undervoltage sensing circuit
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Microsemi |
| 包装说明 | TO-92, SIP3,.1,50 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | O-PBCY-T3 |
| JESD-609代码 | e3 |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 3 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TO-92 |
| 封装等效代码 | SIP3,.1,50 |
| 封装形状 | ROUND |
| 封装形式 | CYLINDRICAL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 最大供电电流 (Isup) | 0.5 mA |
| 最大供电电压 (Vsup) | 6.5 V |
| 最小供电电压 (Vsup) | 1 V |
| 标称供电电压 (Vsup) | 4 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 1.27 mm |
| 端子位置 | BOTTOM |
| 阈值电压标称 | +4.6V |
| 处于峰值回流温度下的最长时间 | 40 |
| MC33064LP | MC34064 | MC34064LP | MC33064 | MC34064DM | MC33064DM | |
|---|---|---|---|---|---|---|
| 描述 | undervoltage sensing circuit | undervoltage sensing circuit | undervoltage sensing circuit | undervoltage sensing circuit | undervoltage sensing circuit | undervoltage sensing circuit |
| 是否Rohs认证 | 符合 | - | 符合 | - | 符合 | 符合 |
| 厂商名称 | Microsemi | - | Microsemi | - | Microsemi | Microsemi |
| 包装说明 | TO-92, SIP3,.1,50 | - | ROHS COMPLIANT, PLASTIC, TO-92, 3 PIN | - | SOP, SOP8,.25 | ROHS COMPLIANT, PLASTIC, SOIC-8 |
| Reach Compliance Code | unknown | - | unknown | - | compliant | unknown |
| ECCN代码 | EAR99 | - | EAR99 | - | EAR99 | EAR99 |
| 可调阈值 | NO | - | NO | - | NO | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | - | POWER SUPPLY SUPPORT CIRCUIT | - | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | O-PBCY-T3 | - | O-PBCY-T3 | - | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e3 | - | e3 | - | e3 | e3 |
| 湿度敏感等级 | 1 | - | 1 | - | 1 | 1 |
| 信道数量 | 1 | - | 1 | - | 1 | 1 |
| 功能数量 | 1 | - | 1 | - | 1 | 1 |
| 端子数量 | 3 | - | 3 | - | 8 | 8 |
| 最高工作温度 | 85 °C | - | 70 °C | - | 70 °C | 85 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TO-92 | - | TO-92 | - | SOP | SOP |
| 封装等效代码 | SIP3,.1,50 | - | SIP3,.1,50 | - | SOP8,.25 | SOP8,.25 |
| 封装形状 | ROUND | - | ROUND | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | CYLINDRICAL | - | CYLINDRICAL | - | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | - | 260 | - | 260 | 260 |
| 电源 | 5 V | - | 5 V | - | 5 V | 5 V |
| 认证状态 | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified |
| 最大供电电流 (Isup) | 0.5 mA | - | 0.5 mA | - | 0.5 mA | 0.5 mA |
| 最大供电电压 (Vsup) | 6.5 V | - | 6.5 V | - | 6.5 V | 6.5 V |
| 最小供电电压 (Vsup) | 1 V | - | 1 V | - | 1 V | 1 V |
| 标称供电电压 (Vsup) | 4 V | - | 4 V | - | 4 V | 4 V |
| 表面贴装 | NO | - | NO | - | YES | YES |
| 技术 | BIPOLAR | - | BIPOLAR | - | BIPOLAR | BIPOLAR |
| 温度等级 | INDUSTRIAL | - | COMMERCIAL | - | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | - | Matte Tin (Sn) | - | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | - | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | - | 1.27 mm | - | 1.27 mm | 1.27 mm |
| 端子位置 | BOTTOM | - | BOTTOM | - | DUAL | DUAL |
| 阈值电压标称 | +4.6V | - | +4.6V | - | +4.6V | +4.6V |
| 处于峰值回流温度下的最长时间 | 40 | - | 40 | - | 40 | 40 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
