8-bit mcu
| T81L0003B | T81L0003B-AK | T81L0003B-BD | T81L0003B-BK | T81L0003B-AD | |
|---|---|---|---|---|---|
| 描述 | 8-bit mcu | 8-bit mcu | 8-bit mcu | 8-bit mcu | 8-bit mcu |
| 厂商名称 | - | TM Technology, Inc. | TM Technology, Inc. | TM Technology, Inc. | TM Technology, Inc. |
| 零件包装代码 | - | DIP | SOIC | DIP | SOIC |
| 包装说明 | - | DIP, DIP18,.3 | SOP, SOP18,.4 | DIP, DIP18,.3 | SOP, SOP18,.4 |
| 针数 | - | 18 | 18 | 18 | 18 |
| Reach Compliance Code | - | unknown | unknown | unknown | unknown |
| 位大小 | - | 8 | 8 | 8 | 8 |
| CPU系列 | - | 8051 | 8051 | 8051 | 8051 |
| JESD-30 代码 | - | R-PDIP-T18 | R-PDSO-G18 | R-PDIP-T18 | R-PDSO-G18 |
| 端子数量 | - | 18 | 18 | 18 | 18 |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | DIP | SOP | DIP | SOP |
| 封装等效代码 | - | DIP18,.3 | SOP18,.4 | DIP18,.3 | SOP18,.4 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| 电源 | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | - | 256 | 256 | 256 | 256 |
| ROM（单词） | - | 8192 | 8192 | 8192 | 8192 |
| ROM可编程性 | - | UVPROM | UVPROM | UVPROM | UVPROM |
| 速度 | - | 24 MHz | 24 MHz | 24 MHz | 24 MHz |
| 标称供电电压 | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | - | NO | YES | NO | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | - | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | - | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL |
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