Analog to Digital Converters - ADC 12-Bit 66 kSPS Serial Out
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP20,.3 |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最大模拟输入电压 | 3.6 V |
| 最小模拟输入电压 | |
| 最长转换时间 | 10 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-PDIP-T20 |
| JESD-609代码 | e4 |
| 长度 | 24.325 mm |
| 最大线性误差 (EL) | 0.0244% |
| 模拟输入通道数量 | 11 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出位码 | BINARY, 2'S COMPLEMENT BINARY |
| 输出格式 | SERIAL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 采样并保持/跟踪并保持 | SAMPLE |
| 座面最大高度 | 5.08 mm |
| 标称供电电压 | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| TLV2543INE4 | TLV2543CDWRG4 | TLV2543CDBG4 | TLV2543IDWRG4 | TLV2543IDWG4 | TLV2543IDBG4 | TLV2543CNE4 | TLV2543 | TLV2543EVM | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Analog to Digital Converters - ADC 12-Bit 66 kSPS Serial Out | Analog to Digital Converters - ADC 12-Bit 66 kSPS Serial Out | Analog to Digital Converters - ADC 12-Bit 66 kSPS Serial Out | Analog to Digital Converters - ADC 12-Bit 66 kSPS Serial Out | Analog to Digital Converters - ADC 12bit ADC w/11Chl | Analog to Digital Converters - ADC 12-Bit 66 kSPS Serial Out | Analog to Digital Converters - ADC 12-Bit 66 kSPS Serial Out | TLV2543 12-Bit 66 kSPS ADC Ser. Out, Pgrmable Pwrdn, MSB/LSB First, Built-In Self-Test Mode, 11 Ch. | EVAL BOARD FOR TLV2543 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - | - |
| 零件包装代码 | DIP | SOIC | SSOP | SOIC | SOIC | SSOP | DIP | - | - |
| 包装说明 | DIP, DIP20,.3 | SOP, SOP20,.4 | SSOP, SSOP20,.3 | SOP, SOP20,.4 | SOP, SOP20,.4 | SSOP, SSOP20,.3 | DIP, DIP20,.3 | - | - |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | - | - |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | - | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | - |
| 最大模拟输入电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | - |
| 最长转换时间 | 10 µs | 10 µs | 10 µs | 10 µs | 10 µs | 10 µs | 10 µs | - | - |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | - | - |
| JESD-30 代码 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 | - | - |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | - | - |
| 长度 | 24.325 mm | 12.825 mm | 7.2 mm | 12.825 mm | 12.825 mm | 7.2 mm | 24.325 mm | - | - |
| 最大线性误差 (EL) | 0.0244% | 0.0244% | 0.0244% | 0.0244% | 0.0244% | 0.0244% | 0.0244% | - | - |
| 模拟输入通道数量 | 11 | 11 | 11 | 11 | 11 | 11 | 11 | - | - |
| 位数 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | - | 12 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | - | - |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C | - | - |
| 输出位码 | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | - | - |
| 输出格式 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | - | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
| 封装代码 | DIP | SOP | SSOP | SOP | SOP | SSOP | DIP | - | - |
| 封装等效代码 | DIP20,.3 | SOP20,.4 | SSOP20,.3 | SOP20,.4 | SOP20,.4 | SSOP20,.3 | DIP20,.3 | - | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | IN-LINE | - | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | 260 | 260 | 260 | 260 | NOT SPECIFIED | - | - |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |
| 采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE | - | - |
| 座面最大高度 | 5.08 mm | 2.65 mm | 2 mm | 2.65 mm | 2.65 mm | 2 mm | 5.08 mm | - | - |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | - |
| 表面贴装 | NO | YES | YES | YES | YES | YES | NO | - | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | - |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | - | - |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | - | - |
| 端子节距 | 2.54 mm | 1.27 mm | 0.65 mm | 1.27 mm | 1.27 mm | 0.65 mm | 2.54 mm | - | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 宽度 | 7.62 mm | 7.5 mm | 5.3 mm | 7.5 mm | 7.5 mm | 5.3 mm | 7.62 mm | - | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 | 1 | - | - | - |
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