Speech Synthesizer With RCDG, 20s, CMOS, PDIP28
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Nuvoton(新唐科技) |
包装说明 | DIP, DIP28,.6 |
Reach Compliance Code | unknown |
商用集成电路类型 | SPEECH SYNTHESIZER WITH RCDG |
JESD-30 代码 | R-PDIP-T28 |
JESD-609代码 | e0 |
端子数量 | 28 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP28,.6 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
认证状态 | Not Qualified |
最长读取时间 | 20 s |
表面贴装 | NO |
技术 | CMOS |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
Base Number Matches | 1 |
ISD1020API | ISD1020AGI | ISD1016AG | ISD1016AGI | ISD1016API | ISD1016AX | |
---|---|---|---|---|---|---|
描述 | Speech Synthesizer With RCDG, 20s, CMOS, PDIP28 | Speech Synthesizer With RCDG, 20s, CMOS, PDSO28 | Speech Synthesizer With RCDG, 16s, CMOS, PDSO28 | Speech Synthesizer With RCDG, 16s, CMOS, PDSO28 | Speech Synthesizer With RCDG, 16s, CMOS, PDIP28 | Speech Synthesizer With RCDG, 16s, CMOS |
厂商名称 | Nuvoton(新唐科技) | Nuvoton(新唐科技) | Nuvoton(新唐科技) | Nuvoton(新唐科技) | Nuvoton(新唐科技) | Nuvoton(新唐科技) |
包装说明 | DIP, DIP28,.6 | SOP, SOP28,.5 | SOP, SOP28,.5 | SOP, SOP28,.5 | DIP, DIP28,.6 | , DIE OR CHIP |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
商用集成电路类型 | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG |
JESD-30 代码 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 | X-XUUC-N25 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 25 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
封装等效代码 | DIP28,.6 | SOP28,.5 | SOP28,.5 | SOP28,.5 | DIP28,.6 | DIE OR CHIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED |
封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | UNCASED CHIP |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最长读取时间 | 20 s | 20 s | 16 s | 16 s | 16 s | 16 s |
表面贴装 | NO | YES | YES | YES | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | NO LEAD |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | UPPER |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | - |
封装代码 | DIP | SOP | SOP | SOP | DIP | - |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | - |
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