| 参数名称 | 属性值 |
| 产品种类 Product Category | Multiplexer Switch ICs |
| 制造商 Manufacturer | Maxim(美信半导体) |
| Number of Channels | 1 Channel |
| On Resistance - Max | 1.8 kOhms |
| On Time - Max | 300 ns |
| Off Time - Max | 300 ns |
| 工作电源电压 Operating Supply Voltage | +/- 5 V, +/- 9 V, +/- 12 V, +/- 15 V |
| 最大工作温度 Maximum Operating Temperature | + 75 C |
| 封装 / 箱体 Package / Case | CDIP-16 |
| 高度 Height | 3.56 mm (Max) |
| 长度 Length | 21.34 mm (Max) |
| Maximum Dual Supply Voltage | +/- 18 V |
| 最小工作温度 Minimum Operating Temperature | 0 C |
| Pd-功率耗散 Pd - Power Dissipation | 1280 mW |
| Supply Current - Max | 2 mA |
| Supply Type | Dual Supply |
| 宽度 Width | 7.87 mm (Max) |
| HI1-0509A-5- | HI3-0201-5 | HI1-0201-5 | HI3-0201-5- | HI1-0201-9 | |
|---|---|---|---|---|---|
| 描述 | Analog Switch ICs Quad SPST CMOS Analgo Switch | Analog Switch ICs Quad SPST, CMOS Analog Switch | Analog Switch ICs Quad SPST, CMOS Analog Switch | Analog Switch ICs Quad SPST CMOS Analgo Switch | |
| 是否无铅 | - | 含铅 | 含铅 | - | 含铅 |
| 是否Rohs认证 | - | 不符合 | 不符合 | - | 不符合 |
| 厂商名称 | - | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) |
| 零件包装代码 | - | DIP | DIP | - | DIP |
| 包装说明 | - | DIP, DIP16,.3 | DIP, DIP16,.3 | - | DIP, DIP16,.3 |
| 针数 | - | 16 | 16 | - | 16 |
| Reach Compliance Code | - | not_compliant | not_compliant | - | not_compliant |
| 模拟集成电路 - 其他类型 | - | SPST | SPST | - | SPST |
| JESD-30 代码 | - | R-PDIP-T16 | R-GDIP-T16 | - | R-GDIP-T16 |
| JESD-609代码 | - | e0 | e0 | - | e0 |
| 湿度敏感等级 | - | 1 | 1 | - | 1 |
| 负电源电压最大值（Vsup） | - | -18 V | -18 V | - | -18 V |
| 负电源电压最小值（Vsup） | - | -4.5 V | -4.5 V | - | -4.5 V |
| 标称负供电电压 (Vsup) | - | -15 V | -15 V | - | -15 V |
| 正常位置 | - | NC | NC | - | NC |
| 信道数量 | - | 1 | 1 | - | 1 |
| 功能数量 | - | 4 | 4 | - | 4 |
| 端子数量 | - | 16 | 16 | - | 16 |
| 标称断态隔离度 | - | 70 dB | 70 dB | - | 70 dB |
| 最大通态电阻 (Ron) | - | 80 Ω | 80 Ω | - | 80 Ω |
| 最高工作温度 | - | 70 °C | 70 °C | - | 85 °C |
| 输出 | - | SEPARATE OUTPUT | SEPARATE OUTPUT | - | SEPARATE OUTPUT |
| 封装主体材料 | - | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | - | CERAMIC, GLASS-SEALED |
| 封装代码 | - | DIP | DIP | - | DIP |
| 封装等效代码 | - | DIP16,.3 | DIP16,.3 | - | DIP16,.3 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | - | IN-LINE | IN-LINE | - | IN-LINE |
| 峰值回流温度（摄氏度） | - | 240 | 240 | - | 240 |
| 电源 | - | +-15 V | +-15 V | - | +-15 V |
| 认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | - | 4.572 mm | 5.842 mm | - | 5.842 mm |
| 最大供电电压 (Vsup) | - | 18 V | 18 V | - | 18 V |
| 最小供电电压 (Vsup) | - | 4.5 V | 4.5 V | - | 4.5 V |
| 标称供电电压 (Vsup) | - | 15 V | 15 V | - | 15 V |
| 表面贴装 | - | NO | NO | - | NO |
| 最长断开时间 | - | 350 ns | 350 ns | - | 350 ns |
| 最长接通时间 | - | 500 ns | 500 ns | - | 500 ns |
| 切换 | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE |
| 技术 | - | CMOS | CMOS | - | CMOS |
| 温度等级 | - | COMMERCIAL | COMMERCIAL | - | INDUSTRIAL |
| 端子面层 | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn/Pb) |
| 端子形式 | - | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE |
| 端子节距 | - | 2.54 mm | 2.54 mm | - | 2.54 mm |
| 端子位置 | - | DUAL | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | - | 20 | 20 | - | 20 |
| 宽度 | - | 7.62 mm | 7.62 mm | - | 7.62 mm |
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