Caution 1) Absolute maximum ratings represent the values which cannot be exceeded for any length of time.
Caution 2) Even when the device is used within the range of absolute maximum ratings, as a result of continuous usage
under high temperature, high current, high voltage, or drastic temperature change, the reliability of the IC
may be degraded. Please contact us for the further details.
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed,
damage may occur and reliability may be affected.
ORDERING INFORMATION
See detailed ordering and shipping information on page 15 of this data sheet.
Semiconductor Components Industries, LLC, 2014
July, 2014
71514NK 20140704-S00001/D1113HK No.A2254-1/15
LV8716QA
Recommended Operating Conditions
at Ta = 25°C
Parameter
Motor supply voltage range
Logic input voltage
Symbol
VM
VIN
Conditions
VM1,VM2
PS,IN1,IN2,IN3,IN4
Ratings
2.7 to 10.5
0 to 5.5
Unit
V
V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended
Operating Ranges limits may affect device reliability.
Electrical Characteristics
at Ta
=
25°C, VM = 7.2V
Parameter
Standby mode current
Supply Current
VM low voltage cutting
threshold voltage
Low voltage hysteresis voltage
Thermal shutdown temperature
Thermal hysteresis width
Output on resistance
Output leakage current
Diode forward voltage
Logic high-level input voltage
Logic low-level input voltage
PS pin input current
Logic pin input current
(IN1,IN2,IN3,IN4)
Chopping cycle
Current detection reference
voltage
Output current
detection current
Symbol
IMstn
IM
Vthvm
Vthhis
TSD
∆TSD
Ronu
Rond
Ioleak
VD
Vinh
Vinl
IinL
IinH
IinL
IinH
Tchop
Vref
Ircs
Conditions
PS=”L”, I(VM1)+I(VM2)
PS=”H”, IN1=IN3=”H”, No load
I(VM1)+I(VM2)
2.3
100
150
min
Ratings
typ
0
1.4
2.45
200
180
40
0.65
0.35
1
2.0
0
5
35
5
23
12
0.194
115
max
500
1.82
2.6
300
200
0.85
0.45
20
1.2
5.5
0.8
11
65
11
43
20
0.206
135
Unit
nA
mA
V
mV
°C
°C
Ω
Ω
μA
V
V
V
μA
μA
μA
μA
μs
V
μA
Design guarantee
Design guarantee
Io=1A,Source-side
Io=1A,Sink-side
ID=−1A
PS,IN1,IN2,IN3,IN4
VIN=0.8V
VIN=3.3V
VIN=0.8V
VIN=3.3V
8
50
8
33
16
0.2
125
Io=0.5A, RCS=0V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be
indicated by the Electrical Characteristics if operated under different conditions.
No.A2254-2/15
LV8716QA
Package Dimensions
unit : mm
QFN16 3x3, 0.5P
CASE 485G-01
ISSUE F
D
PIN 1
LOCATION
A
B
L1
L
L
DETAIL A
E
2X
2X
ALTERNATE TERMINAL
CONSTRUCTIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MILLIMETERS
MIN
NOM MAX
0.80
0.90
1.00
0.00
0.03
0.05
0.20 REF
0.18
0.24
0.30
3.00 BSC
1.65
1.75
1.85
3.00 BSC
1.65
1.75
1.85
0.50 BSC
0.18 TYP
0.30
0.40
0.50
0.00
0.08
0.15
0.10 C
0.10 C
0.05 C
0.05 C
TOP VIEW
DETAIL B
EXPOSED Cu
MOLD CMPD
A3
(A3)
DETAIL B
A
A1
A1
ALTERNATE
CONSTRUCTIONS
NOTE 4
SIDE VIEW
C
SEATING
PLANE
GENERIC
MARKING DIAGRAM*
XXXXX
XXXXX
ALYW
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
XXXXX
A
L
Y
W
0.10 C A B
16X
L
DETAIL A
D2
8
4
9
E2
16X
K
1
16
16X
e
e/2
BOTTOM VIEW
b
0.10 C A B
0.05 C
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
16X
0.58
1
1.84 3.30
16X
2X
2X
0.30
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
No.A2254-3/15
LV8716QA
*1: With components mounted on the exposed die-pad board
Two-layer circuit board *1
No.A2254-4/15
LV8716QA
Substrate Specifications
(Substrate recommended for operation of LV8716QA)
Size
: 90mm × 90mm × 1.6mm (two-layer substrate )
Material
: Glass epoxy
Copper wiring density
: L1 = 85%, L2 = 90%
L1: Copper wiring pattern diagram
L2: Copper wiring pattern diagram
Cautions
1) The data for the case with the Exposed Die-Pad substrate mounted shows the values when 90% or more
of the Exposed Die-Pad is wet.
2) For the set design, employ the derating design with sufficient margin.
Stresses to be derated include the voltage, current, junction temperature, power loss, and mechanical
stresses such as vibration, impact, and tension.
Accordingly, the design must ensure these stresses to be as low or small as possible.
The guideline for ordinary derating is shown below:
(1) Maximum value 80% or less for the voltage rating
(2) Maximum value 80% or less for the current rating
(3) Maximum value 80% or less for the temperature rating
3) After the set design, be sure to verify the design with the actual product.
Confirm the solder joint state and verify also the reliability of solder joint for the Exposed Die-Pad, etc.
Any void or deterioration, if observed in the solder joint of these parts, causes deteriorated thermal
conduction, possibly resulting in thermal destruction of IC.
目前医疗监护中无法动态掌握患者信息，一旦患者病情恶化，无法在第一时间实施抢救，对数据信息维护效率低。 文中首先阐述了蓝牙技术及其在医疗监护中应用的可行性，然后设计了系统框架，给出了具体功能，BlueTooth Wireless Communication Technology Application in Medical Monitoring包括数据采集和语音报警，最后对蓝牙信号在传输...[详细]
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