EGP10D
Glass Passivated Junction
Fast Efficient Rectifiers
PRODUCT SUMMARY
Reverse Voltage 50 to 400 Volts
Forward Current 1.0 Ampere
FEATURES
Cavity-free glass-passivated junction
Ultrafast reverse recovery time
Low forward voltage drop
Low leakage current
Low switching losses, high efficiency
High forward surge capability
Solder Dip 260 °C, 40 seconds
MECHANICAL DATA
Case: DO-204AL, molded epoxy over glass body Epoxy meets
UL-94V-0 Flammability rating
Terminals: Matte tin plated leads, solderable per J-STD-002B
and JESD22-B102D
E3 suffix for commercial grade, HE3 suffix for high reliability
grade (AEC Q101 qualified)
Polarity: Color band denotes cathode end
Weight: 0.012 ounce, 0.34 gram
Pb-free; RoHS-compliant
07/11/2007 Rev.1.00
www.SiliconStandard.com
1
EGP10D
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25
o
C ambient temperature unless otherwise specified.
Parameter
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
0.375" (9.5mm) lead length at T
A
=55
o
C
Peak forward surge current 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method)
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current
at rated DC blocking voltage
@T
A
=25
o
C
@T
A
=125
o
C
Symbol
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
I
R
t
rr
C
J
R
θ
JA
T
J
, T
STG
22.0
50.0
-55 to +150
0.95
5.0
100
50
15.0
o
EGP
10A
50
35
50
EGP
10B
100
70
100
EGP
10C
150
105
150
1.0
30.0
EGP
10D
200
140
200
EGP
10F
300
210
300
EGP
10G
400
280
400
Unit
Volts
Volts
Volts
Amp
Amps
1.25
Volts
uA
nS
pF
C/W
o
Maximum reverse recovery time at I
F
= 0.5 A, I
R
= 1.0 A,
I
rr
= 0.25 A
Typical junction capacitance at 4.0 V, 1 MHz
Typical thermal resistance (Note 1)
Operating junction and storage temperature range
Notes:
C
1. Thermal resistance from junction to ambient at 0.375"(9.5mm) lead length
2. Pulse test: 300us pulse width, 1% duty cycle
07/11/2007 Rev.1.00
www.SiliconStandard.com
2
EGP10D
RATINGS AND CHARACTERISTIC CURVES
(T
A
=25 C unless otherwise noted)
o
Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no
guarantee or warranty, expressed or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no
responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its
use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including
without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to
the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of
Silicon Standard Corporation or any third parties.
07/11/2007 Rev.1.00
www.SiliconStandard.com
3
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