PTCTT Series
www.vishay.com
Vishay BCcomponents
TWIN Vertical SMD PTC Thermistors
For Telecom Overload Protection
FEATURES
• Very small footprint, allowing to increase the
number of lines per PCB
• Matched pairs in one component, significantly
reducing the assembly time
• Narrow tracking between the 2 PTC’s over a wide
temperature range (matching at 85 °C:
2 x matching at
25 °C)
• Limited height and weight, used on high speed pick-and-
place circuit assembly
• Flat pick-up ceramic area for easy placement
• Small ceramics for faster response time
• Thermal coupled PTC’s for enhanced protection
• Small and large pitch available
• Compliant with the enhanced level requirements of
ITU - K20-21-45 edition 2003
• Suitable for lead (Pb)-bearing and lead (Pb)-free reflow
soldering
• Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
QUICK REFERENCE DATA
PARAMETER
Resistance value at 25 °C
Switching temperature
Maximum voltage (RMS)
Maximum overload current
Operating temperature range
at V
max.
Maximum trip time at 1 A
Weight
VALUE
10 to 50
UNIT
°C
V
RMS
A
°C
s
g
105 to 130
240
2.5 to 8.0
-40 to 85
1.2 to 4.0
~ 1.3
APPLICATIONS
Over-temperature/over-load protection:
• Telecom
- Telecommunications infrastructure
- PABX
- Set-top Box (S.B.)
DESCRIPTION
The component consists of two high performance PTC
ceramics mounted together on an alumina spacer cover and
with 4 lead (Pb)-free tin plated contacts. The terminations
are joined to the Ag plated ceramics by a high melting
solder.
MOUNTING
A flat pick-up area of 30 mm2 and low weight allows for fast
placement. No excessive solder paste should be used as no
solder or flux can reach the ceramic body during reflow
soldering. Not suitable for bismuth containing solder.
Typical soldering
235 °C, duration: 5 s (Lead (Pb)-bearing)
245 °C, duration: 5 s (Lead (Pb)-free)
Resistance to soldering heat
260 °C, duration: 10 s max.
MARKING
• All TWIN Vertical SMD PTC’s are marked with the last
3-digits of the type number (BCxxx) and a date code
(YYWW)
ELECTRICAL DATA
R
25
± 20 %
()
10
20
25
35
50
I
nt
at
MATCHING
(
0.5
0.5
0.5
1.0
1.0
V
max.
(V
RMS
)
240
240
240
240
240
25 °C
(mA)
140
90
100
100
90
70 °C
(mA)
85
60
60
60
50
85 °C
(mA)
55
40
40
40
35
I
t
(mA)
300
200
200
200
190
MAX.
TRIP-TIME
at 1 A
(s)
4.0
2.0
2.0
1.5
1.2
I
max.
at
V
max.
(A)
4.0
8.0
4.0
4.0
2.5
I
res
(2 PIECES POWERED)
at V
max.
(mA)
12.0
12.0
12.0
12.0
12.0
Note
• All data is measured at 25 °C unless otherwise specified
Revision:03-Mar-14
Document Number: 29088
1
For technical questions, contact:
nlr@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
PTCTT Series
www.vishay.com
Vishay BCcomponents
SAP CODING
SMALL PITCH
LARGE PITCH
ORDERING INFORMATION
R
25
± 20 %
()
10
20
25
35
50
PTCTT95R100GTE
PTCTT95R200GTE
PTCTT95R250GTE
PTCTT95R350GTE
PTCTT95R500GTE
PTCTT95R100GTELAR
PTCTT95R200GTELAR
PTCTT95R250GTELAR
PTCTT95R350GTELAR
PTCTT95R500GTELAR
ELECTRICAL CHARACTERISTICS
3.5
Trip current vs Tamb
Typical
3.0
PTC will trip
(1 PTC powered)
2.5
Current deviation factor
2.0
1.5
I
TRIP
1.0
PTC will not trip
(2 PTC's powered)
0.5
I
HOLD
0
- 40
- 20
0
20
40
Tamb(°C)
60
80
100
PTC OUTLINES
X (4x)
0.3
L
T
DIMENSIONS
in millimeters
L
T
H
b
b
1
S
d
t
P
P
1
P
2
X
K
1
K
2
SMALL PITCH
9.0 ± 0.1
7.2 ± 0.25
6.9 ± 0.25
1.5 ± 0.1
0.9 ± 0.15
1.25 ± 0.15
0.22 ± 0.025
2.3 ± 0.1
6.5 ± 0.5
2.55 ± 0.15
2.2 ± 0.1
0.5 ± 0.2
6.0 ± 0.5
5.0 ± 0.5
LARGE PITCH
9.0 ± 0.1
8.4 ± 0.25
6.9 ± 0.25
1.5 ± 0.1
0.9 ± 0.15
1.25 ± 0.15
0.22 ± 0.025
2.3 ± 0.1
6.5 ± 0.5
2.55 ± 0.15
3.45 ± 0.15
0.5 ± 0.2
7.2 ± 0.5
5.0 ± 0.5
H
S
P
b
d
P
1
P
2
0.1
K
1
b
1
FOOTPRINT
D
E
BCXXX
YYWW
K
2
t
RECOMMENDED FOOTPRINT
in millimeters
A
B
C
D
E
SMALL PITCH
2.0
2.4
3.8
3.8
2.7
LARGE PITCH
2.0
2.4
5.0
4.0
1.4
A
B
C
Revision:03-Mar-14
Document Number: 29088
2
For technical questions, contact:
nlr@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
PTCTT Series
www.vishay.com
PACKAGING
Tape specifications
All tape and reel specifications are in accordance with IEC 60 286-3. Carrier tape material is non-conductive polystyrene or
polycarbonate.
