PRELIMINARY
CM1450
LCD & Camera EMI Filter Array with ESD Protection
Features
•
•
•
•
•
•
•
•
•
•
Six and eight channels of EMI filtering
Utilizes
Praetorian™
inductor-based design tech-
nology for true L-C filter implementation
OptiGuard™
coating for improved reliability
±15kV
ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
±30kV
ESD protection on each channel (HBM)
Better than 40dB of attenuation at 1GHz
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
15-bump, 2.960mm x 1.330mm footprint
Chip Scale Package (CM1450-06CS/CP)
20-bump, 4.000mm x 1.458mm footprint
Chip Scale Package (CM1450-08CS/CP)
Lead-free version available
Product Description
The CM1450 comprises a family of inductor-capacitor
(L-C) based EMI filter arrays with integrated ESD pro-
tection in CSP form factor. The CM1450-06 and
CM1450-08 are configured in 6 and 8 channel formats
respectively. Each EMI filter channel of the CM1450 is
implemented as a 5-pole L-C filter where the compo-
nent values are 15pF-17nH-15pF-17nF-15pF. The
CM1450's roll-off frequency at -10dB attenuation is
300MHz and can be used in applications where the
data rates are as high as 120Mbps while providing
greater than 35dB over the 800MHz to 2.7GHz fre-
quency range. The parts integrate ESD protection
diodes on every pin, which provide a very high level of
protection for sensitive electronic components that may
be subjected to electrostatic discharge (ESD). The
ESD protection diodes connected to the filter ports are
designed and characterized to safely dissipate ESD
strikes of
±15kV,
beyond the Level 4 requirement of
the IEC61000-4-2 international standard. Using the
MIL-STD-883 (Method 3015) specification for Human
Body Model (HBM) ESD, the pins are protected for
contact discharges at greater than
±30kV.
This device is particularly well suited for portable elec-
tronics (e.g. wireless handsets, PDAs) because of its
small package format and easy-to-use pin assign-
ments. In particular, the CM1450 is ideal for EMI filter-
ing and protecting data and control lines for the LCD
display and camera interface in wireless handsets.
The CM1450 incorporates
OptiGuard™
which results in
improved reliability at assembly. The CM1450 is avail-
able in a space saving, low profile Chip Scale Package
with optional lead-free finishing.
.
Applications
•
•
•
•
•
•
LCD and Camera data lines in mobile handsets
I/O port protection for mobile handsets, notebook
computers, PDAs, etc.
EMI filtering for data phones in cell phones, PDAs
or notebook computersWireless handsets / cell
phones
Wireless Handsets
Handheld PCs/PDAs
LCD and camera modules
Electrical Schematic
L1
L2
FILTERn*
C
C
C
FILTERn*
GND
(Pins B1-Bn)
1 of n EMI Filtering + ESD Channels
(n = 6 for CM1450-06, 8 for CM1450-08)
©
2005 California Micro Devices Corp. All rights reserved.
01/27/05
* See Package/Pinout Diagram
for expanded pin information.
