Precision Amplifiers LinCMOS Lo-Power Op Amp
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | DIP |
包装说明 | DIP, DIP8,.3 |
针数 | 8 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER |
架构 | VOLTAGE-FEEDBACK |
最大平均偏置电流 (IIB) | 0.00006 µA |
25C 时的最大偏置电流 (IIB) | 0.00006 µA |
标称共模抑制比 | 94 dB |
频率补偿 | YES |
最大输入失调电压 | 12000 µV |
JESD-30 代码 | R-PDIP-T8 |
JESD-609代码 | e4 |
长度 | 9.81 mm |
低-偏置 | YES |
低-失调 | NO |
微功率 | YES |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP8,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
包装方法 | TUBE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5/10 V |
认证状态 | Not Qualified |
座面最大高度 | 5.08 mm |
标称压摆率 | 0.03 V/us |
最大压摆率 | 0.033 mA |
供电电压上限 | 18 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
标称均一增益带宽 | 85 kHz |
最小电压增益 | 50000 |
宽度 | 7.62 mm |
TLC27L1CPE4 | TLC27L1IPE4 | TLC27L1BCDG4 | TLC27L1AIDG4 | TLC27L1ACPE4 | TLC27L1A | TLC27L1B | TLC27L1 | |
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描述 | Precision Amplifiers LinCMOS Lo-Power Op Amp | Precision Amplifiers LinCMOS Lo-Power Op Amp | Precision Amplifiers LinCMOS LO-PWR OP AMP | Precision Amplifiers LinCMOS LO-PWR OP AMP | Precision Amplifiers LinCMOS Lo-Power Op Amp | TLC27L1A LinCMOS Low-Power Operational Amplifier | TLC27L1B LinCMOS Low-Power Operational Amplifier | TLC27L1 LinCMOS Low-Power Operational Amplifier |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | - | - |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | - | - | - |
零件包装代码 | DIP | DIP | SOIC | SOIC | DIP | - | - | - |
包装说明 | DIP, DIP8,.3 | PLASTIC, DIP-8 | SOP, SOP8,.25 | SOP, SOP8,.25 | DIP, DIP8,.3 | - | - | - |
针数 | 8 | 8 | 8 | 8 | 8 | - | - | - |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | - | - | - |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | - | - |
放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | - | - | - |
架构 | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | - | - | - |
最大平均偏置电流 (IIB) | 0.00006 µA | 0.00006 µA | 0.00006 µA | 0.0006 µA | 0.00006 µA | - | - | - |
25C 时的最大偏置电流 (IIB) | 0.00006 µA | 0.00006 µA | 0.00006 µA | 0.00006 µA | 0.00006 µA | - | - | - |
标称共模抑制比 | 94 dB | 94 dB | 94 dB | 94 dB | 94 dB | - | - | - |
频率补偿 | YES | YES | YES | YES | YES | - | - | - |
最大输入失调电压 | 12000 µV | 13000 µV | 3000 µV | 7000 µV | 6500 µV | - | - | - |
JESD-30 代码 | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | - | - | - |
JESD-609代码 | e4 | e4 | e4 | e4 | e4 | - | - | - |
长度 | 9.81 mm | 9.81 mm | 4.9 mm | 4.9 mm | 9.81 mm | - | - | - |
低-偏置 | YES | YES | YES | YES | YES | - | - | - |
低-失调 | NO | NO | NO | NO | NO | - | - | - |
微功率 | YES | YES | YES | YES | YES | - | - | - |
功能数量 | 1 | 1 | 1 | 1 | 1 | - | - | - |
端子数量 | 8 | 8 | 8 | 8 | 8 | - | - | - |
最高工作温度 | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | - | - | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | - |
封装代码 | DIP | DIP | SOP | SOP | DIP | - | - | - |
封装等效代码 | DIP8,.3 | DIP8,.3 | SOP8,.25 | SOP8,.25 | DIP8,.3 | - | - | - |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | - |
封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | - | - | - |
包装方法 | TUBE | TUBE | TUBE | TUBE | TUBE | - | - | - |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 | NOT SPECIFIED | - | - | - |
电源 | 5/10 V | 5/10 V | 5/10 V | 5/10 V | 5/10 V | - | - | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | - |
座面最大高度 | 5.08 mm | 5.08 mm | 1.75 mm | 1.75 mm | 5.08 mm | - | - | - |
标称压摆率 | 0.03 V/us | 0.03 V/us | 0.03 V/us | 0.03 V/us | 0.03 V/us | - | - | - |
最大压摆率 | 0.033 mA | 0.043 mA | 0.033 mA | 0.043 mA | 0.033 mA | - | - | - |
供电电压上限 | 18 V | 18 V | 18 V | 18 V | 18 V | - | - | - |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | - | - | - |
表面贴装 | NO | NO | YES | YES | NO | - | - | - |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - | - | - |
温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | - | - | - |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | - |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | - | - | - |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | - | - | - |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - | - | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - |
标称均一增益带宽 | 85 kHz | 85 kHz | 85 kHz | 85 kHz | 85 kHz | - | - | - |
最小电压增益 | 50000 | 50000 | 50000 | 50000 | 50000 | - | - | - |
宽度 | 7.62 mm | 7.62 mm | 3.905 mm | 3.905 mm | 7.62 mm | - | - | - |
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