oscillator IC for outputs up to 130MHz. Designed to
fit in a small 2 x 1.3mm DFN or 3 x 3mm SOT23
package, the PL610 offers the best phase noise and
jitter performance and lowest power consumption of
any comparable IC.
In addition, there is a ‘6’ bit optional programmable
Odd/Even divider (default=
٪1),
and ‘3’
programmable output drive strengths (4mA, 8mA
(default), 16mA) to choose from. The full feature set
of the PL610 makes it the most versatile XO for any
application.
PACKAGE PIN CONFIGURATION
OE^, PDB^, CLK1
XIN, FIN
OE^, PDB^, CLK1
GND
1
2
3
6
5
4
CLK0
VDD
XOUT
1
2
3
6
5
4
XOUT
VDD
CLK0
GND
XIN, FIN
DFN-6L
(2.0mmx1.3mmx0.6mm)
SOT23-6L
(3.0mmx3.0mmx1.35mm)
BLOCK DIAGRAM
47745 Fremont Blvd., Fremont, California 94538 Tel (510) 492-0990 Fax (510) 492-0991
www.phaselink.com
Rev 4/2/07 Page 1
(Preliminary)
PL610-01
1.8V to 3.3V, 1MHz to 130MHz XO IC
KEY PROGRAMMING PARAMETERS (Optional)
CLK[0:1]
Output Frequency
F
OUT
= F
REF
/ P*
(*: P is an Odd/Even Divider)
Where P = 6 bit
CLK0 = F
REF
, F
REF
/2 or F
REF
/ P
CLK1 = F
REF
, F
REF
/2 or CLK0
Output Drive Strength
Three optional drive strengths
to choose from:
Low: 4mA
Std: 8mA (default)
High: 16mA
Programmable
Input/Output
One output pin can be configured
as:
OE - input
PDB - input
CLK1 – output
PACKAGE PIN AND DIE PAD ASSIGNMENT
Name
XIN, FIN
Pin Assignment
DFN-6L
1
SOT23-6L
3
Type
I
Description
Crystal or Reference Clock input pin
This programmable I/O pin can be configured as an Output
Enable (OE) input, Power Down input (PDB) input or CLK1
clock output. This pin has an internal 60KΩ
pull up resistor
for OE and 10MΩ
pull
up resistor for PDB.
2
1
I/O
State
0
1 (default)
GND
CLK0
VDD
XOUT
3
4
5
6
2
6
5
4
P
O
P
O
GND connection
Programmable Clock Output
VDD connection
Crystal Output pin
Do Not Connect (DNC ) when FIN is present
OE
Tri-state CLK
Normal mode
PDB
Power Down Mode
Normal mode
OE, PDB,
CLK1
47745 Fremont Blvd., Fremont, California 94538 Tel (510) 492-0990 Fax (510) 492-0991
www.phaselink.com
Rev 4/2/07 Page 2
(Preliminary)
PL610-01
1.8V to 3.3V, 1MHz to 130MHz XO IC
FUNCTIONAL DESCRIPTION
PL610-01 is a highly featured, very flexible, advanced XO design for high performance, low-power, small form-
factor applications. The PL610-01 accepts a fundamental input crystal of 5MHz to 130MHz or a reference clock
input of 1MHz to 130MHz and is capable of producing two outputs up to 130MHz. This flexible design allows the
PL610-01 to deliver any frequency, FREF (Crystal or Ref Clk) frequency, FREF / 2 or FREF / P to CLK0 and/or
CLK1. Some of the design features of the PL610-01 are mentioned below:
Clock Output (CLK0)
CLK0 is the main clock output. The output from CLK0
can be FREF (Crystal or Ref Clk), FREF/2 or FREF/P
output. The output drive level can be programmed to
Low Drive (4mA), Standard Drive (8mA) or High Drive
(16mA).
Programmable I/O (OE/PDB/CLK1)
The PL610-01provides one programmable I/O pin
which can be configured as one of the following
functions:
Output Enable (OE)
The Output Enable feature allows the user to enable
and disable the clock output(s) by toggling the OE
pin. The OE pin incorporates a 60kΩ
pull up
resistor giving a default condition of logic “1”.
