Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTS6480SF
MA001376890
PG-DSO-36-43
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
phosphorus
zinc
iron
copper
gold
aluminium
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
13.104
0.061
0.244
4.881
198.190
0.940
2.702
0.807
57.669
344.803
5.069
3.335
0.542
2.555
Average
Mass
[%]
2.06
0.01
0.04
0.77
31.22
0.15
0.43
0.13
9.08
54.29
0.80
0.53
0.09
0.40
29. June 2015
634.90 mg
Sum
[%]
2.06
Average
Mass
[ppm]
20640
96
384
7688
32.04
312158
1480
0.58
4256
1270
90831
63.50
0.80
0.53
543081
7984
5253
854
0.49
4025
4879
1000000
635182
7984
5253
5736
320326
Sum
[ppm]
20640
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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