single 16 and 8/ differential 8 channel and 4 channel cmos analog multiplexers
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Harris |
| 包装说明 | QCCJ, LDCC20,.4SQ |
| Reach Compliance Code | unknown |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | S-PQCC-J20 |
| JESD-609代码 | e0 |
| 标称负供电电压 (Vsup) | -15 V |
| 信道数量 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 标称断态隔离度 | 68 dB |
| 通态电阻匹配规范 | 9 Ω |
| 最大通态电阻 (Ron) | 400 Ω |
| 最高工作温度 | 75 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC20,.4SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | +-15 V |
| 认证状态 | Not Qualified |
| 最大信号电流 | 0.02 A |
| 最大供电电流 (Isup) | 2.4 mA |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | YES |
| 最长断开时间 | 1000 ns |
| 最长接通时间 | 1000 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL EXTENDED |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| HI4P0508-5 | HI9P0509-9 | HI4P0509-5 | HI9P0509-5 | |
|---|---|---|---|---|
| 描述 | single 16 and 8/ differential 8 channel and 4 channel cmos analog multiplexers | single 16 and 8/ differential 8 channel and 4 channel cmos analog multiplexers | single 16 and 8/ differential 8 channel and 4 channel cmos analog multiplexers | single 16 and 8/ differential 8 channel and 4 channel cmos analog multiplexers |
| 厂商名称 | Harris | Harris | Harris | Harris |
| 包装说明 | QCCJ, LDCC20,.4SQ | , | QCCJ, LDCC20,.4SQ | SOP, SOP16,.25 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER |
| JESD-30 代码 | S-PQCC-J20 | R-PDSO-G16 | S-PQCC-J20 | R-PDSO-G16 |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V |
| 信道数量 | 8 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 16 | 20 | 16 |
| 最高工作温度 | 75 °C | 85 °C | 75 °C | 75 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | CHIP CARRIER | SMALL OUTLINE | CHIP CARRIER | SMALL OUTLINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL EXTENDED | INDUSTRIAL | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| 端子形式 | J BEND | GULL WING | J BEND | GULL WING |
| 端子位置 | QUAD | DUAL | QUAD | DUAL |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 |
| JESD-609代码 | e0 | - | e0 | e0 |
| 标称断态隔离度 | 68 dB | - | 68 dB | 68 dB |
| 通态电阻匹配规范 | 9 Ω | - | 9 Ω | 9 Ω |
| 最大通态电阻 (Ron) | 400 Ω | - | 400 Ω | 400 Ω |
| 封装代码 | QCCJ | - | QCCJ | SOP |
| 封装等效代码 | LDCC20,.4SQ | - | LDCC20,.4SQ | SOP16,.25 |
| 电源 | +-15 V | - | +-15 V | +-15 V |
| 最大信号电流 | 0.02 A | - | 0.02 A | 0.02 A |
| 最大供电电流 (Isup) | 2.4 mA | - | 2.4 mA | 2.4 mA |
| 最长断开时间 | 1000 ns | - | 1000 ns | 1000 ns |
| 最长接通时间 | 1000 ns | - | 1000 ns | 1000 ns |
| 切换 | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子节距 | 1.27 mm | - | 1.27 mm | 1.27 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved