NLU2G17
Dual Non-Inverting
Schmitt-Trigger Buffer
The NLU2G17 MiniGatet is an advanced high−speed CMOS dual
non−inverting Schmitt−trigger buffer in ultra−small footprint.
The NLU2G17 input and output structures provide protection when
voltages up to 7.0 V are applied, regardless of the supply voltage.
The NLU2G17 can be used to enhance noise immunity or to square
up slowly changing waveforms.
Features
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MARKING
DIAGRAMS
UDFN6
1.2 x 1.0
CASE 517AA
1
ULLGA6
1.0 x 1.0
CASE 613AD
AM
•
•
•
•
•
•
•
High Speed: t
PD
= 4.0 ns (Typ) @ V
CC
= 5.0 V
Low Power Dissipation: I
CC
= 1
mA
(Max) at T
A
= 25°C
Power Down Protection Provided on inputs
Balanced Propagation Delays
Overvoltage Tolerant (OVT) Input and Output Pins
Ultra−Small Packages
These are Pb−Free Devices
AM
1
IN A1
1
6
OUT Y1
1
ULLGA6
1.2 x 1.0
CASE 613AE
AM
GND
2
5
V
CC
1
ULLGA6
1.45 x 1.0
CASE 613AF
AM
IN A2
3
4
OUT Y2
UDFN6
1.0 x 1.0
CASE 517BX
1
UDFN6
1.45 x 1.0
CASE 517AQ
1
M
5
Figure 1. Pinout
(Top View)
IN A1
IN A2
1
1
M
R
OUT Y1
OUT Y2
M
Figure 2. Logic Symbol
PIN ASSIGNMENT
1
2
3
4
5
6
IN A1
GND
IN A2
OUT Y2
V
CC
OUT Y1
= Date Code
ORDERING INFORMATION
FUNCTION TABLE
A
L
H
Y
L
H
See detailed ordering and shipping information on page 4 of
this data sheet.
©
Semiconductor Components Industries, LLC, 2013
August, 2013
−
Rev. 8
1
Publication Order Number:
NLU2G17/D
NLU2G17
MAXIMUM RATINGS
Symbol
V
CC
V
IN
V
OUT
I
IK
I
OK
I
O
I
CC
I
GND
T
STG
T
L
T
J
MSL
F
R
I
LATCHUP
DC Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Source/Sink Current
DC Supply Current Per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Moisture Sensitivity
Flammability Rating Oxygen
Index: 28 to 34
V
IN
< GND
V
OUT
< GND
Parameter
Value
−0.5
to +7.0
−0.5
to +7.0
−0.5
to +7.0
−20
±20
±12.5
±25
±25
−65
to +150
260
150
Level 1
UL 94 V−0 @ 0.125 in
±500
mA
Unit
V
V
V
mA
mA
mA
mA
mA
°C
°C
°C
Latchup Performance Above V
CC
and Below GND at 125°C (Note 2)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
V
IN
V
OUT
T
A
Dt/DV
Positive DC Supply Voltage
Digital Input Voltage
Output Voltage
Operating Free−Air Temperature
Input Transition Rise or Fall Rate
V
CC
= 3.3 V
±
0.3 V
V
CC
= 5.0 V
±
0.5 V
Parameter
Min
1.65
0
0
−55
0
0
Max
5.5
5.5
5.5
+125
No Limit
No Limit
Unit
V
V
V
°C
ns/V
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2
NLU2G17
DC ELECTRICAL CHARACTERISTICS
V
CC
(V)
3.0
4.5
5.5
3.0
4.5
5.5
3.0
4.5
5.5
V
IN
w
V
T+MAX
I
OH
=
−50
mA
V
IN
w
V
T+MAX
I
OH
=
−4
mA
I
OH
=
−8
mA
V
IN
v
V
T−MIN
I
OL
= 50
mA
V
IN
v
V
T−MIN
I
OL
= 4 mA
I
OL
= 8 mA
0
v
V
IN
v
5.5 V
2.0
3.0
4.5
3.0
4.5
2.0
3.0
4.5
3.0
4.5
0 to
5.5
5.5
0.9
1.35
1.65
0.30
0.40
0.50
1.9
2.9
4.4
2.58
3.94
0
0
0
0.1
0.1
0.1
0.36
0.36
±0.1
T
A
= 25
5C
Min
Typ
2.0
3.0
3.6
1.5
2.3
2.9
0.57
0.67
0.74
2.0
3.0
4.5
Max
2.2
3.15
3.85
1.65
2.46
3.05
1.20
1.40
1.60
0.9
1.35
1.65
0.30
0.40
0.50
1.9
2.9
4.4
2.48
