Operating Temperature Range ........................ -55°C to +125°C
Storage Temperature Range ............................ -55°C to +125°C
Lead Temperature (soldering, 10s) ................................. +300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 1)
TDFN
Junction-to-Ambient Thermal Resistance (B
JA
).......... 41NC/W
Junction-to-Case Thermal Resistance (B
JC
) ................ 8NC/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Recommended Operating Conditions
(T
A
= -55°C to +125°C, unless otherwise noted.) (Note 2)
PARAMETER
Voltage Supply
Input Logic 0
Input Logic 1
SYMBOL
V
DD
V
IL
V
IH
(Note 3)
(Note 3)
(Note 3)
CONDITIONS
MIN
2.2
-0.5
0.7V
DD
TYP
MAX
5.5
0.3 x
V
DD
V
DD
+
0.5
UNITS
V
V
V
Electrical Characteristics
PARAMETER
Standby Current
Timekeeping Current
I
2
C Communication
Thermometer Current
Active Current
Logic 0 Output
(SDA, ALRM, OSC)
Input Current, Each I/O Pin
Thermometer Error
Resolution
(2.2V ≤ V
DD
≤ 5.5V, T
A
= -55°C to +125°C, unless otherwise noted.)
SYMBOL
I
DDS
I
DDC
I
DD2
I
DDT
I
DD
V
OL
CONDITIONS
V
DD
= 2.2V (Note 4)
V
DD
= 5.0V (Note 4)
V
DD
= 2.2V (Note 5)
V
DD
= 5.0V (Note 5)
V
DD
= 2.2V (Note 5)
V
DD
= 5.0V (Note 5)
V
DD
= 2.2V (Note 5)
V
DD
= 5.0V (Note 5)
V
DD
= 2.2V (Note 5)
V
DD
= 5.0V (Note 5)
(Note 6)
0.4V < V
I/O
< 0.9 V
DD
T
ERR
-10°C to +85°C, 2.7V < V
DD
< 5.5V
4 sigma, 2.7V < V
DD
< 5.5V
9
0
-10
MIN
TYP
MAX
0.1
0.2
0.8
1
100
150
1100
1100
1100
1200
0.4
+10
±2
±3
12
UNITS
µA
µA
µA
µA
µA
V
µA
°C
Bits
www.maximintegrated.com
Maxim Integrated
│
2
MAX31629
I
2
C Digital Thermometer and Real-Time Clock
Electrical Characteristics (continued)
(2.2V ≤ V
DD
≤ 5.5V, T
A
= -55°C to +125°C, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
9 bits, 2.7V < V
DD
< 5.5V
Conversion Time
t
CONVT
10 bits, 2.7V < V
DD
< 5.5V
11 bits, 2.7V < V
DD
< 5.5V
12 bits, 2.7V < V
DD
< 5.5V
Crystal Capacitance
ESR
C
C
(Note 7)
12.5
50
MIN
TYP
MAX
25
50
100
200
pF
kΩ
ms
UNITS
Nonvolatile Memory (EEPROM) Characteristics
((2.7V ≤ V
DD
≤ 5.5V, T
A
= -55°C to +125°C, unless otherwise noted.)
PARAMETER
EEPROM Write Cycle Time
EEPROM Writes
EEPROM Data Retention
SYMBOL
t
WR
N
EEWR
t
EEDR
-55°C to +55°C
-55°C to +55°C
50,000
10
CONDITIONS
MIN
TYP
MAX
20
UNITS
ms
Writes
Years
I
2
C AC Electrical Characteristics
(2.2V ≤ V
DD
≤ 5.5V, T
A
= -55°C to +125°C, timing referenced to V
IL(MAX)
and V
IH(MAX)
, unless otherwise noted.) (Note 2) (Figure 1)
PARAMETER
Serial-Clock Frequency
Bus Free Time Between STOP
and START Condition
Repeated START Condition
Setup Time
START Condition Setup Time
START Condition Hold Time
STOP Condition Setup Time
Clock Low Period
Clock High Period
Data-In Hold Time
t
HD:STA
t
SU:STO
t
LOW
t
HIGH
t
HD:DAT
SYMBOL
f
CLK
t
BUF
t
SU:STA
90% of SCL to 90% of SDA, f
CLK
= 400kHz
90% of SDA to 90% of SCL, f
CLK
= 400kHz
90% of SCL to 90% of SDA, f
CLK
= 400kHz
10% to 10%
90% to 90%
(Note 9)
f
CLK
= 400kHz
1.3
0.6
0.6
0.6
0.6
1
1
0
0.9
CONDITIONS
MIN
TYP
MAX
400
UNITS
kHz
µs
µs
µs
µs
µs
µs
µs
µs
www.maximintegrated.com
Maxim Integrated
│
3
MAX31629
I
2
C Digital Thermometer and Real-Time Clock
I
2
C AC Electrical Characteristics (continued)
(2.2V ≤ V
DD
≤ 5.5V, T
A
= -55°C to +125°C, timing referenced to V
IL(MAX)
and V
IH(MAX)
, unless otherwise noted.) (Note 2) (Figure 1)
PARAMETER
Data-In Setup Time
Input Capacitance
Capacitance Load for Each Bus
Line
SYMBOL
t
SU:DAT
C
I
C
B
(Note 10)
CONDITIONS
MIN
100
5
300
TYP
MAX
UNITS
ns
pF
pF
Note 2:
Limits are 100% production tested at T
A
= +25°C and/or T
A
= +85°C. Limits over the operating temperature range and
relevant supply voltage range are guaranteed by design and characterization. Typical values are not guaranteed.
Note 3:
All voltages referenced to ground.
Note 4:
Standby current specified with temperature conversions and clock oscillator/buffer shut down, ALRM pin open, and SDA,
SCL = V
DD
, 0°C to +70°C.
Note 5:
I
DD_
specified with ALRM pin open, and 0°C to +70°C.
Note 6:
Logic 0 voltage specified at a sink current of 4mA at V
DD
= 5.0V and 1.5mA at V
DD
= 2.2V.
Note 7:
Refer to Application Note 58: Crystal
Considerations with Maxim Real-Time Clocks (RTCs). Recommnded ESR < 50kΩ.
Note 8:
This delay applies only if the oscillator is running. If the oscillator is disabled or stopped, no power-up delay occurs.
Note 9:
A master device must provide a hold time of at least 300ns for the SDA signal to bridge the undefined region of SCL’s
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
