IC dual sim/smart card PS 16qfn
| 参数名称 | 属性值 |
| Brand Name | Linear Technology |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, |
| 针数 | 16 |
| 制造商包装代码 | UD |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | S-PQCC-N16 |
| JESD-609代码 | e0 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 235 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.2 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 3 mm |
| LTC4557EUD | DC709A | LTC4557EUD#TR | LTC4557EUD#PBF | LTC4557EUD#TRPBF | |
|---|---|---|---|---|---|
| 描述 | IC dual sim/smart card PS 16qfn | board eval for ltc4557eud | IC dual sim/smart card PS 16qfn | IC dual sim/smart card PS 16qfn | IC DUAL SIM/SMART CARD PS 16QFN |
| Brand Name | Linear Technology | - | Linear Technology | Linear Technology | Linear Technology |
| 是否Rohs认证 | 不符合 | - | 不符合 | 符合 | 符合 |
| 厂商名称 | Linear ( ADI ) | - | Linear ( ADI ) | - | Linear ( ADI ) |
| 零件包装代码 | QFN | - | QFN | QFN | QFN |
| 包装说明 | HVQCCN, | - | HVQCCN, | HVQCCN, | HVQCCN, |
| 针数 | 16 | - | 16 | 16 | 16 |
| 制造商包装代码 | UD | - | UD | UD | UD |
| Reach Compliance Code | not_compliant | - | not_compliant | compliant | compliant |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 |
| 可调阈值 | NO | - | NO | NO | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | - | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | S-PQCC-N16 | - | S-PQCC-N16 | S-PQCC-N16 | S-PQCC-N16 |
| JESD-609代码 | e0 | - | e0 | e3 | e3 |
| 长度 | 3 mm | - | 3 mm | 3 mm | 3 mm |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 |
| 信道数量 | 1 | - | 1 | 1 | 1 |
| 功能数量 | 1 | - | 1 | 1 | 1 |
| 端子数量 | 16 | - | 16 | 16 | 16 |
| 最高工作温度 | 70 °C | - | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | - | HVQCCN | HVQCCN | HVQCCN |
| 封装形状 | SQUARE | - | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 235 | - | 235 | 260 | 250 |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | - | 0.8 mm | 0.8 mm | 0.8 mm |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.2 V | - | 1.2 V | 1.2 V | 1.2 V |
| 标称供电电压 (Vsup) | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | - | YES | YES | YES |
| 温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | NO LEAD | - | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | - | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 20 | - | 20 | 30 | NOT SPECIFIED |
| 宽度 | 3 mm | - | 3 mm | 3 mm | 3 mm |
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