CPC1130N
I
NTEGRATED
C
IRCUITS
D
IVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Rating
350
120
30
Units
V
P
mA
rms
/ mA
DC
350V Normally-Closed Single-Pole
4-Pin SOP OptoMOS
®
Relay
Description
The CPC1130N is a miniature normally-closed,
single-pole (1-Form-B) solid state relay that uses
optically coupled MOSFET technology to provide
1500V
rms
of input to output isolation. The efficient
MOSFET switches and photovoltaic die use IXYS
Integrated Circuits' patented OptoMOS
®
architecture
while the optically coupled output is controlled by a
highly efficient infrared LED.
The CPC1130N offers board space savings of at
least 20% when compared to competitive 4-pin SOP
solid state relays.
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1172007
•
EN/IEC 60950-1 Certified Component:
Certificate available on our website
Ordering Information
Part #
CPC1130N
CPC1130NTR
Description
4-Pin SOP (100/tube)
4-Pin SOP (2000/reel)
Features
•
1500V
rms
Input/Output Isolation
•
Low Drive Power Requirements
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
No EMI/RFI Generation
•
Small 4-Pin SOP Package
•
Tape & Reel Version Available
•
Flammability Rating UL 94 V-0
Applications
•
Telecommunications
•
Telecom Switching
•
Tip/Ring Circuits
•
Modem Switching (Laptop, Notebook, Pocket
Size)
•
Hook Switch
•
Dial Pulsing
•
Ground Start
•
Ringing Injection
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment-Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
Pin Configuration
+ Control
1
4
Load
– Control
2
3
Load
Switching Characteristics
of Normally-Closed Devices
Form-B
I
F
I
LOAD
10%
t
off
90%
t
on
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NTEGRATED
C
IRCUITS
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IVISION
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
CPC1130N
Ratings
350
5
50
1
150
400
1500
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Typical values are characteristic of the device at +25°C, and
are the result of engineering evaluations. They are provided for
information purposes only, and are not part of the manufacturing
testing requirements.
Derate linearly 1.33 mW / ºC
Derate linearly 3.33 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
Continuous
1
Peak
On-Resistance
2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
3
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
1
2
3
Conditions
Symbol
Min
Typ
Max
Units
-
t =10ms
I
L
=120mA
I
F
=2mA, V
L
=350V
P
I
F
=5mA, V
L
=10V
I
F
=2mA, V
L
=50V, f=1MHz
I
L
=120mA
-
I
F
=5mA
V
R
=5V
V
IO
=0V, f=1MHz
25
o
C
85
o
C.
I
L
I
LPK
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
I
F
V
F
I
R
C
IO
-
-
-
-
-
-
-
-
0.3
0.9
-
-
-
-
25
-
-
-
25
0.6
0.55
1.2
-
1
120
±350
30
5
2
2
-
2
-
1.5
10
-
mA
rms
/ mA
DC
mA
P
µA
ms
pF
mA
mA
V
µA
pF
Load current derates linearly from 120mA @
to 80mA @
Measurement taken within 1 second of on-time.
For applications requiring high temperature operation (greater than 60°C) a minimum LED drive current of 4mA is recomended.
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PERFORMANCE DATA*
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
Typical I
F
for Switch Operation
(N=50, I
L
=120mA)
CPC1130N
35
30
Device Count (N)
25
20
15
10
5
0
25
20
15
10
5
0
Typical I
F
for Switch Dropout
(N=50, I
L
=120mA)
Device Count (N)
25
20
15
10
5
0
1.17
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
0.45
0.50
0.55 0.60 0.65
LED Current (mA)
0.70
0.75
Device Count (N)
0.45
0.50
0.55 0.60 0.65 0.70
LED Current (mA)
0.75
35
30
Device Count (N)
25
20
15
10
5
0
Typical On-Resistance Distribution
(N=50, I
L
=120mA)
25
20
15
10
5
0
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=120mA)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=120mA)
Device Count (N)
Device Count (N)
23.5
24
24.5
25
25.5
On-Resistance ( )
26
26.5
0.21
0.22
0.23 0.24 0.25 0.26
Turn-On Time (ms)
0.27
0.50
0.60
0.70 0.80 0.90 1.00
Turn-Off Time (ms)
1.10
Typical Blocking Voltage Distribution
(N=50)
35
30
Device Count (N)
25
20
15
10
5
0
395
400
405 410 415 420
Blocking Voltage (V
P
)
425
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
LED Current (mA)
1.6
1.4
1.2
1.0
0.8
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=50mA)
Load Current (mA)
-20
0
20
40
60
80
100
150
100
50
0
-50
-100
-150
Typical Load Current vs. Load Voltage
(I
F
=5mA)
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
-6
-4
-2
0
2
4
6
Temperature (ºC)
Load Voltage (V)
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
R08
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I
NTEGRATED
C
IRCUITS
D
IVISION
PERFORMANCE DATA*
Typical Turn-On Time
vs. LED Forward Current
(I
L
=120mA)
Turn-Off Time (ms)
CPC1130N
0.7
0.6
Turn-On Time (ms)
0.5
0.4
0.3
0.2
0.1
0
0
5
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
5
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=120mA)
40
35
On-Resistance ( )
30
25
20
15
10
Typical On-Resistance vs. Temperature
(I
F
=5mA, I
L
=120mA)
10
15
20
25
30
35
40
45
50
10
15
20
25
30
35
40
45
50
-40
-20
0
20
40
60
80
100
LED Forward Current (mA)
LED Forward Current (mA)
Temperature (ºC)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
Typical Turn-On Time vs. Temperature
(I
L
=50mA)
Turn-Off Time (ms)
I
F
=10mA
I
F
=5mA
-40
-20
0
20
40
60
80
100
Temperature (ºC)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
Typical Turn-Off Time vs. Temperature
(I
L
=50mA)
180
160
Load Current (mA)
140
120
100
80
60
40
20
0
Maximum Load Current vs. Temperature
(I
F
=0mA, I
L
=AC Peak)
Turn-On Time (ms)
I
F
=5mA
I
F
=10mA
-40
-20
0
20
40
60
80
100
Temperature (ºC)
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
Typical Blocking Voltage
vs. Temperature
425
Blocking Voltage (V
P
)
420
Leakage ( A)
415
410
405
400
395
390
-40
-20
0
20
40
60
80
100
Temperature (ºC)
0.016
0.014
Typical Leakage vs. Temperature
Measured Across Pins 3&4
(I
F
=5mA, V
L
=350V)
Energy Rating Curve
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10μs 100μs 1ms 10ms 100ms
Time
0.010
0.008
0.006
0.004
0.002
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Load Current (A)
0.012
1s
10s 100s
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
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IRCUITS
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IVISION
Manufacturing Information
Moisture Sensitivity
CPC1130N
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in
the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
CPC1130N
Moisture Sensitivity Level (MSL) Classification
MSL 3
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (T
C
) of this product and the maximum dwell time the
body temperature of this device may be (T
C
- 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of
J-STD-020
must be observed.
Device
CPC1130N
Classification Temperature (T
c
)
260ºC
Dwell Time (t
p
)
30 seconds
Max Reflow Cycles
3
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage
to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow
up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the
variability of the wash parameters used to clean the board, determination of the bake temperature and duration
necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning
or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the
device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
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