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74AHC244PW,118: 产品描述buffers & line drivers octal buffer 3-state; 产品类别逻辑逻辑; 文件大小90KB，共17页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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74AHC244PW,118概述

buffers & line drivers octal buffer 3-state

74AHC244PW,118规格参数

参数名称	属性值
Brand Name	NXP Semiconductor
是否Rohs认证	符合
厂商名称	NXP(恩智浦)
零件包装代码	TSSOP2
包装说明	TSSOP, TSSOP20,.25
针数	20
制造商包装代码	SOT360-1
Reach Compliance Code	compliant
控制类型	ENABLE LOW
系列	AHC/VHC/H/U/V
JESD-30 代码	R-PDSO-G20
JESD-609代码	e4
长度	6.5 mm
逻辑集成电路类型	BUS DRIVER
最大I（ol）	0.008 A
湿度敏感等级	1
位数	4
功能数量	2
端口数量	2
端子数量	20
最高工作温度	125 °C
最低工作温度	-40 °C
输出特性	3-STATE
输出极性	TRUE
封装主体材料	PLASTIC/EPOXY
封装代码	TSSOP
封装等效代码	TSSOP20,.25
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法	TAPE AND REEL
峰值回流温度（摄氏度）	260
电源	2/5.5 V
Prop。Delay @ Nom-Sup	9.5 ns
传播延迟（tpd）	15 ns
认证状态	Not Qualified
座面最大高度	1.1 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	2 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	AUTOMOTIVE
端子面层	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式	GULL WING
端子节距	0.65 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	30
宽度	4.4 mm

74AHC244PW,118相似产品对比

	74AHC244PW,118	74AHCT244PW,112	74AHC244D,112	74AHCT244D,112	74AHCT244BQ,115	74AHC244D,118	74AHCT244D,118	74AHC244BQ,115	74AHCT244PW,118
描述	buffers & line drivers octal buffer 3-state	buffers & line drivers octal buffer 3-state	buffers & line drivers octal buffer 3-state	buffers & line drivers octal buffer 3-state	buffers & line drivers octal buffer 3-state	buffers & line drivers octal buffer 3-state	buffers & line drivers octal buffer 3-state	buffers & line drivers octal buffer 3-state	buffers & line drivers octal buffer 3-state
Brand Name	NXP Semiconductor	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合	符合
厂商名称	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)
零件包装代码	TSSOP2	TSSOP2	SOP	SOP	QFN	SOP	SOP	QFN	TSSOP2
包装说明	TSSOP, TSSOP20,.25	4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20	SOP, SOP20,.4	7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20	2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20	SOP, SOP20,.4	7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20	HVQCCN, LCC20,.1X.18,20	4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20
针数	20	20	20	20	20	20	20	20	20
制造商包装代码	SOT360-1	SOT360-1	SOT163-1	SOT163-1	SOT764-1	SOT163-1	SOT163-1	SOT764-1	SOT360-1
Reach Compliance Code	compliant	compli	compli	compli	compli	compliant	compliant	compliant	compliant
控制类型	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW
系列	AHC/VHC/H/U/V	AHCT/VHCT/VT	AHC/VHC/H/U/V	AHCT/VHCT/VT	AHCT/VHCT/VT	AHC/VHC/H/U/V	AHCT/VHCT/VT	AHC/VHC/H/U/V	AHCT/VHCT/VT
JESD-30 代码	R-PDSO-G20	R-PDSO-G20	R-PDSO-G20	R-PDSO-G20	R-PQCC-N20	R-PDSO-G20	R-PDSO-G20	R-PQCC-N20	R-PDSO-G20
长度	6.5 mm	6.5 mm	12.8 mm	12.8 mm	4.5 mm	12.8 mm	12.8 mm	4.5 mm	6.5 mm
逻辑集成电路类型	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
最大I（ol）	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A
湿度敏感等级	1	1	1	1	1	1	1	1	1
位数	4	4	4	4	4	4	4	4	4
功能数量	2	2	2	2	2	2	2	2	2
端口数量	2	2	2	2	2	2	2	2	2
端子数量	20	20	20	20	20	20	20	20	20
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
输出极性	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TSSOP	TSSOP	SOP	SOP	HVQCCN	SOP	SOP	HVQCCN	TSSOP
封装等效代码	TSSOP20,.25	TSSOP20,.25	SOP20,.4	SOP20,.4	LCC20,.1X.18,20	SOP20,.4	SOP20,.4	LCC20,.1X.18,20	TSSOP20,.25
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法	TAPE AND REEL	TUBE	TUBE	TUBE	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	TUBE	TAPE AND REEL
峰值回流温度（摄氏度）	260	260	260	260	260	260	260	260	260
电源	2/5.5 V	5 V	2/5.5 V	5 V	5 V	2/5.5 V	5 V	2/5.5 V	5 V
传播延迟（tpd）	15 ns	10.5 ns	15 ns	10.5 ns	10.5 ns	15 ns	10.5 ns	15 ns	10.5 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.1 mm	1.1 mm	2.65 mm	2.65 mm	1 mm	2.65 mm	2.65 mm	1 mm	1.1 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	2 V	4.5 V	2 V	4.5 V	4.5 V	2 V	4.5 V	2 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
端子面层	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL/PALLADIUM/GOLD (NI/PD/AU)
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	NO LEAD	GULL WING	GULL WING	NO LEAD	GULL WING
端子节距	0.65 mm	0.65 mm	1.27 mm	1.27 mm	0.5 mm	1.27 mm	1.27 mm	0.5 mm	0.65 mm
端子位置	DUAL	DUAL	DUAL	DUAL	QUAD	DUAL	DUAL	QUAD	DUAL
处于峰值回流温度下的最长时间	30	30	30	30	30	30	30	30	30
宽度	4.4 mm	4.4 mm	7.5 mm	7.5 mm	2.5 mm	7.5 mm	7.5 mm	2.5 mm	4.4 mm
JESD-609代码	e4	e4	e4	e4	e4	e4	e4	e4	-
Prop。Delay @ Nom-Sup	9.5 ns	-	-	-	-	9.5 ns	10.5 ns	9.5 ns	10.5 ns
负载电容（CL）	-	50 pF	-	50 pF	50 pF	-	50 pF	-	50 pF

74AHC244PW,118

74AHC244PW,118概述

74AHC244PW,118规格参数

74AHC244PW,118相似产品对比

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