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MT4HTF6464AI-800XX

产品描述DDR DRAM Module, 64MX64, CMOS, HALOGEN FREE, MO-237, DIMM-240
产品类别存储    存储   
文件大小316KB,共10页
制造商Micron Technology
官网地址http://www.mdtic.com.tw/
下载文档 详细参数 选型对比 全文预览

MT4HTF6464AI-800XX概述

DDR DRAM Module, 64MX64, CMOS, HALOGEN FREE, MO-237, DIMM-240

MT4HTF6464AI-800XX规格参数

参数名称属性值
厂商名称Micron Technology
零件包装代码DIMM
包装说明DIMM,
针数240
Reach Compliance Codecompliant
ECCN代码EAR99
访问模式SINGLE BANK PAGE BURST
其他特性AUTO/SELF REFRESH
JESD-30 代码R-XDMA-N240
JESD-609代码e4
内存密度4294967296 bit
内存集成电路类型DDR DRAM MODULE
内存宽度64
功能数量1
端口数量1
端子数量240
字数67108864 words
字数代码64000000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织64MX64
封装主体材料UNSPECIFIED
封装代码DIMM
封装形状RECTANGULAR
封装形式MICROELECTRONIC ASSEMBLY
认证状态Not Qualified
自我刷新YES
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)1.7 V
表面贴装NO
技术CMOS
温度等级INDUSTRIAL
端子面层GOLD
端子形式NO LEAD
端子位置DUAL

文档预览

下载PDF文档
512MB (x64, SR) 240-Pin DDR2 SDRAM UDIMM
Features
DDR2 SDRAM UDIMM
MT4HTF6464AZ – 512MB
For the latest component data sheet, refer to Micron's Web site:
www.micron.com
Features
• 240-pin, unbuffered dual in-line memory module
(UDIMM)
• Fast data transfer rates: PC2-8500, PC2-6400,
PC2-5300, PC2-4200, or PC2-3200
• 512MB (64 Meg x 64)
• V
DD
= V
DDQ
= +1.8V
• V
DDSPD
= +1.7V to +3.6V
• JEDEC-standard 1.8V I/O (SSTL_18-compatible)
• Differential data strobe (DQS, DQS#) option
• 4n-bit prefetch architecture
• Single rank
• Multiple internal device banks for concurrent
operation
• Programmable CAS# latency (CL)
• Posted CAS# additive latency (AL)
• WRITE latency = READ latency - 1
t
CK
• Programmable burst lengths: 4 or 8
• Adjustable data-output drive strength
• 64ms, 8,192-cycle refresh
• On-die termination (ODT)
• Serial presence-detect (SPD) with EEPROM
• Halogen-free
• Gold edge contacts
Figure 1:
240-Pin UDIMM (MO-237 R/C C)
Module height 30.0mm (1.18in)
Options
• Operating temperature
Commercial (0°C
T
C
+85°C)
Industrial (–40°C
T
C
+95°C)
• Package
240-pin DIMM (halogen-free)
• Frequency/CAS latency
1.875ns @ CL = 7 (DDR2-1066)
2.5ns @ CL = 5 (DDR2-800)
2.5ns @ CL = 6 (DDR2-800)
3.0ns @ CL = 5 (DDR2-667)
Marking
None
I
Z
-1GA
-80E
-800
-667
Notes: 1. Contact Micron for industrial temperature
module offerings.
Table 1:
Speed
Grade
-1GA
-80E
-800
-667
-53E
-40E
Key Timing Parameters
Industry
Nomenclature
PC2-8500
PC2-6400
PC2-6400
PC2-5300
PC2-4200
PC2-3200
Data Rate (MT/s)
CL = 7
1066
CL = 6
800
800
CL = 5
667
800
667
667
CL = 4
533
533
533
533
400
CL = 3
400
400
400
t
RCD
t
RP
t
RC
(ns)
13.125
12.5
15
15
15
15
(ns)
13.125
12.5
15
15
15
15
(ns)
58.128
57.5
60
60
60
55
PDF: 09005aef83bfd5e4/Source: 09005aef83bfd5bd
HTF4C64x64AZ.fm - Rev. A 9/09 EN
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2009 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.

MT4HTF6464AI-800XX相似产品对比

MT4HTF6464AI-800XX MT4HTF6464AI-80EH1 MT4HTF6464AI-80EXX MT4HTF6464AI-1GAXX MT4HTF6464AI-667XX MT4HTF6464AI-667H1 MT4HTF6464AI-800H1 MT4HTF6464AI-1GAH1
描述 DDR DRAM Module, 64MX64, CMOS, HALOGEN FREE, MO-237, DIMM-240 64MX64 DDR DRAM MODULE, DMA240, HALOGEN FREE, MO-237, DIMM-240 DDR DRAM Module, 64MX64, CMOS, HALOGEN FREE, MO-237, DIMM-240 DDR DRAM Module, 64MX64, CMOS, HALOGEN FREE, MO-237, DIMM-240 DDR DRAM Module, 64MX64, CMOS, HALOGEN FREE, MO-237, DIMM-240 64MX64 DDR DRAM MODULE, DMA240, HALOGEN FREE, MO-237, DIMM-240 64MX64 DDR DRAM MODULE, DMA240, HALOGEN FREE, MO-237, DIMM-240 64MX64 DDR DRAM MODULE, DMA240, HALOGEN FREE, MO-237, DIMM-240
零件包装代码 DIMM DIMM DIMM DIMM DIMM DIMM DIMM DIMM
包装说明 DIMM, DIMM, DIMM, DIMM, DIMM, DIMM, DIMM, DIMM,
针数 240 240 240 240 240 240 240 240
Reach Compliance Code compliant unknown compliant compliant compliant unknown unknown unknow
访问模式 SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST
其他特性 AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 代码 R-XDMA-N240 R-XDMA-N240 R-XDMA-N240 R-XDMA-N240 R-XDMA-N240 R-XDMA-N240 R-XDMA-N240 R-XDMA-N240
JESD-609代码 e4 e4 e4 e4 e4 e4 e4 e4
内存密度 4294967296 bit 4294967296 bit 4294967296 bit 4294967296 bit 4294967296 bit 4294967296 bit 4294967296 bit 4294967296 bi
内存集成电路类型 DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE
内存宽度 64 64 64 64 64 64 64 64
功能数量 1 1 1 1 1 1 1 1
端口数量 1 1 1 1 1 1 1 1
端子数量 240 240 240 240 240 240 240 240
字数 67108864 words 67108864 words 67108864 words 67108864 words 67108864 words 67108864 words 67108864 words 67108864 words
字数代码 64000000 64000000 64000000 64000000 64000000 64000000 64000000 64000000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
组织 64MX64 64MX64 64MX64 64MX64 64MX64 64MX64 64MX64 64MX64
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装代码 DIMM DIMM DIMM DIMM DIMM DIMM DIMM DIMM
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
表面贴装 NO NO NO NO NO NO NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 GOLD GOLD GOLD GOLD GOLD GOLD GOLD GOLD
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
厂商名称 Micron Technology - - Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology

 
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