high fidelity power speech
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Winbond(华邦电子) |
零件包装代码 | DIE |
包装说明 | DIE, DIE OR CHIP |
针数 | 29 |
Reach Compliance Code | unknown |
应用 | DOORBELLS; MELODY CLOCK; TOYS |
商用集成电路类型 | SPEECH SYNTHESIZER |
JESD-30 代码 | R-XUUC-N29 |
JESD-609代码 | e0 |
功能数量 | 1 |
端子数量 | 29 |
片上内存类型 | ROM |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | UNSPECIFIED |
封装代码 | DIE |
封装等效代码 | DIE OR CHIP |
封装形状 | RECTANGULAR |
封装形式 | UNCASED CHIP |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 2.4/5.5 V |
认证状态 | Not Qualified |
最长读取时间 | 15 s |
最大压摆率 | 1.2 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 2.4 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD |
端子位置 | UPPER |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
W583S15 | W583S30 | W583S99 | W583M02 | W583S50 | W583S20 | W583S60 | W583S40 | W583S25 | W583S80 | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | high fidelity power speech | high fidelity power speech | high fidelity power speech | high fidelity power speech | high fidelity power speech | high fidelity power speech | high fidelity power speech | high fidelity power speech | high fidelity power speech | high fidelity power speech |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) |
零件包装代码 | DIE | DIE | DIE | DIE | DIE | DIE | DIE | DIE | DIE | DIE |
包装说明 | DIE, DIE OR CHIP | DIE, DIE OR CHIP | DIE, DIE OR CHIP | DIE, DIE OR CHIP | DIE, DIE OR CHIP | DIE, DIE OR CHIP | DIE, DIE OR CHIP | DIE, DIE OR CHIP | DIE, DIE OR CHIP | DIE, DIE OR CHIP |
针数 | 29 | 29 | 29 | 29 | 29 | 29 | 29 | 29 | 29 | 29 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
应用 | DOORBELLS; MELODY CLOCK; TOYS | DOORBELLS; MELODY CLOCK; TOYS | DOORBELLS; MELODY CLOCK; TOYS | DOORBELLS; MELODY CLOCK; TOYS | DOORBELLS; MELODY CLOCK; TOYS | DOORBELLS; MELODY CLOCK; TOYS | DOORBELLS; MELODY CLOCK; TOYS | DOORBELLS; MELODY CLOCK; TOYS | DOORBELLS; MELODY CLOCK; TOYS | DOORBELLS; MELODY CLOCK; TOYS |
商用集成电路类型 | SPEECH SYNTHESIZER | SPEECH SYNTHESIZER | SPEECH SYNTHESIZER | SPEECH SYNTHESIZER | SPEECH SYNTHESIZER | SPEECH SYNTHESIZER | SPEECH SYNTHESIZER | SPEECH SYNTHESIZER | SPEECH SYNTHESIZER | SPEECH SYNTHESIZER |
JESD-30 代码 | R-XUUC-N29 | R-XUUC-N29 | R-XUUC-N29 | R-XUUC-N29 | R-XUUC-N29 | R-XUUC-N29 | R-XUUC-N29 | R-XUUC-N29 | R-XUUC-N29 | R-XUUC-N29 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 29 | 29 | 29 | 29 | 29 | 29 | 29 | 29 | 29 | 29 |
片上内存类型 | ROM | ROM | ROM | ROM | ROM | ROM | ROM | ROM | ROM | ROM |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | DIE | DIE | DIE | DIE | DIE | DIE | DIE | DIE | DIE | DIE |
封装等效代码 | DIE OR CHIP | DIE OR CHIP | DIE OR CHIP | DIE OR CHIP | DIE OR CHIP | DIE OR CHIP | DIE OR CHIP | DIE OR CHIP | DIE OR CHIP | DIE OR CHIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 2.4/5.5 V | 2.4/5.5 V | 2.4/5.5 V | 2.4/5.5 V | 2.4/5.5 V | 2.4/5.5 V | 2.4/5.5 V | 2.4/5.5 V | 2.4/5.5 V | 2.4/5.5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最长读取时间 | 15 s | 30 s | 99 s | 120 s | 50 s | 20 s | 60 s | 40 s | 25 s | 80 s |
最大压摆率 | 1.2 mA | 1.2 mA | 1.2 mA | 1.2 mA | 1.2 mA | 1.2 mA | 1.2 mA | 1.2 mA | 1.2 mA | 1.2 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子位置 | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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