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
1
PRELIMINARY
CM1450
PACKAGE / PINOUT DIAGRAMS
(Bumps Down View)
Orientation
Marking
(see note 2)
TOP VIEW
3
4
5
BOTTOM VIEW
(Bumps Up View)
FILTER3
FILTER4
FILTER5
FILTER1
FILTER2
FILTER6
1
A
B
C
2
6
C1
GND
C2
B1
C3
GND
C4
B2
C5
GND
C6
B3
N506
2
3
4
5
6
7
8
Orientation
Marking
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
A1
A1
A2
A3
A4
A5
A6
CM1450-06CS/CP 15-Bump CSP Package
Orientation
Marking
(see note 2)
1
A
B
C
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
C1
C2
GND
C3
GND
C4
B2
C5
GND
C6
B3
C7
GND
C8
B4
N508
Orientation
Marking
B1
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
A1
A1
A2
A3
A4
A5
A6
A7
A8
Notes:
CM1450 -08CS/CP 20-Bump CSP Package
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
CM1450
PIN(s)
A1
A2
A3
A4
A5
A6
-
-
B1-B3
CM1450
PIN(s)
A1
A2
A3
A4
A5
A6
A7
A8
B1-B4
NAME
NAME
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
GND
DESCRIPTION
DESCRIPTION
Filter Channel 1
Filter Channel 2
Filter Channel 3
Filter Channel 4
Filter Channel 5
Filter Channel 6
Filter Channel 7
Filter Channel 8
Device Ground
CM1450
PIN(s)
C1
C2
C3
C4
C5
C6
-
-
CM1450
PIN(s)
C1
C2
C3
C4
C5
C6
C7
C8
NAME
NAME
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
DESCRIPTION
DESCRIPTION
Filter Channel 1
Filter Channel 2
Filter Channel 3
Filter Channel 4
Filter Channel 5
Filter Channel 6
Filter Channel 7
Filter Channel 8
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
Bumps
15
20
Package
CSP
CSP
Ordering Part
Number
1
CM1450-06CS
CM1450-08CS
Part Marking
N506
N508
Lead-free Finish
2
Ordering Part
Number
1
CM1450-06CP
CM1450-08CP
Part Marking
N506
N508
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "
+
" character for the top side orientation mark.
©
2005 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
01/27/05
PRELIMINARY
CM1450
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Storage Temperature Range
DC Power per Resistor
DC Package Power Rating
RATING
-65 to +150
100
500
UNITS
°C
mW
mW
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
RATING
-40 to +85
UNITS
°C
ELECTRICAL OPERATING CHARACTERISTICS
(NOTE 1)
SYMBOL
L
TOT
L
1
, L
2
C
TOT
PARAMETER
Total Channel Inductance (L
1
+ L
2
)
Inductance
Total Channel Capcitance (C
1
⏐⏐
C
2
⏐⏐
C
3
)
At 2.5V DC, 1MHz,
30mV AC
At 2.5V DC, 1MHz,
30mV AC
36
12
CONDITIONS
MIN
TYP
34
17
45
15
54
18
MAX
UNITS
nH
nH
pF
pF
C
1
, C
2
, C
3
Capacitance
f
C
f
C
V
DIODE
I
LEAK
V
SIG
Cut-off Frequency
Z
SOURCE
=50Ω, Z
LOAD
=50Ω
Roll-off Frequency at -10dB Attenuation
Z
SOURCE
=50Ω, Z
LOAD
=50Ω
Diode Standoff Voltage
Diode Leakage Current (reverse bias)
Signal Voltage
Positive Clamp
Negative Clamp
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
I
DIODE
=10µA
V
DIODE
=+3.3V
I
LOAD
= 10mA
5.6
-1.5
±30
±15
Notes 2,3,4 and 5
5.5
137
300
100
6.8
-0.8
9.0
-0.4
MHz
MHz
V
nA
V
V
kV
kV
V
ESD
Notes 2,4 and 5
V
CL
+12
-7
V
V
Note 1: T
A
=25
°
C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: These parameters are guaranteed by design and characterization.
©
2005 California Micro Devices Corp. All rights reserved.
01/27/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
3
PRELIMINARY
CM1450
Performance Information
Typical Filter Performance (T
A
=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B1)
Figure 2. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5VDC and 25°C)
©
2005 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
01/27/05
PRELIMINARY
CM1450
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
(183°C)
Soldering Maximum Temperature
VALUE
0.275mm
Round
Non-Solder Mask defined pads
0.325mm Round
0.125mm - 0.150mm
0.330mm Round
50/50 by volume
No Clean
OSP (Entek Cu Plus 106A)
+50µm
+20µm
60 seconds
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
250
Temperature (°C)
200
150
100
50
0
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 4. Eutectic (SnPb) Solder
Ball Reflow Profile
©
2005 California Micro Devices Corp. All rights reserved.
01/27/05
Figure 5. Lead-free (SnAgCu) Solder
Ball Reflow Profile
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
5
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