buffers & line drivers octal buffer 3-state
| 参数名称 | 属性值 |
| Brand Name | NXP Semiconductor |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | SOP |
| 包装说明 | 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20 |
| 针数 | 20 |
| 制造商包装代码 | SOT163-1 |
| Reach Compliance Code | compliant |
| 控制类型 | ENABLE LOW |
| 系列 | AHCT/VHCT/VT |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e4 |
| 长度 | 12.8 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.008 A |
| 湿度敏感等级 | 1 |
| 位数 | 4 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP20,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 包装方法 | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 10.5 ns |
| 传播延迟（tpd） | 10.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 7.5 mm |
| 74AHCT244D,118 | 74AHCT244PW,112 | 74AHC244D,112 | 74AHCT244D,112 | 74AHCT244BQ,115 | 74AHC244D,118 | 74AHC244PW,118 | 74AHC244BQ,115 | 74AHCT244PW,118 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | buffers & line drivers octal buffer 3-state | buffers & line drivers octal buffer 3-state | buffers & line drivers octal buffer 3-state | buffers & line drivers octal buffer 3-state | buffers & line drivers octal buffer 3-state | buffers & line drivers octal buffer 3-state | buffers & line drivers octal buffer 3-state | buffers & line drivers octal buffer 3-state | buffers & line drivers octal buffer 3-state |
| Brand Name | NXP Semiconductor | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | SOP | TSSOP2 | SOP | SOP | QFN | SOP | TSSOP2 | QFN | TSSOP2 |
| 包装说明 | 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20 | 4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20 | SOP, SOP20,.4 | 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20 | 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20 | SOP, SOP20,.4 | TSSOP, TSSOP20,.25 | HVQCCN, LCC20,.1X.18,20 | 4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 制造商包装代码 | SOT163-1 | SOT360-1 | SOT163-1 | SOT163-1 | SOT764-1 | SOT163-1 | SOT360-1 | SOT764-1 | SOT360-1 |
| Reach Compliance Code | compliant | compli | compli | compli | compli | compliant | compliant | compliant | compliant |
| 控制类型 | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| 系列 | AHCT/VHCT/VT | AHCT/VHCT/VT | AHC/VHC/H/U/V | AHCT/VHCT/VT | AHCT/VHCT/VT | AHC/VHC/H/U/V | AHC/VHC/H/U/V | AHC/VHC/H/U/V | AHCT/VHCT/VT |
| JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PQCC-N20 | R-PDSO-G20 | R-PDSO-G20 | R-PQCC-N20 | R-PDSO-G20 |
| 长度 | 12.8 mm | 6.5 mm | 12.8 mm | 12.8 mm | 4.5 mm | 12.8 mm | 6.5 mm | 4.5 mm | 6.5 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | TSSOP | SOP | SOP | HVQCCN | SOP | TSSOP | HVQCCN | TSSOP |
| 封装等效代码 | SOP20,.4 | TSSOP20,.25 | SOP20,.4 | SOP20,.4 | LCC20,.1X.18,20 | SOP20,.4 | TSSOP20,.25 | LCC20,.1X.18,20 | TSSOP20,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | TAPE AND REEL | TUBE | TUBE | TUBE | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TUBE | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 5 V | 5 V | 2/5.5 V | 5 V | 5 V | 2/5.5 V | 2/5.5 V | 2/5.5 V | 5 V |
| 传播延迟（tpd） | 10.5 ns | 10.5 ns | 15 ns | 10.5 ns | 10.5 ns | 15 ns | 15 ns | 15 ns | 10.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.65 mm | 1.1 mm | 2.65 mm | 2.65 mm | 1 mm | 2.65 mm | 1.1 mm | 1 mm | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 2 V | 4.5 V | 4.5 V | 2 V | 2 V | 2 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | NICKEL/PALLADIUM/GOLD (NI/PD/AU) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD | GULL WING | GULL WING | NO LEAD | GULL WING |
| 端子节距 | 1.27 mm | 0.65 mm | 1.27 mm | 1.27 mm | 0.5 mm | 1.27 mm | 0.65 mm | 0.5 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 7.5 mm | 4.4 mm | 7.5 mm | 7.5 mm | 2.5 mm | 7.5 mm | 4.4 mm | 2.5 mm | 4.4 mm |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | - |
| 负载电容（CL） | 50 pF | 50 pF | - | 50 pF | 50 pF | - | - | - | 50 pF |
| Prop。Delay @ Nom-Sup | 10.5 ns | - | - | - | - | 9.5 ns | 9.5 ns | 9.5 ns | 10.5 ns |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
