digital to analog converters - dac 8-bit 2ch precision dac
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | QFN |
包装说明 | HVQCCN, |
针数 | 12 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
Factory Lead Time | 6 weeks |
转换器类型 | D/A CONVERTER |
输入位码 | BINARY, OFFSET BINARY |
输入格式 | PARALLEL, 8 BITS |
JESD-30 代码 | S-XQCC-N12 |
JESD-609代码 | e3 |
长度 | 4 mm |
最大线性误差 (EL) | 0.3906% |
湿度敏感等级 | 1 |
位数 | 8 |
功能数量 | 2 |
端子数量 | 12 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | UNSPECIFIED |
封装代码 | HVQCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
座面最大高度 | 0.8 mm |
标称安定时间 (tstl) | 660 µs |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | NO LEAD |
端子节距 | 0.8 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 4 mm |
Base Number Matches | 1 |
MAX5515ETC+ | MAX5513EUA+ | MAX5514ETC+ | MAX5515ETC+T | MAX5512EUA+T | |
---|---|---|---|---|---|
描述 | digital to analog converters - dac 8-bit 2ch precision dac | digital to analog converters - dac 8-bit 2ch precision dac | digital to analog converters - dac 8-bit 2ch precision dac | digital to analog converters - dac 8-bit 2ch precision dac | digital to analog converters - dac 8-bit 2ch precision dac |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
零件包装代码 | QFN | TSSOP | QFN | QFN | TSSOP |
包装说明 | HVQCCN, | TSSOP, | HVQCCN, | HVQCCN, | TSSOP, TSSOP8,.19 |
针数 | 12 | 8 | 12 | 12 | 8 |
Reach Compliance Code | compliant | compli | compli | compli | compli |
Factory Lead Time | 6 weeks | 6 weeks | 1 week | 9 weeks | 6 weeks |
转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
输入位码 | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
输入格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
JESD-30 代码 | S-XQCC-N12 | S-PDSO-G8 | S-XQCC-N12 | S-XQCC-N12 | S-PDSO-G8 |
JESD-609代码 | e3 | e4 | e3 | e3 | e4 |
长度 | 4 mm | 3 mm | 4 mm | 4 mm | 3 mm |
最大线性误差 (EL) | 0.3906% | 0.3906% | 0.3906% | 0.3906% | 0.3906% |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
位数 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 12 | 8 | 12 | 12 | 8 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY |
封装代码 | HVQCCN | TSSOP | HVQCCN | HVQCCN | TSSOP |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 0.8 mm | 1.1 mm | 0.8 mm | 0.8 mm | 1.1 mm |
标称安定时间 (tstl) | 660 µs | 660 µs | 660 µs | 660 µs | 660 µs |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) | MATTE TIN | MATTE TIN | NICKEL PALLADIUM GOLD |
端子形式 | NO LEAD | GULL WING | NO LEAD | NO LEAD | GULL WING |
端子节距 | 0.8 mm | 0.65 mm | 0.8 mm | 0.8 mm | 0.65 mm |
端子位置 | QUAD | DUAL | QUAD | QUAD | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 4 mm | 3 mm | 4 mm | 4 mm | 3 mm |
ECCN代码 | EAR99 | EAR99 | EAR99 | - | EAR99 |
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