SiM3L1xx
High-Performance, Low-Power, 32-Bit Precision32™
MCU Family with up to 256 kB of Flash
32-bit ARM Cortex-M3 CPU
-
50 MHz maximum frequency
-
Single-cycle multiplication, hardware division support
-
Nested vectored interrupt control (NVIC) with 8 priority levels
Memory
-
32–256 kB flash, in-system programmable
-
8–32 kB SRAM with configurable low power retention
Clock Sources
-
Internal oscillator with PLL: 23–50 MHz
-
Low power internal oscillator: 20 MHz
-
Low frequency internal oscillator (LFO): 16.4 kHz
-
External real-time clock (RTC) crystal oscillator
-
External oscillator: Crystal, RC, C, CMOS clock
Power Management
-
Three adjustable low drop-out (LDO) regulators
-
Power-on reset circuit and brownout detectors
-
DC-DC buck converter allows dynamic voltage scaling for
-
maximum efficiency (250 mW output)
Multiple power modes supported for low power optimization
Analog Peripherals
-
12-Bit Analog-to-Digital Converter: Up to 250 ksps 12-bit mode
-
-
or 1 Msps 10-bit mode
10-Bit Current-mode Digital-to-Analog Converter
2 x Low-current comparators
Digital and Communication Peripherals
-
1 x USART with IrDA and ISO7816 Smartcard support
-
1 x UART that operates in low power mode
-
2 x SPIs, 1 x I2C, 16/32-bit CRC
-
128/192/256-bit Hardware AES Encryption
-
Encoder/Decoder: Manchester and Three-out-of-Six
-
Integrated LCD Controller: up to 160 segments (40x4), auto-
contrast and low power operation
Timers/Counters
-
3 x 32-bit or 6 x 16-bit timers with capture/compare
-
16-bit, 6-channel counter with capture/compare/PWM and
-
-
-
-
dead-time controller with differential outputs
16-bit low power timer/advanced capture counter operational in
the lowest power mode
32-bit real time clock (RTC) with multiple alarms
Watchdog timer
Low power mode advanced capture counter (ACCTR)
Low Power Features
-
75 nA typical current in Power Mode 8
-
Low-current RTC (180 nA from LFO, 300 nA from crystal)
-
4
μs
wakeup, register state retention and no reset required from
-
-
-
-
lowest power mode
175
μA/MHz
at 3.6 V executing from flash
140
μA/MHz
at 3.6 V executing from SRAM
Specialized on-chip charge pump reduces power consumption
Process/Voltage/Temperature (PVT) Monitor
Data Transfer Peripherals
-
10-Channel DMA Controller
-
3 Channel Data Transfer Manager manages complex DMA
transfers without core intervention
On-Chip Debugging
-
Serial wire debug (SWD) with serial wire viewer (SWV) or JTAG
-
(no boundary scan) allow debug and programming
Cortex-M3 embedded trace macrocell (ETM)
5 V Tolerant Flexible I/O
-
Up to 62 contiguous 5 V tolerant GPIO with one priority cross-
bar providing flexibility in pin assignments
Temperature Range: –40 to +85 °C
Supply Voltage: 1.8 to 3.8 V
Package Options
-
QFN options: 40-pin (6 x 6 mm), 64-pin (9 x 9 mm)
-
TQFP options: 64-pin (10 x 10 mm), 80-pin (12 x 12 mm)
-
TFBGA option: 80-ball (5.5 x 5.5 mm)
Rev 1.0 10/13
Copyright © 2013 by Silicon Laboratories
SiM3L1xx
SiM3L1xx
Ta ble of Co nt en t s
1. Related Documents and Conventions ...............................................................................5
1.1. Related Documents........................................................................................................5
1.1.1. SiM3L1xx Reference Manual.................................................................................5
1.1.2. Hardware Access Layer (HAL) API Description ....................................................5
1.1.3. ARM Cortex-M3 Reference Manual.......................................................................5
1.2. Conventions ...................................................................................................................5
2. Typical Connection Diagrams ............................................................................................6
2.1. Power .............................................................................................................................6
3. Electrical Specifications......................................................................................................8
3.1. Electrical Characteristics ................................................................................................8
3.2. Thermal Conditions ......................................................................................................30
3.3. Absolute Maximum Ratings..........................................................................................31
4. Precision32™ SiM3L1xx System Overview.....................................................................32
4.1. Power ...........................................................................................................................34
4.1.1. DC-DC Buck Converter (DCDC0)........................................................................34
4.1.2. Three Low Dropout LDO Regulators (LDO0) ......................................................35
4.1.3. Voltage Supply Monitor (VMON0) .......................................................................35
4.1.4. Power Management Unit (PMU)..........................................................................35
4.1.5. Device Power Modes...........................................................................................35
4.1.6. Process/Voltage/Temperature Monitor (TIMER2 and PVTOSC0).......................38
4.2. I/O.................................................................................................................................39
4.2.1. General Features.................................................................................................39
4.2.2. Crossbar ..............................................................................................................39
4.3. Clocking........................................................................................................................40
4.3.1. PLL (PLL0)...........................................................................................................41
4.3.2. Low Power Oscillator (LPOSC0) .........................................................................41
4.3.3. Low Frequency Oscillator (LFOSC0)...................................................................41
4.3.4. External Oscillators (EXTOSC0)..........................................................................41
4.4. Integrated LCD Controller (LCD0)................................................................................42
4.5. Data Peripherals...........................................................................................................43
4.5.1. 10-Channel DMA Controller.................................................................................43
4.5.2. Data Transfer Managers (DTM0, DTM1, DTM2) .................................................43
4.5.3. 128/192/256-bit Hardware AES Encryption (AES0) ............................................43
4.5.4. 16/32-bit Enhanced CRC (ECRC0) .....................................................................44
