*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R07
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3
I
NTEGRATED
C
IRCUITS
D
IVISION
PERFORMANCE DATA (@ 25ºC Unless Otherwise Noted)*
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=100mA)
Typical Turn-On Time
vs. Temperature
(I
L
=100mA)
I
F
=2mA
PLA192
LED Current to Operate (mA)
0.30
0.28
4500
4000
Turn-On Time ( s)
3500
3000
2500
2000
1500
1000
500
500
Turn-Off Time ( s)
450
400
350
300
250
200
Typical Turn-Off Time
vs. Temperature
(I
L
=100mA)
I
F
=10mA
I
F
=5mA
I
F
=2mA
0.26
0.24
0.22
0.20
0.18
0.16
-40
-20
0
20
40
60
Temperature (ºC)
80
100
I
F
=5mA
I
F
=10mA
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
18
On-Resistance ( )
16
14
12
10
8
-40
Typical AC/DC On-Resistance
vs. Temperature
(I
F
=5mA, I
L
=150mA)
7
6
On-Resistance ( )
5
4
3
2
1
-40
Typical DC-Only On-Resistance
vs. Temperature
(I
F
=5mA, I
L
=220mA)
Load Current (mA)
250
Maximum Load Current
vs. Temperature
(I
F
=5mA)
DC-Only Configuration
200
AC/DC Configuration
150
100
50
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-20
0
20
40
60
Temperature (ºC)
80
100
0.15
0.10
Current (A)
Typical Load Current vs. Load Voltage
AC/DC Configuration
(I
F
=5mA)
0.25
0.20
Current (A)
0.15
0.10
0.05
0.00
Typical Load Current vs. Load Voltage
DC-Only Configuration
(I
F
=5mA)
Blocking Voltage (V
P
)
Typical Blocking Voltage
vs. Temperature
770
760
750
740
730
720
710
700
-40
-20
0
20
40
60
80
100
0.05
0.00
-0.05
-0.10
-0.15
-3
-2
-1
0
1
Voltage (V)
2
3
0.0
0.2
0.4
0.6
0.8
Voltage (V)
1.0
1.2
Temperature (ºC)
0.06
0.05
Leakage ( A)
0.04
0.03
0.02
0.01
0
-40
Typical Leakage vs. Temperature
Measured across Pins 4&6
(V
L
=600V)
180
Output Capacitance (pF)
160
140
120
100
80
60
40
20
0
0.1
Output Capacitance
vs. Load Voltage
(I
F
=0mA, f=1MHz)
1.2
1.0
Load Current (A)
0.8
0.6
0.4
0.2
Energy Rating Curve
(I
F
=5mA)
-20
0
20
40
60
Temperature º(C)
80
100
1
10
100
Load Voltage (V)
1000
0
10 s 100 s 1ms 10ms 100ms
Time
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
4
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R07
I
NTEGRATED
C
IRCUITS
D
IVISION
Manufacturing Information
Moisture Sensitivity
PLA192
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
All Versions
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
All Versions
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. IXYS Integrated Circuits Division employs the use of silicone coating as an optical
waveguide in the standard PLA192 (without the "E" suffix); the use of a short drying bake could be necessary if a
wash is used after solder reflow processes. The E-suffix product, being of double-molded construction, does not have
the same necessity for a drying bake. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning
methods that employ ultrasonic energy should not be used.
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