digital to analog converters - dac 8-bit 4ch precision dac
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | SOIC |
包装说明 | SSOP, SSOP16,.25 |
针数 | 16 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
Factory Lead Time | 6 weeks |
最大模拟输出电压 | 2.5 V |
最小模拟输出电压 | |
转换器类型 | D/A CONVERTER |
输入位码 | BINARY |
输入格式 | SERIAL |
JESD-30 代码 | R-PDSO-G16 |
JESD-609代码 | e3 |
长度 | 4.89 mm |
最大线性误差 (EL) | 0.7812% |
湿度敏感等级 | 1 |
位数 | 8 |
功能数量 | 4 |
端子数量 | 16 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SSOP |
封装等效代码 | SSOP16,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
电源 | 3/3.3 V |
认证状态 | Not Qualified |
座面最大高度 | 1.73 mm |
标称安定时间 (tstl) | 6 µs |
最大压摆率 | 1.3 mA |
标称供电电压 | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | GULL WING |
端子节距 | 0.635 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 3.9 mm |
MAX533BEEE+ | MAX533BCPE+ | MAX533BEPE+ | MAX533ACPE+ | MAX533AEEE+T | MAX533BCEE+ | MAX533AEEE+ | |
---|---|---|---|---|---|---|---|
描述 | digital to analog converters - dac 8-bit 4ch precision dac | digital to analog converters - dac 8-bit 4ch precision dac | digital to analog converters - dac 8-bit 4ch precision dac | digital to analog converters - dac 8-bit 4ch precision dac | digital to analog converters - dac 8-bit 4ch precision dac | digital to analog converters - dac 8-bit 4ch precision dac | digital to analog converters - dac 8-bit 4ch precision dac |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
零件包装代码 | SOIC | DIP | DIP | DIP | SOIC | SOIC | SOIC |
包装说明 | SSOP, SSOP16,.25 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | SSOP, SSOP16,.25 | SSOP, SSOP16,.25 | SSOP, SSOP16,.25 |
针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
Reach Compliance Code | compliant | compli | compli | compli | compliant | compliant | compliant |
最大模拟输出电压 | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
输入位码 | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
输入格式 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
JESD-30 代码 | R-PDSO-G16 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
长度 | 4.89 mm | 19.175 mm | 19.175 mm | 19.175 mm | 4.89 mm | 4.89 mm | 4.89 mm |
最大线性误差 (EL) | 0.7812% | 0.7812% | 0.7812% | 0.3906% | 0.3906% | 0.7812% | 0.3906% |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C |
最低工作温度 | -40 °C | - | -40 °C | - | -40 °C | - | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SSOP | DIP | DIP | DIP | SSOP | SSOP | SSOP |
封装等效代码 | SSOP16,.25 | DIP16,.3 | DIP16,.3 | DIP16,.3 | SSOP16,.25 | SSOP16,.25 | SSOP16,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 | 260 |
电源 | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.73 mm | 4.572 mm | 4.572 mm | 4.572 mm | 1.73 mm | 1.73 mm | 1.73 mm |
标称安定时间 (tstl) | 6 µs | 6 µs | 6 µs | 6 µs | 6 µs | 6 µs | 6 µs |
最大压摆率 | 1.3 mA | 1.3 mA | 1.3 mA | 1.3 mA | 1.3 mA | 1.3 mA | 1.3 mA |
标称供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | NO | NO | NO | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
端子节距 | 0.635 mm | 2.54 mm | 2.54 mm | 2.54 mm | 0.635 mm | 0.635 mm | 0.635 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 3.9 mm | 7.62 mm | 7.62 mm | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm |
ECCN代码 | EAR99 | EAR99 | - | - | EAR99 | EAR99 | EAR99 |
Factory Lead Time | 6 weeks | - | - | - | 9 weeks | 6 weeks | 6 weeks |
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