1,048,576-word x 40-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE
MSC23140D | MSC23140D-60DS10 | MSC23140D-60BS10 | MSC23140D-70BS10 | MSC23140D-XXBS10 | MSC23140D-XXDS10 | MSC23140D-70DS10 | |
---|---|---|---|---|---|---|---|
描述 | 1,048,576-word x 40-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE | 1,048,576-word x 40-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE | 1,048,576-word x 40-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE | 1,048,576-word x 40-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE | 1,048,576-word x 40-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE | 1,048,576-word x 40-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE | 1,048,576-word x 40-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE |
零件包装代码 | - | MODULE | MODULE | MODULE | - | - | MODULE |
针数 | - | 72 | 72 | 72 | - | - | 72 |
Reach Compliance Code | - | unknow | unknow | unknow | - | - | unknow |
ECCN代码 | - | EAR99 | EAR99 | EAR99 | - | - | EAR99 |
访问模式 | - | FAST PAGE | FAST PAGE | FAST PAGE | - | - | FAST PAGE |
最长访问时间 | - | 60 ns | 60 ns | 70 ns | - | - | 70 ns |
JESD-30 代码 | - | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | - | - | R-XSMA-N72 |
内存密度 | - | 41943040 bi | 41943040 bi | 41943040 bi | - | - | 41943040 bi |
内存集成电路类型 | - | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | - | - | FAST PAGE DRAM MODULE |
内存宽度 | - | 40 | 40 | 40 | - | - | 40 |
功能数量 | - | 1 | 1 | 1 | - | - | 1 |
端口数量 | - | 1 | 1 | 1 | - | - | 1 |
端子数量 | - | 72 | 72 | 72 | - | - | 72 |
字数 | - | 1048576 words | 1048576 words | 1048576 words | - | - | 1048576 words |
字数代码 | - | 1000000 | 1000000 | 1000000 | - | - | 1000000 |
工作模式 | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | - | ASYNCHRONOUS |
最高工作温度 | - | 70 °C | 70 °C | 70 °C | - | - | 70 °C |
组织 | - | 1MX40 | 1MX40 | 1MX40 | - | - | 1MX40 |
封装主体材料 | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | - | - | UNSPECIFIED |
封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR |
封装形式 | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | - | - | MICROELECTRONIC ASSEMBLY |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified |
最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | - | - | 5.5 V |
最小供电电压 (Vsup) | - | 4.5 V | 4.5 V | 4.5 V | - | - | 4.5 V |
标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | - | - | 5 V |
表面贴装 | - | NO | NO | NO | - | - | NO |
技术 | - | CMOS | CMOS | CMOS | - | - | CMOS |
温度等级 | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | - | COMMERCIAL |
端子形式 | - | NO LEAD | NO LEAD | NO LEAD | - | - | NO LEAD |
端子位置 | - | SINGLE | SINGLE | SINGLE | - | - | SINGLE |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved