32k x 32 synchronous pipelined static ram
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ISSI(芯成半导体) |
| 零件包装代码 | QFP |
| 包装说明 | TQFP-100 |
| 针数 | 100 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.B.2.B |
| 最长访问时间 | 5 ns |
| 其他特性 | INTERNAL SELF-TIMED WRITE |
| 最大时钟频率 (fCLK) | 100 MHz |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PQFP-G100 |
| JESD-609代码 | e0 |
| 长度 | 20 mm |
| 内存密度 | 1048576 bit |
| 内存集成电路类型 | CACHE SRAM |
| 内存宽度 | 32 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 100 |
| 字数 | 32768 words |
| 字数代码 | 32000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 32KX32 |
| 输出特性 | 3-STATE |
| 可输出 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LQFP |
| 封装等效代码 | QFP100,.63X.87 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK, LOW PROFILE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.6 mm |
| 最大待机电流 | 0.01 A |
| 最小待机电流 | 3.14 V |
| 最大压摆率 | 0.17 mA |
| 最大供电电压 (Vsup) | 3.63 V |
| 最小供电电压 (Vsup) | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 14 mm |
| Base Number Matches | 1 |
| IS61C632A-5TQ | IS61C632A-4PQ | IS61C632A-4TQ | IS61C632A-7PQ | IS61C632A-8PQ | IS61C632A-5PQ | IS61C632A-6TQ | IS61C632A-8TQ | IS61C632A-6PQ | IS61C632A | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 32k x 32 synchronous pipelined static ram | 32k x 32 synchronous pipelined static ram | 32k x 32 synchronous pipelined static ram | 32k x 32 synchronous pipelined static ram | 32k x 32 synchronous pipelined static ram | 32k x 32 synchronous pipelined static ram | 32k x 32 synchronous pipelined static ram | 32k x 32 synchronous pipelined static ram | 32k x 32 synchronous pipelined static ram | 32k x 32 synchronous pipelined static ram |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | - |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - |
| 厂商名称 | ISSI(芯成半导体) | ISSI(芯成半导体) | ISSI(芯成半导体) | ISSI(芯成半导体) | ISSI(芯成半导体) | ISSI(芯成半导体) | ISSI(芯成半导体) | ISSI(芯成半导体) | ISSI(芯成半导体) | - |
| 零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP | - |
| 包装说明 | TQFP-100 | PLASTIC, QFP-100 | TQFP-100 | PLASTIC, QFP-100 | PLASTIC, QFP-100 | PLASTIC, QFP-100 | TQFP-100 | TQFP-100 | PLASTIC, QFP-100 | - |
| 针数 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | - |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | - |
| ECCN代码 | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | - |
| 最长访问时间 | 5 ns | 4 ns | 4 ns | 7 ns | 8 ns | 5 ns | 6 ns | 8 ns | 6 ns | - |
| 其他特性 | INTERNAL SELF-TIMED WRITE | INTERNAL SELF-TIMED WRITE | INTERNAL SELF-TIMED WRITE | INTERNAL SELF-TIMED WRITE | INTERNAL SELF-TIMED WRITE | INTERNAL SELF-TIMED WRITE | INTERNAL SELF-TIMED WRITE | INTERNAL SELF-TIMED WRITE | INTERNAL SELF-TIMED WRITE | - |
| 最大时钟频率 (fCLK) | 100 MHz | 125 MHz | 125 MHz | 76 MHz | 66 MHz | 100 MHz | 83 MHz | 66 MHz | 83 MHz | - |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | - |
| JESD-30 代码 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | - |
| 长度 | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | - |
| 内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | - |
| 内存集成电路类型 | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | - |
| 内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 端口数量 | 1 | 1 | 1 | - | - | 1 | 1 | - | 1 | - |
| 端子数量 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | - |
| 字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | - |
| 字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | - |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | - |
| 组织 | 32KX32 | 32KX32 | 32KX32 | 32KX32 | 32KX32 | 32KX32 | 32KX32 | 32KX32 | 32KX32 | - |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| 可输出 | YES | YES | YES | - | - | YES | YES | - | YES | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | LQFP | QFP | LQFP | QFP | QFP | QFP | LQFP | LQFP | QFP | - |
| 封装等效代码 | QFP100,.63X.87 | QFP100,.7X.9 | QFP100,.63X.87 | QFP100,.7X.9 | QFP100,.7X.9 | QFP100,.7X.9 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.7X.9 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | FLATPACK, LOW PROFILE | FLATPACK | FLATPACK, LOW PROFILE | FLATPACK | FLATPACK | FLATPACK | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK | - |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 1.6 mm | 3.22 mm | 1.6 mm | 3.22 mm | 3.22 mm | 3.22 mm | 1.6 mm | 1.6 mm | 3.22 mm | - |
| 最大待机电流 | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | - |
| 最小待机电流 | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | - |
| 最大压摆率 | 0.17 mA | 0.18 mA | 0.18 mA | 0.15 mA | 0.14 mA | 0.17 mA | 0.16 mA | 0.14 mA | 0.16 mA | - |
| 最大供电电压 (Vsup) | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | - |
| 最小供电电压 (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | - |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | - |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
Linux与安卓
聊聊、笑笑、闹闹
测试/测量
电源技术
模拟与混合信号
嵌入式系统
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
