
Device
NSR20F20NXT5G
Package
Shipping†
DSN2
5000 / Tape & Reel
(Pb−Free)
MAXIMUM RATINGS
Rating
Reverse Voltage
Forward Current (DC)
Forward Surge Current (60 Hz @ 1 cycle)
Repetitive Peak Forward Current
(Pulse Wave = 1 sec, Duty Cycle = 66%)
ESD Rating:
Human Body Model
Machine Model
Symbol
V
R
I
F
I
FSM
I
FRM
ESD
Value
20
2.0
28
4.0
>8
> 400
Unit
V
A
A
A
kV
V
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
©
Semiconductor Components Industries, LLC, 2016
1
April, 2016 − Rev. 3
Publication Order Number:
NSR20F20/D
NSR20F20
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance
Junction−to−Ambient (Note 1)
Total Power Dissipation @ T
A
= 25°C
Thermal Resistance
Junction−to−Ambient (Note 2)
Total Power Dissipation @ T
A
= 25°C
Storage Temperature Range
Junction Temperature
Symbol
R
qJA
P
D
R
qJA
P
D
T
stg
T
J
Min
Typ
Max
213
586
80
1.56
−40 to +125
+150
Unit
°C/W
mW
°C/W
W
°C
°C
1. Mounted onto a 4 in square FR−4 board 50 mm sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state.
2. Mounted onto a 4 in square FR−4 board 1 in sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state.
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
Characteristic
Reverse Leakage
(V
R
= 10 V)
(V
R
= 20 V)
Forward Voltage
(I
F
= 1.0 A)
(I
F
= 2.0 A)
Reverse Recovery Time
(I
F
= I
R
= 10 mA, I
R(REC)
= 1.0 mA, Figure 4)
Symbol
I
R
30
150
V
F
0.390
0.450
t
rr
80
0.420
0.470
ns
V
Min
Typ
Max
Unit
mA
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2
NSR20F20
PACKAGE DIMENSIONS
DSN2, 1.6x0.8, 0.9P, (0603)
CASE 152AB
ISSUE B
0.05 C
D
A B
E
0.05 C
TOP VIEW
0.05 C
A
0.05 C
A1
SIDE VIEW
0.05 C A B
L
L/2
b
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
DIM
A
A1
b
D
E
L
L2
L3
MILLIMETERS
MIN
MAX
0.25
0.31
−−−
0.05
0.55
0.65
1.60 BSC
0.80 BSC
1.45
1.55
0.90
1.00
0.25
0.35
CATHODE BAND MONTH CODING
DEC
SEP
JUN
MAR
FEB
JAN
0.05 C A B
L2
NOV OCT
XXXX
YYY
XXXX
Y09
DEVICE CODE
YEAR CODE
1
L3
BOTTOM VIEW
(EXAMPLE)
MOUNTING FOOTPRINT*
1.70
0.52
PIN 1
0.70
1.05
DIMENSIONS: MILLIMETERS
INDICATES AUG 2009
0.80
See Application Note AND8464/D for more mounting details
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
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Sales Representative
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4
NSR20F20/D