3.80
0.1
0.1
0.1
0.44
0.44
±1.0
1.20
1.40
1.60
T
A
=
+855C
Min
Max
2.2
3.15
3.85
0.9
1.35
1.65
0.30
0.40
0.50
1.9
2.9
4.4
2.34
3.66
0.1
0.1
0.1
0.52
0.52
±1.0
mA
V
1.20
1.40
1.60
T
A
=
−555C
to
+1255C
Min
Max
2.2
3.15
3.85
Unit
V
Symbol
V
T+
Parameter
Positive
Threshold
Voltage
Negative
Threshold
Voltage
Hysteresis
Voltage
Minimum
High−Level
Output
Voltage
Conditions
V
T−
V
V
H
V
V
OH
V
V
OL
Maximum
Low−Level
Output
Voltage
I
IN
Input
Leakage
Current
Quiescent
Supply
Current
I
CC
V
IN
= 5.5 V or
GND
1.0
10
40
mA
AC ELECTRICAL CHARACTERISTICS
(Input t
r
= t
f
= 3.0 ns)
V
CC
(V)
3.0 to
3.6
4.5 to
5.5
C
IN
C
PD
Input Capacitance
Power Dissipation
Capacitance (Note 3)
5.0
Test
Condition
C
L
= 15 pF
C
L
= 50 pF
C
L
= 15 pF
C
L
= 50 pF
T
A
= 25
5C
Min
Typ
7.0
8.5
4.0
5.5
5.0
7.0
Max
12.8
16.3
8.6
10.6
10
T
A
=
+855C
Min
1.0
1.0
1.0
1.0
Max
15
18.5
10
12
10
T
A
=
−555C
to
+1255C
Min
1.0
1.0
1.0
1.0
Max
17
20.5
11.5
13.5
10
pF
pF
Unit
ns
Symbol
t
PLH
,
t
PHL
Parameter
Propagation Delay,
Input A to Output Y
3. C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation I
CC(OPR)
= C
PD
•
V
CC
•
f
in
+ I
CC
. C
PD
is used to determine the no−load
dynamic power consumption: P
D
= C
PD
•
V
CC2
•
f
in
+ I
CC
•
V
CC.
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3
NLU2G17
A or B
V
CC
50%
t
PLH
Y
50% V
CC
A 1−MHz square input wave is recommended for propagation delay tests.
t
PHL
GND
INPUT
R
L
C
L
OUTPUT
Figure 3. Switching Waveforms
Figure 4. Test Circuit
V
H
V
IN
V
CC
V
T+
V
T−
GND
V
OH
V
IN
V
H
V
CC
V
T+
V
T−
GND
V
OH
V
OUT
V
OL
V
out
V
OL
(b) A Schmitt−Trigger Offers Maximum Noise Immunity
(a) A Schmitt−Trigger Squares Up Inputs With Slow Rise and Fall Times
Figure 5. Typical Schmitt−Trigger Applications
ORDERING INFORMATION
Device
NLU2G17MUTCG
NLU2G17AMX1TCG
NLU2G17BMX1TCG
NLU2G17CMX1TCG
NLU2G17AMUTCG
NLU2G17CMUTCG
Package
UDFN6, 1.2 x 1.0, 0.4P
(Pb−Free)
ULLGA6, 1.45 x 1.0, 0.5P
(Pb−Free)
ULLGA6, 1.2 x 1.0, 0.4P
(Pb−Free)
ULLGA6, 1.0 x 1.0, 0.35P
(Pb−Free)
UDFN6, 1.45 x 1.0, 0.5P
(Pb−Free)
UDFN6, 1.0 x 1.0, 0.35P
(Pb−Free)
Shipping
†
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NLU2G17
PACKAGE DIMENSIONS
UDFN6 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
D
A
B
L1
PIN ONE
REFERENCE
L
L
E
OPTIONAL
CONSTRUCTIONS
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
DIM
A
A1
A2
b
D
E
e
L
L1
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.07 REF
0.20
0.30
1.45 BSC
1.00 BSC
0.50 BSC
0.30
0.40
−−−
0.15
0.10 C
0.10 C
DETAIL B
0.05 C
6X
A
A1
SIDE VIEW
e
1
3
OPTIONAL
CONSTRUCTIONS
0.05 C
A2
C
SEATING
PLANE
6X
L
DETAIL A
6
4
6X
b
0.10 C A B
0.05 C
NOTE 3
BOTTOM VIEW
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5
ÉÉ
ÉÉ
ÉÉÉ
ÉÉÉ
TOP VIEW
EXPOSED Cu
MOLD CMPD
DETAIL B
MOUNTING FOOTPRINT
PACKAGE
OUTLINE
0.30
6X
1.24
0.53
6X
1
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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