Blister tape
T
P
0
K
0
D
0
P
2
E
Vishay BCcomponents
F
cover
tape
BCXXX
YYWW
W
B
0
T
1
T
2
A
0
P
1
D
1
direction of unreeling
Cumulative pitch error: 0.2 mm over 10 pitches
Cumulative tolerance over 10 holes: ± 0.2 mm
DIMENSIONS OF BLISTER TAPE
in millimeters
SMALL PITCH
A
0
B
0
K
0
W
LARGE PITCH
SMALL PITCH
LARGE PITCH
E
F
D
0
7.2 ± 0.1
9.3 ± 0.1
7.2 ± 0.1
16.0 ± 0.3
1.75 ± 0.1
7.5 ± 0.1
1.5 + 0.1
8.4 ± 0.1
9.3 ± 0.1
7.2 ± 0.1
16.0 ± 0.3
1.75 ± 0.1
7.5 ± 0.1
1.5 + 0.1
D
1
P
0
P
1
P
2
T
T
1
T
2
1.5 + 0.1
4.0 ± 0.1
12.0 ± 0.1
2.0 ± 0.1
0.5 ± 0.05
0.05
7.8 max.
1.5 + 0.1
4.0 ± 0.1
12.0 ± 0.1
2.0 ± 0.1
0.5 ± 0.05
0.05
7.8 max.
REEL SPECIFICATIONS
in millimeters
Reel
W2
20.5
12.75 +0.15 N A
0
W
1
REEL DIMENSIONS
in millimeters
UNITS PER REEL
1 000
TAPE WIDTH
16
A
380
N
64
W
1
16.4
W
2
MAX.
20.4
Note
• Reels are packed in sealed plastic bags for protection against high humidity and corrosive atmospheres
Revision:03-Mar-14
Document Number: 29088
3
For technical questions, contact:
nlr@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
PTCTT Series
www.vishay.com
SOLDERING CONDITIONS
This SMD thermistor is only suitable for reflow soldering, in accordance with JEDEC J-STD-020. Soldering processes which can
be used are reflow (infrared and convection heating) and vapour phase. The maximum temperature of 260 °C during 10 s should
not be exceeded and no liquid flux should be allowed to reach the ceramic body.
Typical examples of soldering processes that will provide reliable joints without damage, are shown below.
Reflow soldering
300
T
(°C)
250
200
150
100
2 K/s
260 °C
≈
245 °C
215 °C
180 °C
10 s
40 s
10 s
Vishay BCcomponents
130 °C
50
0
Typical values (solid line)
Process limits (dotted lines)
0
50
100
150
200
t (s)
250
Vapour phase soldering
300
T
(°C)
250
215 °C
20 to 40 s
200
150
100
50
0
0
180 °C
130 °C
external preheating
100 °C
forced
cooling
internal preheating,
e.g.
by
infrared,
max. 2 K/s
50
100
150
200
t (s)
250
Typical values (solid line)
Process limits (dotted line)
HANDLING PRECAUTIONS
Because of the nature of PTC ceramic material the component should not be touched with bare hands, as the residue of
perspiration can influence component behaviour at high temperatures.
Handling forces applied to the component should be limited to 5 N in any condition.
Revision:03-Mar-14
Document Number: 29088
4
For technical questions, contact:
nlr@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of
typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding
statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a
particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for
such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document
or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 08-Feb-17
1
Document Number: 91000
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