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HCGD16585EB

产品描述Mux/Demux, 1-Func, Bipolar, CBGA132, 13 X 13 MM, CERAMIC, BGA-132
产品类别无线/射频/通信    电信电路   
文件大小183KB,共17页
制造商Intel(英特尔)
官网地址http://www.intel.com/
下载文档 详细参数 选型对比 全文预览

HCGD16585EB概述

Mux/Demux, 1-Func, Bipolar, CBGA132, 13 X 13 MM, CERAMIC, BGA-132

HCGD16585EB规格参数

参数名称属性值
厂商名称Intel(英特尔)
零件包装代码BGA
包装说明BGA,
针数132
Reach Compliance Codeunknown
JESD-30 代码S-CBGA-B132
长度13 mm
负电源额定电压-5.2 V
功能数量1
端子数量132
最高工作温度70 °C
最低工作温度
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码BGA
封装形状SQUARE
封装形式GRID ARRAY
认证状态Not Qualified
座面最大高度2.1 mm
表面贴装YES
技术BIPOLAR
电信集成电路类型ATM/SONET/SDH MUX/DEMUX
温度等级COMMERCIAL
端子形式BALL
端子节距1 mm
端子位置BOTTOM
宽度13 mm
Base Number Matches1

文档预览

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an Intel company
10 Gbit/s
Transmitter MUX
with Re-timing
GD16585/GD16589
(FEC)
Preliminary
General Description
GD16585 and GD16589 are transmitter
chips used in SDH STM-64 and SONET
OC-192 optical communication systems.
The device is available in two versions:
u
GD16585 for 9.5328 Gbit/s.
u
GD16589 for 10.66 Gbit/s with
Forward Error Correction (FEC).
Except the different operating bit rate the
two versions are functional identical.
The transmitter integrates the main func-
tions of the serializer which are:
u
Clock Multiply Unit (CMU)
u
16:1 Multiplexer in a single monolithic
IC.
The CMU consists of Phase Locked
Loop (PLL) controlled from an external
reference clock. The PLL characteristics
are controlled by an external loop filter al-
lowing the user to optimize the jitter
perfomance of the device.
The 16:1 Multiplexer accepts 16 parallel
input bits at 622.88 Mbit/s (or 666 Mbit/s)
that are serialized into a 9.9538 Gbit/s (or
10.66 Gbit/s) data stream. The serialized
data stream is re-timed by the high-
speed clock from the VCO.
The parallel input interface features
GIGA’s unique self-synchronizing dy-
namic phase alignment scheme that al-
lows both:
u
Source synchronous counter clocking
for OIF99.102.5 interfaces.
u
Forward clocking with phase nulling
and jitter clean-up of the clock.
These schemes enable the serializer to
absorb output delay variations from the
upstream System ASIC without use of
initialization or reset.
The data and clock inputs to the MUX
are LVDS and the output data is CML
compatible.
The device operates from a dual -5.2 V
and +3.3 V power supply. The power dis-
sipation is 2.2 W, typical.
The device is manufactured in a Silicon
Bipolar process and packaged in an 132
balls 13 × 13 mm Ceramic/Plastic Ball
Grid Array (CBGA).
Features
l
PLL based CMU with on-chip 10 GHz
or 10.66 GHz VCO.
16:1 Multiplexer with a last stage
re-timing.
OIF99.102.5 compliant timing .
LVDS compatible parallel data and
clock inputs
CML compatible serial data output.
155 MHz or 622 MHz reference clock
input (selectable).
Divide by 16 clock output.
PLL out of lock detector.
Dual supply operation: -5.2 V and
+3.3 V
Low power dissipation: 2.2 W (typ.).
Available in three package versions:
– EB: 132 ball (16 mill) Ceramic
BGA 13 × 13 mm
– EF: 132 ball (20 mill) Ceramic
BGA 13 × 13 mm
– FB: 132 ball (20 mill) Plastic
BGA 13 × 13 mm
l
l
l
l
l
l
l
l
l
l
DI0
DIN0
Parallel
Input Data
DI15
DIN15
FF
VCUR
OUT
OUTN
l
16:1
Multiplexer
VCO
l
Available in two versions:
– GD16585 for 10 Gbit/s
– GD16589 for 10.66 Gbit/s
VCTL
SEL1
SEL2
CKOUT
CKOUTN
CKI
CKIN
Phase
Selector
Timing
Control
Phase
Frequency
Detector
Applications
PCTL
(PHIGH)
(PLOW)
NLDET
l
PFCX
TCK
l
Telecommunication systems:
– SDH STM-64
– SONET OC-192
– Optical Transport Networking
(OTN)
– FEC applications
Fibre optic test equipment.
PCTLX
SGNX
SEL3
REFCK/N VCC VDD VDDO VDDA VEE
Data Sheet Rev.: 13