4.5.5. Encoder / Decoder (ENCDEC0) ..........................................................................44
4.6. Counters/Timers...........................................................................................................45
4.6.1. 32-bit Timer (TIMER0, TIMER1, TIMER2)...........................................................45
4.6.2. Enhanced Programmable Counter Array (EPCA0) .............................................45
4.6.3. Real-Time Clock (RTC0) .....................................................................................46
4.6.4. Low Power Timer (LPTIMER0)............................................................................46
4.6.5. Watchdog Timer (WDTIMER0)............................................................................46
4.6.6. Low Power Mode Advanced Capture Counter (ACCTR0)...................................47
4.7. Communications Peripherals .......................................................................................48
4.7.1. USART (USART0) ...............................................................................................48
Rev 1.0
3
SiM3L1xx
4.7.2. UART (UART0)....................................................................................................48
4.7.3. SPI (SPI0, SPI1) ..................................................................................................49
4.7.4. I2C (I2C0) ............................................................................................................49
4.8. Analog ..........................................................................................................................50
4.8.1. 12-Bit Analog-to-Digital Converter (SARADC0)...................................................50
4.8.2. 10-Bit Digital-to-Analog Converter (IDAC0) .........................................................50
4.8.3. Low Current Comparators (CMP0, CMP1) ..........................................................50
4.9. Reset Sources..............................................................................................................51
4.10.Security ........................................................................................................................52
4.11.On-Chip Debugging .....................................................................................................52
5. Ordering Information .........................................................................................................53
6. Pin Definitions....................................................................................................................55
6.1. SiM3L1x7 Pin Definitions .............................................................................................55
6.2. SiM3L1x6 Pin Definitions .............................................................................................63
6.3. SiM3L1x4 Pin Definitions .............................................................................................70
6.4. TQFP-80 Package Specifications ................................................................................75
6.4.1. TQFP-80 Solder Mask Design.............................................................................78
6.4.2. TQFP-80 Stencil Design ......................................................................................78
6.4.3. TQFP-80 Card Assembly.....................................................................................78
6.5. TFBGA-80 Package Specifications ..............................................................................79
6.5.1. TFBGA-80 Solder Mask Design ..........................................................................82
6.5.2. TFBGA-80 Stencil Design....................................................................................82
6.5.3. TFBGA-80 Card Assembly ..................................................................................82
6.6. QFN-64 Package Specifications ..................................................................................83
6.6.1. QFN-64 Solder Mask Design...............................................................................85
6.6.2. QFN-64 Stencil Design ........................................................................................85
6.6.3. QFN-64 Card Assembly.......................................................................................85
6.7. TQFP-64 Package Specifications ................................................................................86
6.7.1. TQFP-64 Solder Mask Design.............................................................................89
6.7.2. TQFP-64 Stencil Design ......................................................................................89
6.7.3. TQFP-64 Card Assembly.....................................................................................89
6.8. QFN-40 Package Specifications ..................................................................................90
6.8.1. QFN-40 Solder Mask Design...............................................................................92
6.8.2. QFN-40 Stencil Design ........................................................................................92
6.8.3. QFN-40 Card Assembly.......................................................................................92
7. Revision Specific Behavior...............................................................................................93
7.1. Revision Identification ..................................................................................................93
Document Change List ...........................................................................................................95
Contact Information ................................................................................................................96
4
Rev 1.0
SiM3L1xx
1. Related Documents and Conventions
1.1. Related Documents
This data sheet accompanies several documents to provide the complete description of the SiM3L1xx devices.
1.1.1. SiM3L1xx Reference Manual
The Silicon Laboratories SiM3L1xx Reference Manual provides the detailed description for each peripheral on the
SiM3L1xx devices.
1.1.2. Hardware Access Layer (HAL) API Description
The Silicon Laboratories Hardware Access Layer (HAL) API provides C-language functions to modify and read
each bit in the SiM3L1xx devices. This description can be found in the SiM3xxxx HAL API Reference Manual.
1.1.3. ARM Cortex-M3 Reference Manual
The ARM-specific features like the Nested Vectored Interrupt Controller are described in the ARM Cortex-M3
reference documentation. The online reference manual can be found here:
http://infocenter.arm.com/help/topic/com.arm.doc.subset.cortexm.m3/index.html#cortexm3.
1.2. Conventions
The block diagrams in this document use the following formatting conventions:
Figure 1.1. Block Diagram Conventions
Rev 1.0
5
无线连接
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
