flip flops quad D-type master
| 参数名称 | 属性值 |
| Brand Name | NXP Semiconductor |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | TSSOP |
| 包装说明 | TSSOP, TSSOP16,.25 |
| 针数 | 16 |
| 制造商包装代码 | SOT403-1 |
| Reach Compliance Code | compliant |
| Is Samacsys | N |
| 系列 | HC/UH |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e4 |
| 长度 | 5 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 最大频率@ Nom-Sup | 20000000 Hz |
| 最大I（ol） | 0.004 A |
| 湿度敏感等级 | 1 |
| 位数 | 4 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2/6 V |
| 传播延迟（tpd） | 265 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 4.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 4.4 mm |
| 最小 fmax | 24 MHz |
| Base Number Matches | 1 |
| 74HC175PW,118 | 74HCT175PW,112 | 74HC175DB,118 | 74HCT175PW,118 | 74HC175D,653 | 74HC175DB,112 | 74HCT175D,652 | |
|---|---|---|---|---|---|---|---|
| 描述 | flip flops quad D-type master | flip flops quad D-type master | flip flops quad D-type master | flip flops quad D-type master | flip flops quad D-type master reset | flip flops quad D-type master | flip flops quad D F/F pos-edge |
| Brand Name | NXP Semiconductor | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | TSSOP | TSSOP | SSOP1 | TSSOP | SOP | SSOP1 | SOP |
| 包装说明 | TSSOP, TSSOP16,.25 | TSSOP, TSSOP16,.25 | SSOP, SSOP16,.3 | TSSOP, TSSOP16,.25 | 3.90 MM, PLASTIC, MS-012AC, SOT-109-1, SO-16 | SSOP, SSOP16,.3 | SOP, SOP16,.25 |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 制造商包装代码 | SOT403-1 | SOT403-1 | SOT338-1 | SOT403-1 | SOT109-1 | SOT338-1 | SOT109-1 |
| Reach Compliance Code | compliant | compli | compli | compli | compliant | compliant | compliant |
| Is Samacsys | N | N | N | N | N | N | N |
| 系列 | HC/UH | HCT | HC/UH | HCT | HC/UH | HC/UH | HCT |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| 长度 | 5 mm | 5 mm | 6.2 mm | 5 mm | 9.9 mm | 6.2 mm | 9.9 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 最大I（ol） | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | SSOP | TSSOP | SOP | SSOP | SOP |
| 封装等效代码 | TSSOP16,.25 | TSSOP16,.25 | SSOP16,.3 | TSSOP16,.25 | SOP16,.25 | SSOP16,.3 | SOP16,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE |
| 包装方法 | TAPE AND REEL | BULK PACK | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | BULK PACK | BULK PACK |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 2/6 V | 5 V | 2/6 V | 5 V | 2/6 V | 2/6 V | 5 V |
| 传播延迟（tpd） | 265 ns | 50 ns | 265 ns | 50 ns | 265 ns | 265 ns | 50 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 1.1 mm | 2 mm | 1.1 mm | 1.75 mm | 2 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 6 V | 5.5 V | 6 V | 5.5 V | 6 V | 6 V | 5.5 V |
| 最小供电电压 (Vsup) | 2 V | 4.5 V | 2 V | 4.5 V | 2 V | 2 V | 4.5 V |
| 标称供电电压 (Vsup) | 4.5 V | 5 V | 4.5 V | 5 V | 4.5 V | 4.5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL/PALLADIUM/GOLD (NI/PD/AU) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | 4.4 mm | 4.4 mm | 5.3 mm | 4.4 mm | 3.9 mm | 5.3 mm | 3.9 mm |
| 最小 fmax | 24 MHz | 17 MHz | 24 MHz | 17 MHz | 24 MHz | 24 MHz | 17 MHz |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| JESD-609代码 | e4 | e4 | e4 | e4 | - | e4 | e4 |
| 最大频率@ Nom-Sup | 20000000 Hz | - | - | - | 20000000 Hz | 20000000 Hz | 17000000 Hz |
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