OM
PL
IA
N
T
Features
n
Subminiature in SMT
n
7.5 mm seated height
•
SM
BO
C112 -L
UR
5 P
US -50
NS
01
Applications
n
Modems (V32)
n
Laptop Computers
n
Telecommunications
n
Instrumentation
*R
oH
S
C
n
Distortion of only 0.015 %
n
Vacuum encapsulated
n
UL60950 certified
n
RoHS compliant*
LE
AD
F
RE
E
SM-LP-5001 Series - Surface Mount Line Matching Transformers
Product Dimensions
How To Order
Model
1.0
(.039)
7.5
(.295)
Nominal Impedance.......................... 600
Ω
Turns Ratio ............................................1:1
Insertion Loss ............2.0 dB max. at 2 kHz
Frequency Response
....................... ±0.25 dB max. 200-4 kHz
Return Loss ............ 24 dB min. 200-4 kHz*
Balance......................................80 dB min.
Distortion .................................-76 dB max.
@ 600 Hz, -10 dBm
Dielectric Strength ...2000 VRMS for 1 min.
Insulation Resistance ..... 100 MΩ @ 500 V
DC Resistance**
Primary............................... 115
Ω
±15 %
Secondary .......................... 115
Ω
±15 %
Shunt Inductance........................3.8 H min.
Shunt Loss.............................. 7500
Ω
min.
Leakage Inductance.......6 mH typ. @ 1 kHz
Power Level ....................................10 dBm
Operating Temperature.....-20 °C to +85 °C
Storage Temperature ........-40 °C to +85 °C
Materials
Electrical Specifications
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
12.8
(.504)
SM-LP-5001 __
0.3
(.012)
Packaging
Blank = Packaged in tubes
E = Tape and reel (400 pcs. per reel)
2.54
(.100)
1
2
3
1.0 +0.25/-0.0
(.039 +.010/-0.0)
2.0
(.079)
6
5
4
0.6 ± 0.2
(.023 ± .008)
9.0
(.354)
Schematic
1
6
2
5
3
4
Suggested PCB Layout
15.0
(.591)
2.54
(.100)
3.0
(.118)
1.5
(.059)
Terminal Plating ...........................Sn/Ag/Cu
*For use with recommended circuit
(BS6305 impedance Class A non-speech
or Class B speech).
**SM-LP-5001 is symmetrical, meaning
there is no real primary nor secondary
winding.
DIMENSIONS:
MM
(INCHES)
0.15
MAX.
(.006)
LEAD COPLANARITY:
UNLESS OTHERWISE ±0.25
MAX.
SPECIFIED, TOLERANCE: (.010)
Solder Profile
240
235
PEAK TEMPERATURE
30 SEC.
Temperature (°C)
217
200
60 SEC.
150
120 SEC.
Time (Seconds)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SM-LP-5001 Series - Surface Mount Line Matching Transformers
Packaging Specifications
11.50 ± 0.1
(.453 ± .004)
1.75 ± 0.1
(.069 ± .004)
2.0 ± 0.1
(.079 ± .004)
4.0 ± 0.1
(.157 ± .004)
DIA. MIN.
1.5 +0.1/-0.0
(.059 +.004/-0)
0.5 ± 0.05
(.020 ± .002)
START
16.0 ± 0.1
(.630 ± .004)
END
14.95 ± 0.1
(.589 ± .004)
24.00 +0.3/-0.1
(.945 +.012/-.004)
7.5 ± 0.1
(.295 ± .004)
7.9 ± 0.1
(.311 ± .004)
6.92
(.272)
DIA. MIN.
2.0 +0.1/-0.0
(.079 +.004/-0)
USER DIRECTION OF FEED
9.5 ± 0.1
(.374 ± .004)
QUANTITY: 400 PCS. PER REEL
MM
(INCHES)
DIMENSIONS:
REV. 05/17
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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