battery management dual AC/usb powered 1-cell Li+ charger
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC28,.16SQ,16 |
| 针数 | 28 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 20 weeks |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | S-XQCC-N28 |
| 长度 | 4 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC28,.16SQ,16 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大供电电流 (Isup) | 4 mA |
| 最大供电电压 (Vsup) | 16 V |
| 最小供电电压 (Vsup) | 4.15 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 0.4 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 4 mm |
| MAX8903DETI+T | MAX8903GETI+ | MAX8903FETI+T | MAX8903AETI+T | MAX8903CETI+T | |
|---|---|---|---|---|---|
| 描述 | battery management dual AC/usb powered 1-cell Li+ charger | battery management dual AC/usb powered 1-cell Li+ charger | battery management dual AC/usb powered 1-cell Li+ charger | battery management dual AC/usb powered 1-cell Li+ charger | battery management dual AC/usb powered 1-cell Li+ charger |
| 是否无铅 | 不含铅 | - | - | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | - | 符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | QFN | - | - | QFN | QFN |
| 包装说明 | HVQCCN, LCC28,.16SQ,16 | QCCN, LCC28,.16SQ,16 | - | HVQCCN, LCC28,.16SQ,16 | HVQCCN, LCC28,.16SQ,16 |
| 针数 | 28 | - | - | 28 | 28 |
| Reach Compliance Code | compliant | compli | - | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | - | EAR99 | EAR99 |
| Factory Lead Time | 20 weeks | 6 weeks | - | 20 weeks | 24 weeks |
| 可调阈值 | NO | - | - | NO | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | - | - | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | S-XQCC-N28 | S-PQCC-N28 | - | S-XQCC-N28 | S-XQCC-N28 |
| 长度 | 4 mm | - | - | 4 mm | 4 mm |
| 湿度敏感等级 | 1 | 1 | - | 1 | 1 |
| 信道数量 | 1 | - | - | 1 | 1 |
| 功能数量 | 1 | - | - | 1 | 1 |
| 端子数量 | 28 | 28 | - | 28 | 28 |
| 最高工作温度 | 85 °C | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | - | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | HVQCCN | QCCN | - | HVQCCN | HVQCCN |
| 封装等效代码 | LCC28,.16SQ,16 | LCC28,.16SQ,16 | - | LCC28,.16SQ,16 | LCC28,.16SQ,16 |
| 封装形状 | SQUARE | SQUARE | - | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | - | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | - | - | 0.8 mm | 0.8 mm |
| 最大供电电流 (Isup) | 4 mA | 4 mA | - | 4 mA | 4 mA |
| 最大供电电压 (Vsup) | 16 V | - | - | 16 V | 16 V |
| 最小供电电压 (Vsup) | 4.15 V | - | - | 4.15 V | 4.15 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | 5 V |
| 表面贴装 | YES | YES | - | YES | YES |
| 技术 | BICMOS | BICMOS | - | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | NO LEAD | - | NO LEAD | NO LEAD |
| 端子节距 | 0.4 mm | 0.4 mm | - | 0.4 mm | 0.4 mm |
| 端子位置 | QUAD | QUAD | - | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 4 mm | - | - | 4 mm | 4 mm |
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