Bus Transceiver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP20, 0.300 INCH, CERDIP-20
| 参数名称 | 属性值 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 其他特性 | WITH DIRECTION CONTROL; IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V |
| 系列 | FCT |
| JESD-30 代码 | R-GDIP-T20 |
| 长度 | 25.3365 mm |
| 逻辑集成电路类型 | BUS TRANSCEIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 传播延迟（tpd） | 4.9 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 5962-8762902RX | 5962-87629022X | 5962-8762902SX | IDT74FCT245SOT/R | |
|---|---|---|---|---|
| 描述 | Bus Transceiver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP20, 0.300 INCH, CERDIP-20 | Bus Transceiver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CQCC20, LCC-20 | Bus Transceiver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDFP20, CERPACK-20 | Bus Transceiver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, PDSO20, SOIC-20 |
| 零件包装代码 | DIP | QLCC | DFP | SOIC |
| 包装说明 | DIP, | QCCN, | DFP, | SOP, SOP20,.4 |
| 针数 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | not_compliant |
| 其他特性 | WITH DIRECTION CONTROL; IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V | WITH DIRECTION CONTROL; IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V | WITH DIRECTION CONTROL; IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V | WITH DIRECTION CONTROL |
| 系列 | FCT | FCT | FCT | FCT |
| JESD-30 代码 | R-GDIP-T20 | S-CQCC-N20 | R-GDFP-F20 | R-PDSO-G20 |
| 逻辑集成电路类型 | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER |
| 位数 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 70 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | - |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | DIP | QCCN | DFP | SOP |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | FLATPACK | SMALL OUTLINE |
| 传播延迟（tpd） | 4.9 ns | 4.9 ns | 4.9 ns | 7 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 2.54 mm | 2.3368 mm | 2.65 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | NO LEAD | FLAT | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL |
| 宽度 | 7.62 mm | 8.89 mm | 6.9215 mm | 7.5 mm |
| 长度 | 25.3365 mm | 8.89 mm | - | 12.8 mm |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | - | 225 |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | 30 |
| Base Number Matches | 1 | 1 | 1 | - |
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