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74LCX760MTCX

产品描述Multilayer Ceramic Capacitors MLCC - SMD/SMT 6.3volts 47uF 20% X5R
产品类别逻辑    逻辑   
文件大小235KB,共13页
制造商Fairchild
官网地址http://www.fairchildsemi.com/
标准
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74LCX760MTCX概述

Multilayer Ceramic Capacitors MLCC - SMD/SMT 6.3volts 47uF 20% X5R

74LCX760MTCX规格参数

参数名称属性值
Brand NameFairchild Semiconductor
是否无铅不含铅
是否Rohs认证符合
厂商名称Fairchild
零件包装代码TSSOP
包装说明TSSOP, TSSOP20,.25
针数20
制造商包装代码20LD, TSSOP, JEDEC MO-153, 4.4MM WIDE
Reach Compliance Codecompliant
ECCN代码EAR99
控制类型ENABLE LOW
系列LVC/LCX/Z
JESD-30 代码R-PDSO-G20
JESD-609代码e4
长度6.5 mm
逻辑集成电路类型BUS DRIVER
最大I(ol)0.024 A
湿度敏感等级1
位数8
功能数量1
端口数量2
端子数量20
最高工作温度85 °C
最低工作温度-40 °C
输出特性OPEN-DRAIN
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装等效代码TSSOP20,.25
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法TAPE AND REEL
峰值回流温度(摄氏度)260
电源3.3 V
Prop。Delay @ Nom-Sup8 ns
传播延迟(tpd)10 ns
认证状态Not Qualified
座面最大高度1.2 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度4.4 mm
Base Number Matches1

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Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers
will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor
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device numbers. The most current and up-to-date ordering information can be found at
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Please
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74LCX760MTCX相似产品对比

74LCX760MTCX 74LCX760MSA 74LCX760MTC 74LCX760WMX
描述 Multilayer Ceramic Capacitors MLCC - SMD/SMT 6.3volts 47uF 20% X5R Buffers u0026 Line Drivers Buffer/Line Driver 5V Open Drain Buffers u0026 Line Drivers Buffer/Line Driver LV Open Drain
Brand Name Fairchild Semiconductor Fairchild Semiconductor Fairchild Semiconductor Fairchild Semiconductor
是否无铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合
厂商名称 Fairchild Fairchild Fairchild Fairchild
零件包装代码 TSSOP SSOP TSSOP SOIC
包装说明 TSSOP, TSSOP20,.25 SSOP, SSOP20,.3 TSSOP, TSSOP20,.25 SOP, SOP20,.4
针数 20 20 20 20
制造商包装代码 20LD, TSSOP, JEDEC MO-153, 4.4MM WIDE 20LD, SSOP, JEDEC MO-150, 5.3MM WIDE 20LD, TSSOP, JEDEC MO-153, 4.4MM WIDE 20LD, SOIC, JEDEC MS013, .300\", WIDE BODY
Reach Compliance Code compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99
控制类型 ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW
系列 LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 代码 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20
JESD-609代码 e4 e3 e4 e3
长度 6.5 mm 7.2 mm 6.5 mm 12.8 mm
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
最大I(ol) 0.024 A 0.024 A 0.024 A 0.024 A
湿度敏感等级 1 1 1 1
位数 8 8 8 8
功能数量 1 1 1 1
端口数量 2 2 2 2
端子数量 20 20 20 20
最高工作温度 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C
输出特性 OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN
输出极性 TRUE TRUE TRUE TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP SSOP TSSOP SOP
封装等效代码 TSSOP20,.25 SSOP20,.3 TSSOP20,.25 SOP20,.4
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
包装方法 TAPE AND REEL RAIL RAIL TAPE AND REEL
峰值回流温度(摄氏度) 260 260 260 260
电源 3.3 V 3.3 V 3.3 V 3.3 V
Prop。Delay @ Nom-Sup 8 ns 8 ns 8 ns 8 ns
传播延迟(tpd) 10 ns 10 ns 10 ns 10 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 2.05 mm 1.2 mm 2.65 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2 V 2 V 2 V 2 V
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Nickel/Palladium/Gold (Ni/Pd/Au) Matte Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au) Matte Tin (Sn)
端子形式 GULL WING GULL WING GULL WING GULL WING
端子节距 0.65 mm 0.65 mm 0.65 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 30
宽度 4.4 mm 5.3 mm 4.4 mm 7.5 mm
Base Number Matches 1 1 1 1
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