Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
V
IN
V
out
I
OH
/I
OL
Positive DC Supply Voltage
Digital Input Voltage
Output Voltage
Output Current
V
CC
= 3.0 V to 3.6 V
V
CC
= 2.3 V to 2.7 V
V
CC
= 1.65 V to 1.95 V
V
CC
= 1.4 V to 1.6 V
V
CC
= 1.1 V to 1.3 V
V
CC
= 0.9 V
Operating Temperature Range. All Package Types
Input Rise or Fall Time
V
CC
= 3.3V
±
0.3 V
−40
0
Parameter
Min
0.9
0
0
Max
3.6
3.6
V
CC
±24
±18
±6
±4
±2
±0.1
+85
10
Units
V
V
V
mA
t
A
t
r
, t
f
°C
nS/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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2
NL17SV16
DC CHARACTERISTICS – Digital Section
(Voltages Referenced to GND)
T
A
= 25°C
Symbol
V
IH
Parameter
High Level
Input Voltage
Condition
V
CC
0.90
1.10
≤
V
CC
≤
1.30
1.40
≤
V
CC
≤
1.60
1.65
≤
V
CC
≤
1.95
2.30
≤
V
CC
≤
2.70
2.70
≤
V
CC
≤
3.60
0.90
1.10
≤
V
CC
≤
1.30
1.40
≤
V
CC
≤
1.60
1.65
≤
V
CC
≤
1.95
2.30
≤
V
CC
≤
2.70
2.70
≤
V
CC
≤
3.60
I
OH
= −100
mA
0.90
1.10
≤
V
CC
≤
1.30
1.40
≤
V
CC
≤
1.60
1.65
≤
V
CC
≤
1.95
2.30
≤
V
CC
≤
2.70
2.70
≤
V
CC
≤
3.60
1.10
≤
V
CC
≤
1.30
1.40
≤
V
CC
≤
1.60
1.65
≤
V
CC
≤
1.95
2.30
≤
V
CC
≤
2.70
2.30
≤
V
CC
≤
2.70
2.70 < V
CC
≤
3.60
2.30
≤
V
CC
≤
2.70
2.70 < V
CC
≤
3.60
2.70
≤
V
CC
≤
3.60
0.90
1.10
≤
V
CC
≤
1.30
1.40
≤
V
CC
≤
1.60
1.65
≤
V
CC
≤
1.95
2.30
≤
V
CC
≤
2.70
2.70
≤
V
CC
≤
3.60
1.10
≤
V
CC
≤
1.30
1.40
≤
V
CC
≤
1.60
1.65
≤
V
CC
≤
1.95
2.30
≤
V
CC
≤
2.70
2.70 < V
CC
≤
3.60
2.30
≤
V
CC
≤
2.70
2.70 < V
CC
≤
3.60
2.70
≤
V
CC
≤
3.60
0.90 to 3.60
0
V
I
= V
CC
or GND
0.90 to 3.60
V
CC
− 0.1
V
CC
− 0.1
V
CC
− 0.2
V
CC
− 0.2
V
CC
− 0.2
V
CC
− 0.2
0.75 x V
CC
0.75 x V
CC
1.25
2.0
1.8
2.2
1.7
2.4
2.2
0.1
0.1
0.2
0.2
0.2
0.2
0.25 x V
CC
0.25 x V
CC
0.3
0.4
0.4
0.6
0.4
0.55
±0.1
1
0.9
Min
0.65 x V
CC
0.65 x V
CC
0.65 x V
CC
0.65 x V
CC
1.6
2.0
0.35 x V
CC
0.35 x V
CC
0.35 x V
CC
0.35 x V
CC
0.7
0.8
V
CC
− 0.1
V
CC
− 0.1
V
CC
− 0.2
V
CC
− 0.2
V
CC
− 0.2
V
CC
− 0.2
0.75 x V
CC
0.75 x V
CC
1.25
2.0
1.8
2.2
1.7
2.4
2.2
0.1
0.1
0.2
0.2
0.2
0.2
0.25 x V
CC
0.25 x V
CC
0.3
0.4
0.4
0.6
0.4
0.55
±0.9
5
5
mA
mA
mA
V
Max
T
A
= −40 to 85°C
Min
0.65 x V
CC
0.65 x V
CC
0.65 x V
CC
0.65 x V
CC
1.6
2.0
0.35 x V
CC
0.35 x V
CC
0.35 x V
CC
0.35 x V
CC
0.7
0.8
Max
Units
V
V
IL
Low Level
Input Voltage
V
V
OH
High Level
Output Voltage
V
I
OH
= −2.0 mA
I
OH
= −4.0 mA
I
OH
= −6.0 mA
I
OH
= −12 mA
I
OH
= −18 mA
I
OH
= −24 mA
V
OL
Low Level
Output Voltage
I
OL
= 100
mA
I
OL
= 2.0 mA
I
OL
= 4.0 mA
I
OL
= 6.0 mA
I
OL
= 12 mA
I
OL
= 18 mA
I
OL
= 24 mA
I
IN
I
OFF
I
CC
Input
Leakage Current
Power Off
Leakage Current
Quiescent
Supply Current
0 = V
I
= 3.6 V
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3
NL17SV16
AC CHARACTERISTICS
(Input t
r
= t
f
= 3.0 nS)
−40°C
Symbol
T
PHL,
T
PLH
Parameter
Propagation Delay
Condition
C
L
= 15 pF, R
L
= 1.0 MW
C
L
= 15 pF, R
L
= 2.0 kW
C
L
= 30 pF, R
L
= 500
W
V
CC
0.90
1.10
≤
V
CC
≤
1.30
1.40
≤
V
CC
≤
1.60
1.65
≤
V
CC
≤
1.95
2.30
≤
V
CC
≤
2.70
2.70
≤
V
CC
≤
3.60
0
0
V
I
= 0 V or V
CC
F = 10 MHz
0.90 to 3.60
2.0
1.0
1.0
0.8
0.7
Min
25°C
Typ
20
6.0
3.2
2.0
1.2
1.0
2.0
4.5
20
13
6.1
5.2
3.7
3.3
1.0
1.0
1.0
0.7
0.6
16.9
7.0
6.2
4.4
3.8
Max
85°C
Min
Max
Units
nS
nS
nS
C
IN
C
OUT
C
PD
Input Capacitance
Output Capacitance
Power Dissipation
Capacitance
pF
pF
pF
DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES
Junction Temperature
°C
80
90
100
110
120
130
140
Time, Hours
1,032,200
419,300
178,700
79,600
37,000
17,800
8,900
Time, Years
117.8
47.9
20.4
9.4
4.2
2.0
1.0
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4
NL17SV16
PACKAGE DIMENSIONS
SOT−553, 5 LEAD
CASE 463B
ISSUE C
D
−X−
A
L
4
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
DIM
A
b
c
D
E
e
L
H
E
MIN
0.50
0.17
0.08
1.55
1.15
MILLIMETERS
NOM
MAX
0.55
0.60
0.22
0.27
0.13
0.18
1.60
1.65
1.20
1.25
0.50 BSC
0.10
0.20
0.30
1.55
1.60
1.65
MIN
0.020
0.007
0.003
0.061
0.045
INCHES
NOM
0.022
0.009
0.005
0.063
0.047
0.020 BSC
0.008
0.004
0.061
0.063
MAX
0.024
0.011
0.007
0.065
0.049
0.012
0.065
1
2
3
E
−Y−
H
E
b
e
5 PL
M
c
X Y
0.08 (0.003)
RECOMMENDED
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.0
0.0394
1.35
0.0531
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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