Analog to Digital Converters - ADC 12-Bit 66 kSPS Serial Out
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
零件包装代码 | SSOP |
包装说明 | SSOP, SSOP20,.3 |
针数 | 20 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
最大模拟输入电压 | 3.6 V |
最小模拟输入电压 | |
最长转换时间 | 10 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PDSO-G20 |
JESD-609代码 | e4 |
长度 | 7.2 mm |
最大线性误差 (EL) | 0.0244% |
湿度敏感等级 | 1 |
模拟输入通道数量 | 11 |
位数 | 12 |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出位码 | BINARY, 2'S COMPLEMENT BINARY |
输出格式 | SERIAL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SSOP |
封装等效代码 | SSOP20,.3 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
电源 | 3.3 V |
认证状态 | Not Qualified |
采样并保持/跟踪并保持 | SAMPLE |
座面最大高度 | 2 mm |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 5.3 mm |
Base Number Matches | 1 |
TLV2543CDBG4 | TLV2543CDWRG4 | TLV2543INE4 | TLV2543IDWRG4 | TLV2543IDWG4 | TLV2543IDBG4 | TLV2543CNE4 | TLV2543 | TLV2543EVM | |
---|---|---|---|---|---|---|---|---|---|
描述 | Analog to Digital Converters - ADC 12-Bit 66 kSPS Serial Out | Analog to Digital Converters - ADC 12-Bit 66 kSPS Serial Out | Analog to Digital Converters - ADC 12-Bit 66 kSPS Serial Out | Analog to Digital Converters - ADC 12-Bit 66 kSPS Serial Out | Analog to Digital Converters - ADC 12bit ADC w/11Chl | Analog to Digital Converters - ADC 12-Bit 66 kSPS Serial Out | Analog to Digital Converters - ADC 12-Bit 66 kSPS Serial Out | TLV2543 12-Bit 66 kSPS ADC Ser. Out, Pgrmable Pwrdn, MSB/LSB First, Built-In Self-Test Mode, 11 Ch. | EVAL BOARD FOR TLV2543 |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | - |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - | - |
零件包装代码 | SSOP | SOIC | DIP | SOIC | SOIC | SSOP | DIP | - | - |
包装说明 | SSOP, SSOP20,.3 | SOP, SOP20,.4 | DIP, DIP20,.3 | SOP, SOP20,.4 | SOP, SOP20,.4 | SSOP, SSOP20,.3 | DIP, DIP20,.3 | - | - |
针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | - | - |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | - | - |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | - |
最大模拟输入电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | - |
最长转换时间 | 10 µs | 10 µs | 10 µs | 10 µs | 10 µs | 10 µs | 10 µs | - | - |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | - | - |
JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 | - | - |
JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | - | - |
长度 | 7.2 mm | 12.825 mm | 24.325 mm | 12.825 mm | 12.825 mm | 7.2 mm | 24.325 mm | - | - |
最大线性误差 (EL) | 0.0244% | 0.0244% | 0.0244% | 0.0244% | 0.0244% | 0.0244% | 0.0244% | - | - |
湿度敏感等级 | 1 | 1 | - | 1 | 1 | 1 | - | - | - |
模拟输入通道数量 | 11 | 11 | 11 | 11 | 11 | 11 | 11 | - | - |
位数 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | - | 12 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | - | - |
最高工作温度 | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 85 °C | 70 °C | - | - |
输出位码 | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | - | - |
输出格式 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | - | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
封装代码 | SSOP | SOP | DIP | SOP | SOP | SSOP | DIP | - | - |
封装等效代码 | SSOP20,.3 | SOP20,.4 | DIP20,.3 | SOP20,.4 | SOP20,.4 | SSOP20,.3 | DIP20,.3 | - | - |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - |
封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | IN-LINE | - | - |
峰值回流温度(摄氏度) | 260 | 260 | NOT SPECIFIED | 260 | 260 | 260 | NOT SPECIFIED | - | - |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |
采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE | - | - |
座面最大高度 | 2 mm | 2.65 mm | 5.08 mm | 2.65 mm | 2.65 mm | 2 mm | 5.08 mm | - | - |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | - |
表面贴装 | YES | YES | NO | YES | YES | YES | NO | - | - |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | - |
温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | - | - |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - |
端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | - | - |
端子节距 | 0.65 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 0.65 mm | 2.54 mm | - | - |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
宽度 | 5.3 mm | 7.5 mm | 7.62 mm | 7.5 mm | 7.5 mm | 5.3 mm | 7.62 mm | - | - |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved