(*) Specified board is attached:80.0mm×80.0mm×1.0mm, glass epoxy board
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed,
damage may occur and reliability may be affected.
Note : Machine model ESD voltage level of the pin 18 is less than 200V, because their high frequency characteristics are
extremely important. Handle pins 18 with care to prevent electrostatic breakdown.
Operating Conditions
at Ta = 25ºC
Parameter
Recommended supply voltage
Operating supply voltage range
Input High level voltage
Symbol
VCC
VCC op
VINH1
VINH2
Input Low level voltage
VINL1
VINL2
SCL clock frequency
fSCL
TEST, RST, XSTBY, XRST
SDA, SCL
TEST, RST, XSTBY, XRST
SDA, SCL
SCL
Conditions
Ratings
5.0V
4.5 to 5.5V
3 to 3.45V
2.3 to 3.45V
0.5V or less
0.9V or less
400kHz or less
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended
Operating Ranges limits may affect device reliability.
Range of Reception Frequency
Parameter
FM input frequency1
FM input frequency2
FM input frequency3
Symbol
FM_EU
FM_US
FM_JP
FM EU
FM US
FM JP
Conditions
Ratings
87.5 to 108.0
87.9 to 108.1
76 to 90
unit
MHz
MHz
MHz
The constant in application circuit is different in FM_EU, FM_US and FM_JP.
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2
LV25500PQA
Electric Characteristics
at Ta = 25ºC, VCC = 5.0V
fc = 98.1MHz, Vin = 60dBuVEMF, fm = 1kHz, Audio filter: HPF = 100Hz, LPF = 15kHz
Parameter
Usable sensitivity 1
(S/N30dB)
Usable sensitivity 2
(S/N10dB)
SN ratio 1
SN ratio 2
AM suppression ratio
Image removal ratio
Audio output level 1
Audio output level 2
SD sensitivity
Center frequency
Symbol
SN30
SN10
SN1
SN2
AMR
IMR
ADO1
ADO2
SDS
f0
VOL1
Output (L) level voltage
VOL2
VOL3
VOH1
Output (H) level voltage
VOH2
Current consumption 1
Current consumption 2
ICC1
ICC2
Conditions
22.5kHz dev, fm = 1kHz,
S/N = 30dB input level
7.5kHz dev, fm = 76kHz,
S/N = 10dB input level [1]
22.5kHz dev, fm = 1kHz
7.5kHz dev, fm = 76kHz [1]
AM 30% mod
22.5kHz dev, fm = 1kHz
7.5kHz dev, fm = 1kHz [1]
7.5kHz dev, fm = 76kHz [1]
LNA input level when SD terminal
is on.
57kHz BPF peak frequency
RDDA, RDCL, INT, SD
IOL=0.5mA
RDS-ID,IOL=0.5mA
SDA (when VDD pull up)
RDDA, RDCL, INT, SD
IOH=0.5mA
SDA (when VDD pull up)
When no signal input
RDS mode
When no signal input
VICS mode
-
-
-
2.3
0.7*VDD
[2]
125
120
165
155
min
-
-
34
-
34
-
12
12
13
typ
12
27
46
23
45
46
30
23
20
57
-
-
-
-
0.5
0.5
0.5
-
-
205
190
max
20
-
-
-
-
-
45
45
27
unit
dBuVEMF
dBuVEMF
dB
dB
dB
dB
mVrms
mVrms
dBuVEMF
kHz
V
V
V
V
V
mA
mA
[1] Audio filter : HPF = 100Hz, LPF = OFF
[2] VDD :
μ-COM
Supply Voltage
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be
indicated by the Electrical Characteristics if operated under different conditions.
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3
LV25500PQA
RDS input/output Format
RST= 0
RST= 1
RST Pin
Normal operation
Reset of RDS-ID and demodulator circuit
RDS-ID
RDS-IDoutput
Active-Low
RDCL/RDDA Output timing
421μs
RDCL output
421μs
Tp
RDDA Output
17μs Tp
17μs
RDS-ID Output timing
RDS-ID
RDCL
RDDA
High/Low
High/Low
High/Low
High/Low
High/Low
High/Low
High/Low
Note : RDS-ID is High : data with Low RDS reliability, Low: data with High RDS reliability
RST operation
Tp3
250ns
RST
RDS detection
RDCL
RDDA
Note : RDCL and RDDA outputs keep high level after input of RST until RDS detection circuit output is detected.
Note : When the reception channel is changed, a memory reset must be applied using RST input.
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4
circuit output
LV25500PQA
Package Dimensions
WQFN56 (7.0mm x 7.0mm)
unit : mm
WQFN56 7x7, 0.4P
CASE 510BD
ISSUE O
D
PIN 1
INDICATOR
A B
L1
L
L
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO THE PLATED
TERMINAL AND IS MEASURED ABETWEEN
0.15 AND 0.25MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM
A
A1
A3
b
D
D2
E
E2
e
L
L1
MILLIMETERS
MIN
MAX
0.80
0.00
0.05
0.20 REF
0.15
0.25
7.00 BSC
5.10
5.30
7.00 BSC
5.10
5.30
0.40 BSC
0.30
0.50
0.00
0.15
E
2X
EXPOSED Cu
MOLD CMPD
0.15 C
2X
0.15 C
0.10 C
0.08 C
TOP VIEW
(A3)
A
A1
SIDE VIEW
0.10
M
DETAIL B
ALTERNATE
CONSTRUCTION
DETAIL B
NOTE 4
C
C A B
SEATING
PLANE
GENERIC
MARKING DIAGRAM*
1
DETAIL A
15
D2
29
XXXXXXXXX
XXXXXXXXX
AWLYYWWG
C A B
A
WL
YY
WW
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb-Free Package
0.10
M
E2
1
56
56X
43
56X
*This information is generic. Please refer to
device data sheet for actual part marking.
b
0.10
0.05
M
M
L
e
e/2
BOTTOM VIEW
C A B
C
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
5.40
1
7.30
2X
2X
0.63
56X
56X
0.26
0.40 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and