HCGD16585EB相似产品对比

HCGD16585EB HCGD16585EF GD16585-FB GD16585-EB GD16585-EF HCGD16589EB GD16589-EF GD16589-FB
描述 Mux/Demux, 1-Func, Bipolar, CBGA132, 13 X 13 MM, CERAMIC, BGA-132 Mux/Demux, 1-Func, Bipolar, CBGA132, 13 X 13 MM, CERAMIC, BGA-132 Mux/Demux, 1-Func, Bipolar, PBGA132, 13 X 13 MM, PLASTIC, BGA-132 Mux/Demux, 1-Func, Bipolar, CBGA132, 13 X 13 MM, CERAMIC, BGA-132 Mux/Demux, 1-Func, Bipolar, CBGA132, 13 X 13 MM, CERAMIC, BGA-132 Mux/Demux, 1-Func, Bipolar, CBGA132, 13 X 13 MM, CERAMIC, BGA-132 Mux/Demux, 1-Func, Bipolar, CBGA132, 13 X 13 MM, CERAMIC, BGA-132 Mux/Demux, 1-Func, Bipolar, PBGA132, 13 X 13 MM, PLASTIC, BGA-132
厂商名称 Intel(英特尔) Intel(英特尔) Intel(英特尔) Intel(英特尔) Intel(英特尔) Intel(英特尔) Intel(英特尔) Intel(英特尔)
零件包装代码 BGA BGA BGA BGA BGA BGA BGA BGA
包装说明 BGA, BGA, BGA, BGA, BGA, BGA, BGA, BGA,
针数 132 132 132 132 132 132 132 132
Reach Compliance Code unknown unknown compliant unknown compliant unknown compliant compliant
JESD-30 代码 S-CBGA-B132 S-CBGA-B132 S-PBGA-B132 S-CBGA-B132 S-CBGA-B132 S-CBGA-B132 S-CBGA-B132 S-PBGA-B132
长度 13 mm 13 mm 13 mm 13 mm 13 mm 13 mm 13 mm 13 mm
负电源额定电压 -5.2 V -5.2 V -5.2 V -5.2 V -5.2 V -5.2 V -5.2 V -5.2 V
功能数量 1 1 1 1 1 1 1 1
端子数量 132 132 132 132 132 132 132 132
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA BGA BGA BGA BGA
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.1 mm 2.1 mm 1.83 mm 2.1 mm 2.1 mm 2.1 mm 2.1 mm 1.83 mm
表面贴装 YES YES YES YES YES YES YES YES
技术 BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR
电信集成电路类型 ATM/SONET/SDH MUX/DEMUX ATM/SONET/SDH MUX/DEMUX ATM/SONET/SDH MUX/DEMUX ATM/SONET/SDH MUX/DEMUX ATM/SONET/SDH MUX/DEMUX ATM/SONET/SDH MUX/DEMUX ATM/SONET/SDH MUX/DEMUX ATM/SONET/SDH MUX/DEMUX
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 BALL BALL BALL BALL BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
宽度 13 mm 13 mm 13 mm 13 mm 13 mm 13 mm 13 mm 13 mm
Base Number Matches 1 1 1 1 1 1 1 1
应用程序 - - SONET;SDH SONET;SDH SONET;SDH - SONET;SDH SONET;SDH

 
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