Output Current (sink) by Any I/O Pin..................................25mA
Output Current (source) by Any I/O Pin ............................-25mA
Operating Temperature Range ........................... -20°C to +85°C
Storage Temperature Range ............................ -65°C to +150°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Information
100 WLP
Package Code
Outline Number
Land Pattern Number
Thermal Resistance, Single-Layer Board
Junction-to-Ambient (θ
JA
)
Junction-to-Case Thermal Resistance (θ
JC
)
Thermal Resistance, Four-Layer Board
Junction-to-Ambient (θ
JA
)
Junction-to-Case Thermal Resistance (θ
JC
)
38.9°C/W
N/A
N/A
N/A
W1004D4+1
21-0452
Refer to Application Note 1891
For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages.
Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
www.maximintegrated.com
Maxim Integrated
│
3
MAX32630/MAX32631
Ultra-Low Power, High-Performance
Cortex-M4F Microcontroller for Wearables
Electrical Characteristics
(Limits are 100% tested at T
A
= +25°C and T
A
= +85°C. Limits over the operating temperature range and relevant supply voltage
range are guaranteed by design and characterization. Specifications marked GBD are guaranteed by design and not production tested.
Specifications to -20°C are guaranteed by design and are not production tested.)
PARAMETER
SYMBOL
V
DD18
V
DD12
Supply Voltage
V
DDA
V
RTC
V
DDIO
V
DDIOH
Power Fail Reset
Voltage
Power-On Reset
Voltage
RAM Data Retention
Voltage
V
DD12
Dynamic
Current, LP3 Mode
V
RST
V
POR
V
DRV
Measured on the V
DD12
pin and execut-
ing code from cache memory, all inputs
are tied to V
SS
or V
DD18
, outputs do not
source/sink any current, PMU disabled
Measured on the V
DD12
pin and execut-
ing code from cache memory, all inputs
are tied to V
SS
or V
DD18
, outputs do not
source/sink any current, 96MHz oscillator
selected as system clock
Measured on the V
DD12
pin and execut-
ing code from cache memory, all inputs
are tied to V
SS
or V
DD18
, outputs do not
source/sink any current, 4MHz oscillator
selected as system clock
Measured on the V
DD18
+ V
DDA
device
pins and executing code from cache mem-
ory, all inputs are tied to V
SS
or V
DD18
,
outputs do not source/sink any current,
96MHz oscillator selected as system clock
Measured on the V
DD18
+ V
DDA
device
pins and executing code from cache mem-
ory, all inputs are tied to V
SS
or V
DD18
,
outputs do not source/sink any current,
4MHz oscillator selected as system clock
Measured on the V
DD12
pin, ARM in sleep
mode, PMU with two channels active
V
DDIOH
must be ≥ V
DDIO
Monitors V
DD18
Monitors V
DD18
CONDITIONS
MIN
1.71
1.14
1.71
1.75
1.71
1.71
1.62
1.5
0.93
TYP
1.8
1.2
1.8
1.8
1.8
1.8
MAX
1.89
1.26
1.89
1.89
3.6
3.6
1.7
V
V
V
V
UNITS
I
DD12_DLP3
106
μA/MHz
173
μA
72
V
DD12
Fixed Current,
LP3 Mode
I
DD12_FLP3
366
μA
33
V
DD18
Fixed Current,
LP3 Mode
I
DD18_FLP3
V
DD12
Dynamic
Current, LP2 Mode
I
DD12_DLP2
27
μA/MHz
www.maximintegrated.com
Maxim Integrated
│
4
MAX32630/MAX32631
Ultra-Low Power, High-Performance
Cortex-M4F Microcontroller for Wearables
Electrical Characteristics (continued)
(Limits are 100% tested at T
A
= +25°C and T
A
= +85°C. Limits over the operating temperature range and relevant supply voltage
range are guaranteed by design and characterization. Specifications marked GBD are guaranteed by design and not production tested.
Specifications to -20°C are guaranteed by design and are not production tested.)
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