Filtronic
Solid State
Features
•
•
•
•
•
•
•
•
9dB Typical Gain
18dBm 1-dB Gain Compression Power
15dB Input/Output Return Loss Typical
2-26GHz Frequency Bandwidth
DC Decoupled RF Input and Output
Chip Size : 1.986
mm
X1.082
mm
(.078”X.043”)
Chip Thickness : 100µm
2
Pad Dimension : 100µm
2-26 GHz PHEMT Amplifier
LMA208C
Description
The Filtronic LMA208C is a medium power PHEMT amplifier that operates from 2 to 26GHz. This 5-stage travelling wave amplifier provides
10dB nominal gain and 1-dB gain compression power output of greater than 19dBm. The LMA208C is designed for use as wideband driver
amplifer in ECM (Electronic Counter-Measure) and commercial communication system applications. Ground is provided to the circuitry
through vias to the backside metallization.
Electrical Specifications
at T
a
=25
°C
(V
DD
=+4.0V, Zin=Zout=50Ω)
Limit
Typ.
9
7
162
±1.5
-13
-14
-30
18
21
Symbol
BW
S21
S21
Idss
∆S21
RLin
RLout
S12
P-1dB
Psat
Parameter
Operating Bandwidth
Small Signal Gain (2-20GHz)
Small Signal Gain (20-26GHz)
Drain Current at Saturation
Small Signal Gain Flatness
Input Return Loss
Output Return Loss
Reverse Isolation
1-dB Gain Compression Power
Saturated Output Power
Test Conditions
@ .5Idss
@ .5Idss
Idss @ Vg=0 V
Min.
2
7
6
75
Max.
26
225
±2.0
@ .5Idss
16
Units
GHz
dB
dB
mA
dB
dB
dB
dB
dBm
dBm
Absolute Maximum Ratings
Symbol
Vdd
Idd
Pin
Pt
Tch
Tstg
Tmax.
Parameter/Conditions
Drain Supply Voltage
Total Drain Current
RF Input Power
Power Dissipation
Operating Channel Temperature
Storage Temperature
Max. Assembly Temp.
(1 min. max.)
Min.
Max.
7
225
12
1.6
150
165
300
Units
Volts
mA
dBm
W
°C
°C
°C
-65
Note
s:
1. This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these devices.
2. Specifications subject to change without notice.
DSS 009 WC
Phone:
(408) 988-1845
Internet:
http://www.FiltronicSolidState.com
Fax:
(408) 970-9950
Filtronic
Solid State
2-26 GHz PHEMT Amplifier
LMA208C
Assembly Diagram
1.) Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter wire. The bond
tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is recommended.
Ultrasonic bonding is not recommended.
2.) The recommended die attach is an eutectic 80/20 Gold/Tin solder, using a stage temperature of 285-290°C. Maximum
time at temperature is 1 minute. Use of forming gas (90% N
2
, 10% H
2
) for best results.
3.) Bond on bond or stitch bond acceptable.
4.) Conductor over conductor acceptable. Conductors must not short.
DSS 009 WC
Phone:
(408) 988-1845
Internet:
http://www.FiltronicSolidState.com
Fax:
(408) 970-9950
Filtronic
Solid State
2-26 GHz PHEMT Amplifier
LMA208C
Mechanical Outline
Notes:
1.) Unless Otherwise specified.
2.) All units are in micron (µm).
3.) All bond pads are 100 X 100 µm
2
.
4.) Bias pad (V
DD
) size is 100 X 121.5 µm
2
.
DSS 009 WC
Phone:
(408) 988-1845
Internet:
http://www.FiltronicSolidState.com
Fax:
(408) 970-9950
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