Power-Down Control (PDB)
The Power Down (PDB) feature allows the user to
put the PL610-01 into “Sleep Mode”. When
activated (logic ‘0’), PDB ‘Disables the PLL, the
oscillator circuitry, counters, and all other active
circuitry. In Power Down mode the IC consumes
<10µA of power. The PDB pin incorporates a 10MΩ
pull up resistor giving a default condition of logic “1”.
Clock Output (CLK1)
The CLK1 feature allows the PL610-01 to have an
additional clock output programmed to one of the
following:
FREF - Reference (Crystal or Ref Clk)
Frequency
FREF / 2
CLK0
47745 Fremont Blvd., Fremont, California 94538 Tel (510) 492-0990 Fax (510) 492-0991
www.phaselink.com
Rev 4/2/07 Page 3
(Preliminary)
PL610-01
1.8V to 3.3V, 1MHz to 130MHz XO IC
LAYOUT RECOMMENDATIONS
The following guidelines are to assist you with a performance optimized PCB design:
Signal Integrity and Termination
Considerations
- Keep traces short!
- Trace = Inductor. With a capacitive load this equals
ringing!
- Long trace = Transmission Line. Without proper
termination this will cause reflections (looks like
ringing).
- Design long traces as “striplines” or “microstrips” with
defined impedance.
- Match trace at one side to avoid reflections bouncing
back and forth.
Decoupling and Power Supply
Considerations
- Place decoupling capacitors as close as possible to
the VDD pin(s) to limit noise from the power supply
- Multiple VDD pins should be decoupled separately
for best performance.
- Addition of a ferrite bead in series with VDD can
help prevent noise from other board sources
- Value of decoupling capacitor is frequency
dependant. Typical values to use are 0.1F for
designs using crystals < 50MHz and 0.01F for
designs using crystals > 50MHz.
Series and parallel capacitors used to fine tune the crystal load to the circuit load.
Crystal
Cst
XIN
1
Cpt
8
Cpt
XOUT
– Series Capacitor, used to lower circuit load to match crystal load. Raises frequency
offset. This can be eliminated by using a crystal with a Cload of equal or greater value than the
oscillator.
– Parallel Capacitors, Used to raise the circuit load to match the crystal load. Lowers
frequency offset.
47745 Fremont Blvd., Fremont, California 94538 Tel (510) 492-0990 Fax (510) 492-0991
www.phaselink.com
Rev 4/2/07 Page 4
(Preliminary)
PL610-01
1.8V to 3.3V, 1MHz to 130MHz XO IC
ELECTRICAL SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
PARAMETERS
Supply Voltage Range
Input Voltage Range
Output Voltage Range
Storage Temperature
Ambient Operating Temperature*
SYMBOL
V
DD
V
I
V
O
T
S
MIN.
-0.5
-0.5
-0.5
-65
-40
MAX.
4.6
V
DD
+0.5
V
DD
+0.5
150
85
UNITS
V
V
V
C
C
Exposure of the device under conditions beyond the limits specified by Maximum Ratings for extended periods may cause permanent damage to the device
and affect product reliability. These conditions represent a stress rating only, and functional operations of the device at these or any other conditions above
the operational limits noted in this specification is not implied. *Operating temperature is guaranteed by design. Parts are tested to commercial grade only.
AC SPECIFICATIONS
PARAMETERS
Crystal Input Frequency
Input (FIN) Frequency
Input (FIN) Signal Amplitude
Input (FIN) Signal Amplitude
Output Frequency
VDD Sensitivity
Output Rise Time
(See MTC-1)
Output Fall Time
(See MTC-1)
Duty Cycle
(See MTC-1)
CONDITIONS
Fundamental Crystal
@ V
DD
=3.3V
@ V
DD
=2.5V
@ V
DD
=1.8V
Internally AC coupled (High Frequency)
Internally AC coupled (Low Frequency)
3.3V <50MHz, 2.5V <40MHz, 1.8V <15MHz
@ Vdd=1.8V-3.3V
Frequency vs. VDD+/-10%
15pF Load, 10/90%VDD, High Drive, 3.3V
15pF Load, 90/10%VDD, High Drive, 3.3V
45
0.9
0.1
20kHz
-2
1
1
50
V
DD
V
DD
130
2
1.2
1.2
55
Vpp
Vpp
MHz
ppm
ns
ns
%
1
130
MHz
MIN.
5
TYP.
MAX.
130
UNITS
MHz
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