Power Supply Management Circuit, Fixed, 1 Channel, CMOS, PDSO5, LEAD FREE, SOT-23, 5 PIN
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | SOT-23 |
| 包装说明 | LSSOP, TSOP5/6,.11,37 |
| 针数 | 5 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | R-PDSO-G5 |
| JESD-609代码 | e3 |
| 长度 | 2.9 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 5 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LSSOP |
| 封装等效代码 | TSOP5/6,.11,37 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.2/5.5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.45 mm |
| 最大供电电流 (Isup) | 0.012 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.2 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | GULL WING |
| 端子节距 | 0.95 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 1.625 mm |
| Base Number Matches | 1 |
| DS1819BR-20-U+ | DS1819AR-10-U+ | DS1819CR-10-U+ | DS1819BR-10-U+ | DS1814CR-10-U+ | DS1814AR-5-U+ | DS1814AR-10-U+ | DS1814CR-5-U+ | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Power Supply Management Circuit, Fixed, 1 Channel, CMOS, PDSO5, LEAD FREE, SOT-23, 5 PIN | Power Supply Management Circuit, Fixed, 1 Channel, CMOS, PDSO5, 0.650 INCH, LEAD FREE, SOT-23, 5 PIN | Power Supply Support Circuit, Fixed, 1 Channel, CMOS, PDSO5, LEAD FREE, SOT-23, 5 PIN | Power Supply Management Circuit, Fixed, 1 Channel, CMOS, PDSO5, LEAD FREE, SOT-23, 5 PIN | Power Supply Support Circuit, Fixed, 1 Channel, CMOS, PDSO5, LEAD FREE, SOT-23, 5 PIN | Power Supply Management Circuit, Fixed, 1 Channel, CMOS, PDSO5, LEAD FREE, SOT-23, 5 PIN | Power Supply Management Circuit, Fixed, 1 Channel, CMOS, PDSO5, LEAD FREE, SOT-23, 5 PIN | Power Supply Support Circuit, Fixed, 1 Channel, CMOS, PDSO5, LEAD FREE, SOT-23, 5 PIN |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOT-23 | SOT-23 | SOT-23 | SOT-23 | SOT-23 | SOT-23 | SOT-23 | SOT-23 |
| 包装说明 | LSSOP, TSOP5/6,.11,37 | LSSOP, TSOP5/6,.11,37 | LSSOP, TSOP5/6,.11,37 | LSSOP, TSOP5/6,.11,37 | LSSOP, TSOP5/6,.11,37 | LSSOP, TSOP5/6,.11,37 | LSSOP, TSOP5/6,.11,37 | LEAD FREE, SOT-23, 5 PIN |
| 针数 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | NO | NO | NO | NO | NO | NO | NO | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 |
| 长度 | 2.9 mm | 2.9 mm | 2.9 mm | 2.9 mm | 2.9 mm | 2.9 mm | 2.9 mm | 2.9 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LSSOP | LSSOP | LSSOP | LSSOP | LSSOP | LSSOP | LSSOP | LSSOP |
| 封装等效代码 | TSOP5/6,.11,37 | TSOP5/6,.11,37 | TSOP5/6,.11,37 | TSOP5/6,.11,37 | TSOP5/6,.11,37 | TSOP5/6,.11,37 | TSOP5/6,.11,37 | TSOP5/6,.11,37 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | NOT SPECIFIED | 260 | 260 |
| 电源 | 1.2/5.5 V | 1.2/5.5 V | 1.2/5.5 V | 1.2/5.5 V | 1.2/5.5 V | 1.2/5.5 V | 1.2/5.5 V | 1.2/5.5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.45 mm | 1.45 mm | 1.45 mm | 1.45 mm | 1.45 mm | 1.45 mm | 1.45 mm | 1.45 mm |
| 最大供电电流 (Isup) | 0.012 mA | 0.012 mA | 0.012 mA | 0.012 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1 V | 1 V | 1 V | 1 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.95 mm | 0.95 mm | 0.95 mm | 0.95 mm | 0.95 mm | 0.95 mm | 0.95 mm | 0.95 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 1.625 mm | 1.625 mm | 1.625 mm | 1.625 mm | 1.625 mm | 1.625 mm | 1.625 mm | 1.625 mm |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | - | e3 | e3 |
| 端子面层 | MATTE TIN | Tin (Sn) | Matte Tin (Sn) | MATTE TIN | Matte Tin (Sn) | - | Matte Tin (Sn) | MATTE TIN |
| Factory Lead Time | - | 6 weeks | 6 weeks | 1 week | 6 weeks | - | 6 weeks | - |
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